TMF8701 AMSCO | Alldatasheet
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Technical content
Datasheet, Public Page 1 [v2-00] 2023-Feb-21 Document Feedback TMF8701 Time-of-Flight Sensor The TMF8701 is a time-of-flight (T OF) sensor in a single modular package with associated VCSEL. The TOF device is based on SPAD, TDC and histogram technology. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TMF8701, Time-of-Flight Sensor are listed below: Figure 1: Added Value of Using TMF8701 Benefits Feature
- Modular package - 2.2mm x 3.6mm x 1.0mm • Small footprint fits in the mobile phone bezel
- 21° FOI • Detecting central closest objects
- Time-to-Digital converter (TDC)
- Direct time-of-flight measurement
- Within 5% of measurement (accuracy); no multi-path and no multiple object problems as for iT oF
- Single Photon Avalanche Photodiode (SPAD)
- Histogram based architecture
- Better accuracy detects reliably closest object
- Min. distance 1mm (black target)
- Max. distance 60cm
- Dynamic cover glass calibration • No complex calibration
- Reliable operation under demanding use cases • Compensates for dirt on glass
- Reference SPAD • Improved accuracy over temperature and life
- Distance and signal quality reported • Make better decisions
- Fast VCSEL driver with protection • Class 1 Eye Safe
- 940μA power consumption at 10Hz (proximity mode)
- 26 mA power consumption at 60Hz operation (distance and proximity mode)
- 0.26μA power-down current consumption (EN=0)
- Longer battery life General Description
Page 2 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − General Description
Applications
The device is ideal for use in the mobile phone market with applications including:
- Distance measurement for camera autofocus (Laser Detect Autofocus - LDAF)
- Supporting low-power system operation by enabling high-power components (i.e. 3D facial recognition) only when an object is in the detection range
- Proximity detection
- Presence detection - Object detection
- Collision avoidance Block Diagram The functional blocks of this device are shown below: Figure 2: TMF8701 Block Diagram TMF8701 VCSEL Optical Filter Reflective Surface Background Light Internal Reflection Optics SPAD, TDC and Histogram Driver Control Data Process Cortex M0 TOF SensorEN GPIO1 GPIO0INT SDA SCL VDDC GNDC VDD GND Host
Datasheet, Public Page 3 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Pin Assignments Pin Diagram Figure 3: Pin Diagram TMF8701 Module Pin Description The GPIO is controlled by the firmware. Figure 4: Pin Description TMF8701 Module Pin Diagram TMF8701 Module: Top through view (not to scale) Pin No. Pin Name Signal Type Description
1 VDDC Supply
Charge pump supply voltage (3V); add a capacitor GRM155R70J104KA01 (0402 X7R 0.1μF 6.3V) to GND 2G N D C G r o u n d Charge pump ground; connect all ground pins together 3G P I O 0 I / O General purpose input/output; default output low; leave open if not used 4I N T O u t p u t Interrupt. Open-drain output; connect to GND if not used
5 SCL Input I²C serial clock
Page 4 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Pin Assignments Note(s): 1. SDA, SCL, INT and EN have no diode to any VDD supply. Theref ore even with VDD=0V they do not block the interrupt line or I²C bus. 2. GPIO0 and GPIO1 are push/pull output and have a diode to VDD; therefore if VDD is not powered, GPIO0 and GPIO1 should not be driven from outside. 6S D A I / O I ² C s e r i a l d a t a
7 VDD Supply
Chip supply voltage (3V); add a capacitor GRM155R70J104KA01 (0402 X7R 0.1μF 6.3V) to GND
8 GND Ground Chip ground; connect all ground pins
Enable input active high; setting to low forces the device into shutdown and all memory content is lost; connect to VDD if not used
10 GPIO1 I/O General purpose input/output; default
output low; leave open if not used
11 GNDV Ground VCSEL ground; connect all ground pins
12 VDDV Supply
VCSEL supply voltage (3V); add a capacitor GRM155R70J104KA01 (0402 X7R 0.1μF 6.3V) to GND Pin No. Pin Name Signal Type Description
Datasheet, Public Page 5 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond thos e indicated unde r Electrical Specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Symbol Parameter Min Max Units Comment VDDC, VDDV, VDD 3V Supply voltage -0.3 3.6 V Connect pins VDDC, VDDV, VDD on PCB with very short connections GNDV, GNDC, GND Ground 0.0 0.0 V Connect all GND pins on PCB with very short connections GPIO0, GPIO1 Digital I/O terminal voltage -0.3 VDD+0.3V V Protection diode to VDD INT, SCL, SDA, EN Digital I/O terminal voltage -0.3 3.6 V No protection diodes to any positive supply only to ground I_SCR Latch-up immunity ±100 mA JEDEC JESD78D Nov 2011 Electrostatic Discharge ESD_HBM Electrostatic discharge HBM ±2000 V JS-001-2014 ESD_CDM Electrostatic discharge CDM ±500 V JEDEC JESD22-C101F Oct 2013 Absolute Maximum Ratings
