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Technical content

  1. Features 2. Applications 3. Dimensions A B C E D 4R7 1546 4. Part Numbering TMHC0503S-Series(N)-D 1. Shielded construction. 2. Capable of corresponding high frequency. 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. TMHC 0503 S - 2R2 MN - D A B C D E F A: Series B: Dimension BxC C: Type Standard. D: Inductance R10=0.1uh，4R7=4.7uh，100=10uh，101=100uh，102=1000uh. E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% F: Code Marking: Black.2R2 and 916H (9:YY,16:WW, follow production date, H:P/N). SMD Power Inductor Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 6.0 2.8 2.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. Series A A\` B C D E Unit:mm Halogen-free Halogen 2R2 916H
  1. Specification Part Number Inductance L0 A(uH) ±20% Heat Rating Current DC (A)I rms. Saturation Current DC (A)I sat. DCR (mΩ)Typ. DCR (mΩ)Max. Typ Max Typ Max TMHC0503S-R68MN-D 0.68 12.0 10.0 15 14 8.7 10 TMHC0503S-1R0MN-D 1.00 10.0 9.0 12 11 12 14 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement.
  1. Typical Performance Curves