TMD3700 AMSCO | Alldatasheet
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Technical content
[v1-02] 2016-Aug-19 Document Feedback TMD3700 Color, ALS and Proximity Sensor Module The device features advanced Proximity measurement, Digital Ambient Light Sensing (ALS) and Color Sensing (CRGB). The slim module incorporates an IR LED and factory calibrated LED driver. The Proximity detection feature provides object detection (e.g. mobile device screen to user’s ear) by photodiode detection of reflecte d IR energy (sourced by the integrated LED). Detect/release events are interrupt driven, and occur when proximity result crosses upper and/or lower threshold settings. The proximity engine features offset adjustment registers to compensate for unwanted IR energy reflection at the sensor. Proximity results are further improved by automatic ambient light subtraction. The Color and ALS detection feature provides red, green, blue and clear light intensity data. Each of the C, R, G, B channels have a UV and IR blocking filters and a dedicated data converter producing16-bit data simultaneously. This architecture allows applications to accurately measure ambient light and sense color which enables devices to calculate illuminance and color temperature, control display backlight, and chromaticity. Ordering Information and Content Guide appear at end of datasheet. Figure 1: Added Value of Using TMD3700 Benefits Features
- Reduced board space requirements and enables low-profile system design
- Small footprint and low profile package 4.00 x 1.75 x 1.00 mm
- Improved ALS angular response for more accurate measurement of lighting environment
- 45 degree average ALS FOV
- Operating range of 200 milli-Lux to 60 kilo-Lux enables operation behind dark glass
- Wide dynamic range and high sensitivity General Description
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − General Description
Applications
The TMD3700 applic ations include:
- Color Sensing
- Ambient Light Sensing
- Mobile Phone touch screen disable Block Diagram The functional blocks of this device are shown below: Figure 2: Functional Blocks of TMD3700
- Single device integrated optical solution
- RGB, Ambient Light Sensor (ALS) and proximity support
- Power management features
- I²C fast mode interface compatible
- Integral IR LED
- Accurate color temperature and ambient light sensing
- UV / IR blocking filters
- Programmable gain and integration time
- Reduced power consumption • 0.18μ process technology with 1.8V I²C bus Benefits Features /g1%/g430/g316/g316/g2%6/g304/g410/g3/g14/g341/g304/g364 /g40/g61/g100 /g14/g1%/g62 /g14/g24/g4 /g115/g24/g24 /g05/g313/g410/g341/g202/g25%/g360/g360/g455/g3 /g40/g10 /g62/g2%/g24 /g31/g61/g24 /g1%/g44/g1004/g3/g4/g24/g1% /g1%/g44/g1005/g3/g4/g24/g1% /g40/g304/g410/g2%6/g316/g316/g430/g313/g410/g3/g05/g430/g410/g3/g%06 /g62/g2%/g24/g4 /g1%/g44/g1006/g3/g4/g24/g1% /g1%/g44/g1000/g3/g4/g24/g1% /g%0/g31/g61/g24 /g100/g6%/g24/g1000/g1011/g1004/g1004
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Pin Assignment Top View of module showing pin assignment Figure 3: TMD3700 Pinout (Top View) Figure 4: Pin Description Pin Number Pin Name Description