Page 6 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Absolute Maximum Ratings Note(s): 1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non hermet ic Solid State Surface Mount Devices.” Temperature Ranges and Storage Conditions TSTRG Storage Temperature -40 85 °C RHNC Relative Humidity (non-condensing) 85 % TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD-020(1) MSL Moisture Sensitivity Level 3 Represents a maximum floor life time of 168h with T AMB<30°C and <60% r.h. Symbol Parameter Min Max Units Comment
Datasheet, Public Page 7 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Electrical Characteristics Recommended Operating Conditions Device parameters are guaranteed at nominal conditions otherwise noted. While the de vice is operational across the temperature range, functionality will vary with temperature. Figure 6: Recommended Operating Co nditions TMF8701 Module Parameter Min Typ Max Units Comment VDDV, VDDC, VDD 3V Supply voltage 2.7 3 3.3 V Temperature Range Free-air temperature -30 25 70 °C Operational
Electrical Characteristics
Page 10 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Detailed Description I²C Protocol The TMF8701 is controlled by an I²C bus, one interrupt pin and two GPIO pins. The device uses I²C serial communication protocol for communication. The device support s 7-bit chip addressing and standard, fast mode and fast mo de plus modes. Read and Write transactions comply with the stan dard set by Philips (now NXP). For a complete description of the I²C protocol, please review the NXP I²C design specification. Internal to the device, an 8-bit buffer stores the register address location of the byte to read or write. This buffer auto-increments upon each byte transfer and is retained between transaction events (i.e. valid even after the master issues a STOP and the I²C bus is released). During consecutive Read transactions, the future/repeated I²C Read transaction may omit the memory address byte normally following the chip address byte; the buffer retains the last register address +1. A Write transaction consists of a START, CHIP-ADDRESSWRITE, REGISTER-ADDRESSWRITE, DATA BYTE(S), and STOP . Following each byte (9TH clock pulse) the slave places an ACKNOWLEDGE/NOT- ACKNOWLEDGE (ACK/NACK) on the bus. If NACK is transmitted by the slave, the master may issue a STOP . A Read transaction consists of a START, CHIP-ADDRESSWRITE, REGISTER-ADDRESS, RESTART, CHIP-ADDRESSREAD, DATA BYTE(S), and STOP . Following all but the final byte the master places an ACK on the bus (9TH clock pulse). Termination of the Read transaction is indicated by a NACK being placed on the bus by the master, followed by STOP . Detailed Description
Page 12 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Detailed Description Power Consumption All current consumption values include silicon process variation. Temperature and voltages are at nominal conditions (23°C and 2.8V). Figure 13: Power Consumption Condition Min Typ Max Units Comment I_VDD Power down Enable Pin Low I²C Off 0.02 0.26 1 μA State: Power down I_VDD Standby CPU Off, RAM On OSC Off, pon=0 I²C Wakeup Only 85 μA State: Standby I_VDD Wait CPU Off, RAM On, OSC On 5MHz I²C On, Timer Wakeup 140 μA State: Wait I_VDD Ranging Processing CPU Running at 80MHz No VCSEL, No TDC 2.7 mA State: Histogram processing I_VDD Ranging Active CPU stopped VCSEL 43MHz 320ps pulses, TDCs running 32.5 mA State: Ranging active I_VDD Background measurement Active CPU stopped VCSEL off, TDCs running 13 mA I_VDD Ranging 60Hz, 16.6ms, distance and proximity algorithm combined 26 mA Average power consumption Peak VCSEL Current 320ps pulses 230 mA Max VCSEL Duty Cycle 2 %
Page 14 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Detailed Description Reset Pin and Power-Up Timing Figure 16: Reset Pin and Power-Up Timing Distance and Proximity Algorithm As the performance of the algo rithm is dependent on the ROM version, following se ction only applies for devices with order code TMF8701-1 B (and TMF8701-1 BM), calibrated and in-application oscillator calibration using the reference driver code and patched with the la test software patch from ams OSRAM (contact ams OSRAM to identify latest patch version). The TMF8701 is embedded in th e application using a 0.38mm airgap and a glass with an IR ink with >90% transmissivity. The glass thickness is 0.5mm. An addi tional mask on the opaque ink is implemented according to TMF8701 optical design guide (external document). Calibration To achieve the performance described in the next sections, a calibration of the algorithm needs to be performed (command = 0x0A). The TMF8701 shall be embedded in the final application and the cover glass in cluding the IR in k needs to be assembled. The calibration test sh all be done in a housing with minimal ambient light and no targ et within 40cm in FOI of the TMF8701. The TMF8701 generates a calibration data set which is permanently stored on the host. On each power-up of the TMF870 1 the calibration data set is sent by I²C to the TMF8701 prior to execution of any algorithms (commands=0x02 or 0x0B). Operating Modes and Timings The TMF8701 can be operated in two different modes:
- Proximity mode only; it uses 80k iterations at 43MHz for capturing (VCSEL on). Min Typ Max Units Comment Power On (boot time) 3 ms Does not include RAM download time Enable High to Ready for Measurement 8m s Standby to Active Time <<1 ms Active to Standby Time <<1 ms Enable Low to Power Down Time <<1 ms
Page 16 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Detailed Description Proximity and Distance Mode Combined In the combined operating mode, proximity algorithm is run first followed by distance algorithm. An object detected in proximity mode has priority over an object detected in distance mode. The distance algorithm reports a distance information of the closest object in 1mm steps. Figure 19: Distance Mode Parameters Note(s): 1. 14k lux halogen light represents 100k lux sunlight equivalent; light on object only. 2. If proximity mode detects an object within ≤ 100mm, it is re ported. Only if proximity mode does not detect an object, distan ce mode result is used. Therefore the full range starting from mi nimum proximity distance (1mm) to maximum distance for distance mode (600mm) is covered. VCSEL Internal protection ensures no single point of failure will cause the VCSEL to violate the Class 1 Laser Safety. Laser Safety: Class 1 VCSEL Pulse Rep. Rate: 23ns (43MHz) Condition Min Nom Max Units Reflectivity of Object at 940nm 20cmx26cm target, perpendicular to TMF8701 18 90 % Maximum Distance Detection, 18% Grey Card, 20cmx26cm <350 lux fluorescent on object 600 mm 14k lux halogen light on object (1) 350 mm Minimum Distance Detection, 18% Grey Card, 20cmx26cm(2) 60 100 mm Accuracy Object distance ≥ 200mm ±5 % 100mm< object distance <200mm ±10 mm
Datasheet, Public Page 17 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Detailed Description Typical Optical Characteristics VCSEL Field of Illumination (FOI): 21 ° Full width from 5% of maximum up to maximum : 19° 1/e² TOF Sensor Field of View (FOV): 37° FWHM – in proximity mode : 24° FWHM – in distance mode This Rx SPAD FoV angular re sponse simulates the TMF8701 operation in proximity mode base d on the entire SPAD array. The Rx SPAD FoV angular response is reduced when the TMF8701 operates in distance mode since the SPAD array is reduced. This helps to improve ambient light tolerance. Figure 20: FOI/FOV of TMF8701 Filter Characteristics FWHM: 56nm Passband Center Frequency: 940nm Min. Stopband Frequency: 350nm Max. Stopband Frequency: 1100nm
Datasheet, Public Page 23 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Register Description Figure 39: COMMAND Register 0x10: COMMAND Field Name Reset Type Description 7:0 Command 0 RW Direct the device to control or select contents of the registers from 0x20...0xDF Setting Meaning 0x00 No command 0x02 Set flag to perform distance or proximity measurement with 8 bytes of data containing where including setting of calibration (and algorithm state) configuration. cmd_data7 = Bit mask which calibration/state data was downloaded from the host to TMF8701 prior to setting this command: Bit 0 - dataFactoryCal: when 1 data from register 0x20 onward includes factory calibration Bit 1 - dataAlgState: if set, also set dataFactoryCal=1. Data from register 0x20 onwards includes factory calibration and algorithm state. cmd_data6… cmd_data0: Identical to command=0x03.