1 SCL I²C serial clock input terminal
2 INT Interrupt. Open drain output (active low). 3 PGND Ground for LED current sink.
4 LEDA LED anode
5 NC No connection
SDA I²C serial data I/O terminal
7 VDD Supply voltage
8 GND Ground. All voltages are referenced to GND Pin Assignment /g1005 /g1006 /g1000 /g100% /g14/g1%/g62 /g40/g61/g100 /g%0/g31/g61/g24 /g62/g2%/g24/g4 /g1012 /g1011 /g1010 /g1001 /g31/g61/g24 /g115/g24/g24 /g14/g24/g4 /g61/g1%
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units VDD Supply voltage -0.3 2.2 V LEDA Supply voltage -0.3 3.6 V VIO Digital I/O terminal voltage -0.3 3.6 V (SDA, INT) Output terminal current -1 20 mA TStrg Storage temperature range -40 85 ºC ISCR Input current (latch up immunity) JEDEC JESD78D Nov 2011 CLASS 1 ESDHBM Electrostatic discharge HBM S-001-2014 ±2000 V ESDCDM Electrostatic discharge CDM JEDEC JESD22-C101F Oct 2013 ±500 V Absolute Maximum Ratings
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Electrical Characteristics Figure 10: Proximity Operating Characteristics Note(s): 1. Production tested result is the average of 5 readings expressed relative to a calibrated response. 2. Representative result by characterization. 3. Production tested result is the average of 20 readings divided by the average response. Parameter Conditions Min Typ Max Units Part to part variation(1) Conditions: PGAIN = 2 (4x) PLDRIVE = 8 (54mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 1 (8μs) d=23mm round target 30mm target distance 75 100 125 % Response, absolute Basic proximity measurement Conditions: PGAIN = 2 (4x) PLDRIVE = 16 (102mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 2 (16μs) Target material: 90% reflective surface of Kodak gray card Target Size: 100mm x 100mm Target Distance: 100mm Module held by TMD37003SH210T socket 90 113 136 counts Improved accuracy proximity measurement using factory programmed offsets in each device and a supplied driver 85 100 115 Response, no target using offset values from 0xE6 and 0xE7 PGAIN = 2 (4x) ILEDDRIVE = 16 (102mA) PPULSE = 16 (17 Pulses) Pulse Length = 2 (16μs) 01 2 c o u n t s Noise/Signal (3) PGAIN = 2 (4x) IRLEDDRIVE = 8 (54mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 1 (8μs) d=23mm round target 30mm target distance
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − I²C Protocol The device uses I²C serial communication protocol for communication. The device supports 7-bit chip addressing and both standard and full-speed cl ock frequency modes. Read and Write transactions comply with th e standard set by Philips (now NXP). Internal to the device, an 8-bit buffer stores the register address location of the desired byte to read or write. This buffer auto-increments upon each byte transfer and is retained between transaction events (I.e. valid even after the master issues a STOP command and the I²C bus is released). During consecutive Read transactions, the future/repeated I²C Read transaction may omit the memory address byte normally following the chip address byte; the buffer retains the last register address +1. All 16-bit fields have a latching scheme for reading and writing. In general it is recommended to use I²C bursts whenever possible, especially in this ca se when accessing two bytes of one logical entity. When reading these fields, the low byte must be read first, and it triggers a 16-bit latch that stores the 16-bit field. The high byte must be read immediately afterwards. When writing to these fields, the low byte must be written first, immediately followed by the high byte. Reading or writing to these registers without following these requirements will cause errors. I²C Write Transaction A Write transaction consists of a START, CHIP-ADDRESSWRITE, REGISTER-ADDRESS WRITE, DATA BYTE(S), and STOP . Following each byte (9TH clock pulse) the slave places an ACKNOWLEDGE/NOT- ACKNOWLEDGE (ACK/NACK) on the bus. If NACK is transmitted by the slave, the master may issue a STOP . I²C Read Transaction A Read transaction consists of a START, CHIP-ADDRESSWRITE, REGISTER-ADDRESS, RESTART, CHIP-ADDRESSREAD, DATA BYTE(S), and STOP . Following all but the final byte the master places an ACK on the bus (9TH clock pulse). Termination of the Read transaction is indicated by a NACK being placed on the bus by the master, followed by STOP . The I²C bus protocol was developed by Philips (now NXP). For a complete description of the I²C protocol, please review the NXP I²C design specification. I²C Protocol