Page 24 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Register Description 0x03 Set flag to perform distance or proximity measurement with 7 bytes of data containing where cmd_data6 = Bit mask which algorithm is used Bit 0 - When 1 proximity is enabled Bit 1 - When 1 distance enabled Bits 3:2 - Reserved; set to 00b. Bits 4 - algImmediateInterrupt – When 1 proximity and distance will immediately report to the host an interrupt of the capturing caused by a GPIO event; when 0, will only report to the host when proximity (and distance if enabled) was finished Bit 5 - When 1 combine the capture of the proximity and distance algorithms for maximum speed Bit 6 - Reserved; set to 0. Bit 7 - When 1 do not go to standby between measurements (faster measurement times but higher current consumption) Please note if bits 0 and 1 are both zero, the system will default to proximity and distance algorithms enabled. cmd_data5 = Bits for GPIO control Bits 3:0 - GPIO0 settings 0 – Disabled (tristate) 1 - Input: Active low disables collection, immediately abandoning current measurement. Returning to high restarts new measurement 2 - Input: Active high disables collection, immediately abandoning current measurement. Returning to low restarts new measurement 3 - Output: VCSEL pulse output - see cmd_data4 4 - Output low (default after startup) 5 - Output high 6:15 – Reserved, do not use Bits 7:4 - GPIO1 settings 0 - Disabled (tristate) 1 - Input: Active low disables collection, immediately abandoning current measurement. Returning to high restarts new measurement 2 - Input: Active high disables collection, immediately abandoning current measurement. Returning to low restarts new measurement 3 - Output: VCSEL pulse output – see cmd_data4 4 - Output low (default after startup) 5 - Output high 6:15 – Reserved, do not use 0x10: COMMAND Field Name Reset Type Description
Datasheet, Public Page 25 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Register Description cmd_data4 = If cmd_data5 enables VCSEL pulse output for GPIO0 and/or GPIO1, cmd_data4 sets its timings as follows. If set to non-zero, GPIO1 shows the VCSEL pulse; additionally the GPIO1 signal can be set to be asserted before the VCSEL pulse starts ‘0’ - No signal, ‘1’ - GPIOx, rises 0μs time before VCSEL pulse starts ‘2’ - GPIOx rises 100μs before VCSEL pulse, ‘3’ - GPIOx rises 200μs before VCSEL pulse and so on. The falling edge of GPIOx happens at the same time the VCSEL stops emitting light. cmd_data3 = Reserved for future, use 0x00. cmd_data2 = Repetition period in ms, use 0 for single measurement; if the repetition period is set lower than the ranging time for this mode, the TMF8701 runs at it maximum possible speed (best effort approach). cmd_data1 = Reserved for future, use 0xFF cmd_data0 = Reserved for future, use 0xFF Once a measurement is finished the interrupt is asserted if it is enabled by int1_enab. Additionally the transaction ID tid is updated. 0x04 Set flag to perform distance measurement (no proximity algorithm is used) with 5 bytes of data containing where: cmd_data4 = If set to non-zero, GPIO1 shows the VCSEL pulse; additionally the GPIO1 signal can be set to be asserted before the VCSEL pulse starts, 0 for no signal, ‘1’=0μs time before VCSEL pulse ‘2’=GPIO1 starts 100μs before VCSEL pulse, ‘3’= GPIO1 starts 200μs before VCSEL pulse. cmd_data3 = Reserved for future, use 0x00 cmd_data2 = Repetition period in ms, use 0 for single ranging; if the repetition period is set lower than the ranging time for this mode, the TMF8701 runs at it maximum possible speed (best effort approach) cmd_data1 = Reserved for future, use 0xFF cmd_data0 = Reserved for future, use 0xFF Once a measurement is finished the interrupt is asserted if it is enabled by int1_enab. Additionally the transaction ID tid is updated. 0x10: COMMAND Field Name Reset Type Description
Page 26 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Register Description 0x0A Perform factory calibration in the final customer application including cover glass, no ambient light and no target. The result from the factory calibration is stored from register 0x20 onwards (14 bytes). 0x0B Set flag to download calibration (and algorithm state) configuration to TMF8701. cmd_data0 = bit mask which calibration/state data was downloaded from the host to TMF8701 prior to setting this command: Bit 0 - dataFactoryCal: When 1 data from register 0x20 onward includes factory calibration Bit 1 - dataAlgState: If set, also set dataFactoryCal=1. Data from register 0x20 onwards includes factory calibration and algorithm state. 0x0F Set gpio control setting without actually performing a measurement as commands 0x02 or 0x03 would do: cmd_data0 = bits for GPIO control Bits 3:0 - GPIO0 settings 0 – Disabled 1 - Input: Active low disables collection, immediately abandoning current measurement. Returning to high restarts new measurement 2 - Input: Active high disables collection, immediately abandoning current measurement. Returning to low restarts new measurement 3 - Output: VCSEL pulse output 4 - Output low 5 - Output high 6:15 – Reserved, do not use Bits 7:4 - GPIO1 settings 0 - Disabled 1 - Input: Active low disables collection, immediately abandoning current measurement. Returning to high restarts new measurement 2 - Input: Active high disables collection, immediately abandoning current measurement. Returning to low restarts new measurement 3 - Output: VCSEL pulse output 4 - Output low 5 - Output high 6:15 – Reserved, do not use 0x10: COMMAND Field Name Reset Type Description
Datasheet, Public Page 27 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Register Description Note(s): 1. At the end of the transaction of read a quarter, the contents of the registers from 0x20-0x9F will be automatically updated, and the contents of registers REGISTER_CON TENTS and TID will be updated. 2. At the end of a TDC, the TDC number will also auto increment. 0x30 Enable histogram readout; the internal state machine will stop when a histogram (e.g. calibration) is available and wait for readout by the host. If the selected histogram is readout, the host shall continue the state machine by sending command 0x32 cmd_data3 = Bitmask for the histograms to be readout:
- Always set bit 0 to ‘0’
- Set bit 1 to get electrical calibration histograms
- Set bit 2 to get optical calibration histogram
- Always set bit 3 to ‘0’
- Set bit 4 to get proximity histograms
- Always set bit 5 and 6 to ‘0’
- Set bit 7 to get distance measurement histograms cmd_data2 = Set to 0x00 cmd_data1 = bitmask for pileup correct histograms readout:
- Set bit 0 to get pileup corrected distance measurement histograms
- Set bit 1 to get pileup corrected sum histogram
- Set bit 2 to get pileup corrected proximity histogram
- Always set bit 3-7 to 0 cmd_data0 = Set to 0x00 Once above bitmask is set, the device is programed to stop when the histogram is available. Set command=0x04 to actually perform the measurement. 0x32 After the host has readout the histogram, continue with internal processing. 0x47 Read out serial number – results see section Serial Number Readout – If Register register_contents=0x47 0x80 … 0x93 Read 1 quarter of one histogram - copy histogram bits[4:2] to select TDC0… TDC5, quarter bits[1:0] into 0x20... 0x9f (1), (2) 0xff Stop whatever you are doing as soon as possible and reenter the idle state. The current state will not be interrupted and will require leaving the current state processing to take effect. This command will stop continuous measurement. 0x10: COMMAND Field Name Reset Type Description