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Register Description Figure 17: Register Overview Address Register Name R/W Register Function Reset Value 0x80 ENABLE R/W Enables states and interrupts 0x00 0x81 ATIME R/W ADC integration time 0x00 0x82 PRATE R/W Proximity sample rate 0x1F 0x83 WTIME R/W Wait time 0x00 0x84 AILTL R/W ALS interrupt low threshold low byte 0x00 0x85 AILTH R/W ALS interrupt low threshold high byte 0x00 0x86 AIHTL R/W ALS interrupt high threshold low byte 0x00 0x87 AIHTH R/W ALS interrupt high threshold high byte 0x00 0x88 PILT R/W Proximity interrupt low threshold 0x00 0x8A PIHT R/W Proximity interrupt high threshold 0x00 0x8C PERS R/W ALS and proximity interrupt persistence filters 0x00 0x8D CFG0 R/W Wait Long 0x80 0x8E PCFG0 R/W Proximity pulse width and count 0x80 0x8F PCFG1 R/W Proximity gain and LED current 0x80 0x90 CFG1 R/W Configuration register one 0x00 0x91 REVID R Revision ID 0x92 ID R Device ID 0xC0 0x93 STATUS R, SC Device status register one 0x00 0x94 CDATAL R Clear ADC low data register 0x00 0x95 CDATAH R Clear ADC high data register 0x00 0x96 RDATAL R Red ADC low data register 0x00 0x97 RDATAH R Red ADC high data register 0x00 0x98 GDATAL R Green ADC low data register 0x00 0x99 GDATAH R Green ADC high data register 0x00 0x9A BDATAL R Blue ADC low data register 0x00 0x9B BDATAH R Blue ADC high data register 0x00 0x9C PDATA R Proximity ADC data register MSBs 0x00 0x9F CFG2 R/W LSB of ALS gain 0x04 Register Description
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Register Description Note(s):
- R = Read Only
- W = Write Only
- R/W = Read or Write
- SC = Self Clearing after access 0xAB CFG3 R/W Configuration register three 0x00 0xC0 POFFSET_L R/W Proximity offset magnitude 0x00-0xFF 0xC1 POFFSET_H R/W Proximity offset sign 0x00-0xFF 0xD7 CALIB R/W Calibration control 0x00 0xD9 CALIBCFG R/W Calibration configuration 0x00 0xDC CALIBSTAT R/W Calibration status bit 0x00 0xDD INTENAB R/W Interrupt enables 0x00 Address Register Name R/W Register Function Reset Value
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Register Description ENABLE Register (0x80) Figure 18: ENABLE Register The Mode/Parameter fields should be written before aen or pen is asserted. The functions pen and aen require pon to be asserted for the respective function to operate correctly. 0x80: ENABLE Field Name Reset Type Description 7:4 Reserved 0 RW Reserved. 3w e n0 R W Wait Enable. This bit activates the wait feature. Writing a one actives the wait timer. Writing a zero disables the wait timer. 2p e n0 R W Proximity Detect Enable. This field activates the proximity detection. 1a e n0 R W ALS Enable. This bit actives the ALS function. Set aen=1 and pon=1 in the same command to ensure autozero function is run prior to the first measurement. 0p o n0 R W Power ON. This field activates the internal oscillator to permit the timers and ADC channels to operate. Writing a one activates the oscillator. Writing a zero disables the oscillator.
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Register Description ATIME Register (0x81) Figure 19: ATIME Register The ATIME register controls th e integration time of the ALS ADCs. The timer is implemented with a down counter with 0x00 as the terminal count. The timer is clocked at a 2.8ms nominal rate. Loading 0x00 will generate a 2.8ms integration time, loading 0x01 will generate a 5.6ms integration time, and so forth. Note(s): The RC oscillator runs at 8MHz nominal rate. This gets divided by 11 to generate the integration clock of 727kHz. One count in ATIME (nominal 2.8ms) are 2.81ms. This is 2048 integration clock cycles: 125ns*11*8*256=2.81ms. 0x81: ATIME Field Name Reset Type Description 7:0 atime 0x00 RW Integration Time. Eight bit value that specifies the integration time The maximum ALS value depends on the integration time. For every 2.81ms, the maximum value increases by 1024. This means that to be able to reach ALS full scale, the integration time has to be at least 64*2.8ms. Value Integration Cycles Integration Time Maximum ALS Value 0x00 1 2.8ms 1023 0x01 2 5.6ms 2047 0x3f 63 180ms 65535 0xff 255 721ms 65535
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Register Description PERS Register (0x8C) Figure 28: PERS Register 0x8C: PERS Field Name Reset Type Description 7:4 ppers 0 RW Proximity Persistence Filtering. Value Interrupt generated when...