Page 30 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Register Description Figure 47: RESUL T_INFO Register Figure 48: DISTANCE_PEAK_0 Register 0x21: RESULT_INFO Field Name Reset Type Description 5:0 reliability 0 RO Reliability of object - valid range 0 to 63 where 63 is best 7:6 measStatus 0 RO When algImmediateInterrupt == 1 Will indicate the status of the measurement. Value Definition
0 Proximity capture interrupted, using
previous proximity only result
1 Proximity capture interrupted, using
previous proximity and distance result
2 Distance capture interrupted, result is
from proximity algorithm only
3 Complete result (distance and proximity)
When algImmediateInterrupt == 0 Will indicate the status of the measurement. Value Definition
0 Measurement was not interrupted
2 Measurement was interrupted (delay) by
0x22: DISTANCE_PEAK_0 Field Name Reset Type Description 7:0 distance_peak[7:0] 0 RO Distance to the peak in [mm] of the object, least significant byte
Datasheet, Public Page 47 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Register Description ADDR_RAM This command is to specify the RAM pointer location for the next R_RAM or W_RAM command. Figure 112: ADDR_RAM Command Address Value Meaning BL_CMD_STAT 0x43 Specify the address of the next RAM read or write. BL_SIZE 2 BL_DATA0 0... 0xFF LSB of address in RAM BL_DATA1 0... 0xFF MSB of address in RAM BL_CSUM 0... 0xFF
Page 50 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Application Information Schematic The TMF8701 needs only 3 small 0402 external capacitors for operation: Figure 116: The SYNC signal connected to GPIO1 can be used to immediately interrupt the TMF870 1 VCSEL operation if the high power illuminator is operating. It needs to be ensured that SYNC does not exceed the VDD supply of TMF8701 as otherwise an internal protection diode will start conducting. The VCSEL operation is controlled by setting cmd_data5 of command=0x02 or 0x03 according (see App0 Registers – appid=0xC0 registers). On SYNC assertion, the VCSEL is immediately switched off (typic ally after 10μs), on SYNC de-assertion the VCSEL operation is resumed within >100μs. GPIO0 can be used as a general GPIO output signal. The signals INT/SDA/SCL need an external pullup resistor to the V IO supply (typically 1.8V). TMF8701 VCSEL Optical Filter Reflective Surface Background Light Internal Reflection Optics SPAD, TDC and Histogram Driver Control Data Process EN GPIO1 GPIO0 INT SDA SCL VDDCGNDC VDDVGNDV VDD GND Host VDD0.1µF/6V3 VDD 2x 0.1µF/6V3 High Power Illuminator VIO SYNC
Datasheet, Public Page 51 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Application Information PCB Layout Figure 117: PCB Layout Recommendation Use GRM155R70J104KA01 (0402 X7R 0.1μF 6.3V) or capacitors with same or better performance for C VDDC , CVDD and C VDDV . (0402) VDDC GNDC GPIO0 EN GND VDD GPIO1 INT SCL SDA GNDV VDDV GND GND VDD VDD VDD GND GPIO1 EN GPIO0 INT SCL SDA CVDDC (0402) CVDDV (0402) CVDD (0402) GND PLANE
Page 52 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Application Information PCB Pad Layout Figure 118: PCB Pad Layout Note(s): 1. All linear dimensions are in millimeters. 2. Dimension tolerances are 0.05mm unless otherwise noted. 3. This drawing is subject to change without notice. Use the PCB pad layout as a recommendation only. The actual pad layout shall be optimized for the customer production line.
Datasheet, Public Page 53 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Package Information Figure 119: Package Drawing Note(s): 1. All linear dimensions are in millimeters. 2. Contact finish is Au/Ni 3. This package contains no lead (Pb). 4. This drawing is subject to change without notice. 5. 5-digit tracecode is only on bottom side of the package.
Package Information
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Page 54 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Tape & Reel Information Figure 120: Tape and Reel Drawing Note(s): 1. All linear dimensions are in millimeters. Dime nsion tolerance is ± 0.10 mm unless otherwise noted. 2. The dimensions on this drawing are for illustrative purpos es only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing A0, B0, and K0 are defined in ANSI EIA Standard 481-B 2001. 4. There are two reel sizes available (see section Ordering Information ) a. 7” reels: Each reel is 7 inches in diameter and contains 500 parts. b. 13” reels: Each reel is 13 inches in diameter and contains 5000 parts. 5. ams OSRAM packaging tape and reel conform to the requirements of EIA Standard 481-B. 6. In accordance with EIA standard, device pin 1 is located next to sprocket holes in the tape. 7. This drawing is subject to change without notice. Tape & Reel Information
Datasheet, Public Page 55 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Soldering & Storage Information Soldering Information The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 121: Solder Reflow Profile Graph Soldering & Storage Information
Page 56 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Soldering & Storage Information Figure 122: Solder Reflow Profile Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 24 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 24 months
- Ambient Temperature: <40°C
- Relative Humidity: <90% Rebaking of the devices will be required if the devices exceed the 24 months shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Parameter Reference Device Average temperature gradient in preheating 2.5°C/s Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 60s Time above 230 °C (T2) t2 Max 50s Time above Tpeak – 10 °C (T3) t3 Max 10s Peak temperature in reflow T peak 260°C Temperature gradient in cooling Max −5°C/s
Datasheet, Public Page 57 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Soldering & Storage Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: <30°C
- Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Page 58 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Laser Eye Safety The TMF8701 is designed to meet the Class 1 laser safety limits including single faul ts in compliance with IEC/EN 60825-1:2014 and IEC/EN 60825-1:2007. This applies to the stand-alone device and the included softwa re supplied by ams OSRAM. In an end application system envir onment, the system may need to be tested to ensure it rema ins compliant. The system must not include any additional lens to concentrate the laser light or parameters set outside of the recommended operating conditions. Use outside of the recommended condition or any physical modification to the mo dule during development could result in hazardous levels of radiation exposure. Additionally the device has been measured according to IEC/EN 60825-1:2007 and it is classified as class 1 according to this standard as well: Laser Eye Safety
Datasheet, Public Page 59 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Ordering & Contact Information Figure 123:
Ordering Information
Note(s): 1. Where X=ROM version (A-Z). Buy our products or get free samples online at: www.ams.com/Products Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/Contact Headquarters ams-OSRAM AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package Marking Delivery Form Delivery Quantity TMF8701-1XM Optical Module 5-Digit Tracecode (coded) Tape & Reel (7”) 500 parts/reel TMF8701-1X Tape & Reel (13”) 5000 parts/reel Ordering & Contact Information
Page 60 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams-OSRAM AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU 2015/863), including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br/Cl): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) and do not contain Chlorine (Cl not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams-OSRAM AG knowledge and belief as of the date that it is provided. ams-OSRAM AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams-OSRAM AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams-OSRAM AG and ams-OSRAM AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Datasheet, Public Page 61 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Copyrights & Disclaimer Copyright ams-OSRAM AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams-OSRAM AG are covered by the warranty and patent indemnification provis ions appearing in its General Terms of Trade. ams-OSRAM AG makes no warranty, express, statutory, implied, or by desc ription regarding the information set forth herein. ams-OSRAM AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams-OSRAM AG for current information. This product is intended for use in commercial applications. Applications re quiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams-OSRAM AG for each application. This product is provided by ams-OSRAM AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams-OSRAM AG shall not be liable to recipient or any third party for any damages, including but no t limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams-OSRAM AG rendering of technical or other services. Copyrights & Disclaimer
Page 62 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Datasheet, Public Page 63 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-08 (2020-Jun-29) to current revision 2-00 (2023-Feb-21) Page Updated “Shelf Life” to 24 months 56 Revision Information
Page 64 Datasheet, Public Document Feedback [v2-00] 2023-Feb-21 TMF8701 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignments
3 Pin Description
5A b s o l u t e M a x i m u m R a t i n g s
7 Electrical Characteristics
7 Recommended Operating Conditions
8 Typical Operating Characteristics
10 Detailed Description
10 I²C Protocol
11 TOF Description
11 System Parameters
11 I/O
12 Power Consumption
13 Timing
14 Distance and Proximity Algorithm
16 VCSEL
17 Typical Optical Characteristics
18 Register Description
18 Register Overview
21 App0 Registers – appid=0xC0
29 Object Detection Results – If Register
register_contents =0x55 (Commands 0x02,0x03 or 0x04)
36 Calibration and Algorithm State Data Exchange
42 Raw Histogram Output – If Register
register_contents= 0x80 …0x93
43 Serial Number Readout – If Register
register_contents=0x47
44 Bootloader Registers – appid=0x80
45 Bootloader Commands
48 SPAD Options
48 Signal SPADs
48 Reference SPADs
49 Reference SPAD, TDC and Histogram
50 Schematic
51 PCB Layout
52 PCB Pad Layout
54 Tape & Reel Information
55 Soldering & Storage Information
55 Soldering Information
Datasheet, Public Page 65 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Content Guide