0 Every proximity cycle
1 Any proximity value outside of threshold range
2 2 consecutive proximity values out of range 3 3 consecutive proximity values out of range 15 15 consecutive proximity values out of range 3:0 apers 0 RW Value Interrupt generated when... 0E v e r y A L S c y c l e
1 Any ALS value outside of threshold range
2 2 consecutive ALS values out of range 3 3 consecutive ALS values out of range 45 . . . 51 0 . . . 61 5 . . . 72 0 . . . 12 45... 13 50... 14 55... 15 60 consecutive ALS values out of range
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Register Description PCFG1 Register (0x8F) Figure 31: PCFG1 Register 5:0 ppulse 15 RW Maximum Number of Pulses in Proximity. Value Number of Pulses 63 64 0x8F: PCFG1 Field Name Reset Type Description 7:6 pgain 2 RW Proximity Gain Control. Sets the gain of the proximity receiver. Value Gain Value 01 x 12 x 24 x 38 x 5 Reserved 0 RW Reserved. 4:0 pldrive 0 RW Proximity LED Drive Strength. This is configured linearly in steps of 6mA This is the nominal value. The actual value depends on the trim procedure. Value LED Current 06 m A 11 2 m A 31 192mA 0x8E: PCFG0 Field Name Reset Type Description
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Register Description CALIBCFG Register (0xD9) Figure 51: CALIBCFG Register 0xD9: CALIBCFG Field Name Reset Type Description 7:5 binsrch_target 'h2 RW ADC target during binary search Value Target 41 5 53 1 66 3 71 2 7 Note that this target is relative to 8-bit ADC values. In the circuit, a 10-bit target is used (x4) of which the lowest 2 bits are always ignored when checking for zero during binary search and zero detection. In hardware, this defines a mask of which bits to ignore when comparing to zero. E.g. binsrch_target=4 (target=15) means that values from the ADC are AND'ed with 0xffc0 before comparing to zero. Only values 16 or larger are taken as positive ADC values. 4 Reserved 1 RW Reserved. Set to 0.
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Register Description CALIBSTAT Register (0xDC) Figure 52: CALIBSTA T Register 2:0 prx_data_avg 0 R_PUSH Prox data calculation is done by averaging consecutive windows of constant size. At the end of the window, PDATA is updated. Typical use case is HRM measurement Value Window Size 0d i s a b l e 41 6 53 2 66 4 71 2 8 Out to be useful, we will reset this bit to zero in the production version. 0xDC: CALIBSTAT Field Name Reset Type Description 0 calib_finished 0 R/W Offset calibration has finished. Clear bit by writing '1' to it. Bit generates interrupt if cien is asserted. 0xD9: CALIBCFG Field Name Reset Type Description
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Register Description INTENAB Register (0xDD) Figure 53: INTENAB Register 0xDD: INTENAB Field Name Reset Type Description 7 asien 0 RW Writing '1' to this bit enables asat interrupt. 6 psien 0 RW Writing '1' to this bit enables psat 5 pien 0 RW Writing '1' to this bit enables prox interrupt. 4 aien 0 RW Writing '1' to this bit enables als interrupt. 3 cien 0 RW Writing '1' to this bi t enables calibration interrupt.
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Application Information Figure 54: Typical Application Hardware Circuit Note(s): 1. Place the 4.7μF and 10μF capacitors as close as possib le to the module. 2. The bulk capacitor can affect the stability of a regulated su pply output and should be chosen with the regulator characteris tics in mind. In systems with a clean power supply the 4.7μF and 22Ω resistor may not be needed. 3. The value of the I²C pull up resistors R PU should be based on the 1.8V bus voltag e, system bus speed and trace capacitance. 4. GND and PGND should be connected to the same solid ground plane as close to the device as possible.
Application Information
1.8V 3.3V RINT = 10KΩ 10µF (1) Bulk System Capacitance (2) VBUS INT SCL SDA 4.7µF (1) R = 22Ω TMD3700 LEDA GND VDD PGND INT SCL SDA NC RPU
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − PCB Pad Layout Figure 55: Recommended PCB Pad Layout PCB Pad Layout 5HFRPPHQGHG3&%3DG/D\\RXW
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Packaging Mechanical Data Figure 56: Package Drawing Note(s): 1. All linear dimensions are in millimeters. 2. The ALS detector is centered in the opening within a tolerance of ±0.03 millimeters. 3. Contact finish is AU. 4. This drawing is subject to change without notice. Packaging Mechanical Data $/6&/ 352;&/ '(7(&725 /(' Green RoHS
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Tape & Reel Information Figure 57: Tape & Reel Information Note(s): 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice. Tape & Reel Information /g11/g21/g29/g20/g12 /g36/g16/g36 /g3/g46/g19/g32/g20/g17/g20/g27/g3 /g3/g20/g19/g131/g80/g68/g91/g17/g3 /g147/g19/g17/g19/g24/g3/g3/g36/g19/g32/g20/g17/g28/g25/g3/g147/g19/g17/g19/g24/g3 /g54/g88/g85/g73/g68/g70/g72/g3/g73/g76/g81/g76/g86/g75/g29 /g37/g16/g37 /g3 /g3/g147/g19/g17/g19/g24/g3/g19/g17/g21/g27/g3 /g3/g37/g19/g32/g23/g17/g21/g20/g3/g147/g19/g17/g19/g24 /g3/g20/g19/g131/g80/g68/g91/g17/g3 /g3/g21/g3/g147/g19/g17/g19/g24/g3 /g3/g20/g21/g3 /g19/g17/g22 /g3/g20/g17/g24/g3/g19 /g19/g17/g20 /g3 /g19/g17/g20 /g3/g20/g17/g26/g24/g3 /g3 /g3 /g147/g19/g17/g20 /g14 /g14 /g147/g19/g17/g19/g24/g3/g24/g17/g24/g3 /g16 /g3 /g3/g23/g91/g20/g19/g32/g23/g19/g3 /g3/g23/g3/g147/g19/g17/g20/g3 /g3/g147/g19/g17/g21 /g3/g147/g19/g17/g20/g3/g23/g3 /g3 /g3/g20/g17/g20/g3/g147/g19/g17/g20/g3 /g37 /g37 /g36 /g36
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Soldering & Storage Information Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 12 months
- Ambient Temperature: <40°C
- Relative Humidity: <90% Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: <30°C
- Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Ordering & Contact Information Figure 60:
Ordering Information
Note(s): 1. Consult factory for availability of secondary address versions. Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code I²C Bus I²C Address Delivery Form Delivery Quantity TMD37003 1.8V 39h Tape & Reel (13") 10000 pcs/reel TMD37003M 1.8V 39h Tape & Reel (7") 1000 pcs/reel TMD37007 (1) 1.8V 29h Tape & Reel (13") 10000 pcs/reel Ordering & Contact Information
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used with out the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limite d to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-01 (2016-Jun-27) to current revision 1-02 (2016-Aug-19) Page Removed POFFEST Magnitude and POFFSET Sign registers Updated Figure 7 5 Updated Figure 17 12 Revision Information
[v1-02] 2016-Aug-19 Document Feedback TMD3700 − Content Guide
1 General Description
2 Applications
3P i n A s s i g n m e n t 4A b s o l u t e M a x i m u m R a t i n g s
5 Electrical Characteristics
11 I²C Protocol
11 I²C Write Transaction
11 I²C Read Transaction
12 Register Description
14 ENABLE Register (0x80)
15 ATIME Register (0x81)
16 PRATE Register (0x82)
16 WTIME Register (0x83)
17 AILTL Register (0x84)
17 AILTH Register (0x85)
18 AIHTL Register (0x86)
18 AIHTH Register (0x87)
19 PILT Register (0x88)
19 PIHT Register (0x8A)
20 PERS Register (0x8C)
21 CFG0 Register (0x8D)
21 PCFG0 Register (0x8E)
22 PCFG1 Register (0x8F)
23 CFG1 Register (0x90)
23 REVID Register (0x91)
24 ID Register (0x92)
24 STATUS Register (0x93)
25 CDATAL Register (0x94)
25 CDATAH Register (0x95)
25 RDATAL Register (0x96)
26 RDATAH Register (0x97)
26 GDATAL Register (0x98)
26 GDATAH Register (0x99)
26 BDATAL Register (0x9A)
27 BDATAH Register (0x9B)
27 PDATA Register (0x9C)
28 CFG2 Register (0x9F)
29 CFG3 Register (0xAB)
29 POFFSET_L Register (0xC0)
30 POFFSET_H Register (0xC1)
30 CALIB Register (0xD7)
31 CALIBCFG Register (0xD9)
32 CALIBSTAT Register (0xDC)
33 INTENAB Register (0xDD)
Document Feedback [v1-02] 2016-Aug-19 TMD3700 − Content Guide