TMD2620 AMSCO | Alldatasheet
Document overview
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Technical content
[v1-01] 2016-Aug-02 Document Feedback TMD2620 Proximity Sensor Module The device is an advanced pro ximity sensor. The slim module incorporates an IR LED and factory calibrated LED driver. The proximity detection feature provides object detection (e.g. mobile device screen to user’s ear) by photodiode detection of reflected IR energy (sourced by the integrated LED). Detect/release events are interrupt driven, and occur when proximity result crosses upper and/or lower threshold settings. The proximity engine features offset adjustment registers to compensate for unwanted IR energy reflection at the sensor. Proximity results are further improved by automatic ambient light subtraction. Ordering Information and Content Guide appear at end of datasheet. Figure 1: Added Value of Using TMD2620
Applications
The TMD2620 is ideal for mobile phone touch screen disable. Benefits Features
- Reduced board space requirements and enables low-profile system design
- Small footprint and low profile package
- 3.10 x 2.00 x 1.00 mm
- Reduced power consumption • 0.18μm process technology with 1.8V I²C bus General Description
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − General Description Block Diagram The functional blocks of this device are shown below: Figure 2: Functional Blocks of TMD2620 Wait Control I²C Interface Prox DataProx ADC Prox Integration Prox Control INTR SCL SDA VDD Optically Isolated IR LED GND Interrupt Control LEDA IR Detector Lower Upper Prox Th resholds PGND
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Pin Assignment Figure 3: TMD2620 Pinout (Top View) Figure 4: Pin Description Pin Number Pin Name Description 1 I/C Internal connection. Connect to ground. 2 INT Interrupt. Open drain output (active low)
3 PGND Ground for LED current sink and I/O buffers
4 LEDA LED anode
5S C L I ² C s e r i a l c l o c k i n p u t SDA I²C serial data I/O terminal 7 VSS Ground. All voltages are referenced to GND
8 VDD Supply voltage
,17 3*1' /('$ 6&/ 6'$ 966 9''
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units VDD Supply voltage -0.3 2.2 V LEDA Supply voltage -0.3 3.6 V VIO Digital I/O terminal voltage -0.3 3.6 V (SDA, INT) Output terminal current -1 20 mA TSTRG Storage temperature range -40 85 ºC ISCR Input current (latch up immunity) JEDEC JESD78D Nov 2011 CLASS 1 ESDHBM Electrostatic discharge HBM S-001-2014 ±2000 V ESDCDM Electrostatic discharge CDM JEDEC JESD22-C101F Oct 2013 ±500 V Absolute Maximum Ratings
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Electrical Characteristics Figure 8: Proximity Optical Characteristics of TMD2620 Note(s): 1. Production tested result is the average of 5 readings expressed relative to a calibrated response. 2. Representative result by characterization. 3. Production tested result is the average of 20 readings divided by the average response. Parameter Conditions Min Typ Max Unit Part to part variation (1) Conditions: PGAIN = 2 (4x) PLDRIVE = 8 (54mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 1 (16μs) d=23mm round target 30mm target distance 75 100 125 % Response, absolute Basic proximity measurement (2) Conditions: PGAIN = 2 (4x), PLDRIVE = 7(48mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 2 (16μs) Target material: 90% reflective surface of Kodak gray card Target Size: 100mm x 100mm Target Distance: 60mm 82 103 123 Counts Response, no target using offset values from 0xE6 and 0xE7 PGAIN = 2 (4x) ILEDDRIVE = 16 (102mA) PPULSE = 16 (17 Pulses) Pulse Length = 2 (16μS) 01 0 Noise/Signal (3) PGAIN = 2 (4x) IRLEDDRIVE = 8 (54mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 1 (8μs) d=23mm round target 30mm target distance
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Register Description Device address is 0x29. Figure 11: Register Overview Register Access:
- R = Read Only
- W = Write Only
- R/W = Read or Write
- SC = Self Clearing after access Address Register Name R/W Register Function Reset Value 0x80 ENABLE R/W Enables states and interrupts 0x00 0x82 PRATE R/W Proximity sample rate 0x1F 0x83 WTIME R/W Wait time 0x00 0x88 PILT R/W Proximity interrupt low threshold 0x00 0x8A PIHT R/W Proximity interrupt high threshold 0x00 0x8C PERS R/W Proximity interrupt persistence filters 0x00 0x8D CFG0 R/W WTIME configuration 0x80 0x8E PCFG0 R/W Proximity pulse width and count 0x4F 0x8F PCFG1 R/W Proximity gain and LED current 0x80 0x91 REVID R Revision ID 0x92 ID R Device ID 0xD4 0x93 STATUS R, SC Device status register one 0x00 0x9C PDATA R Proximity ADC data register MSBs 0x00 0x9E REVID2 R Reserved 0x00 0x9FC F G2 R/W Configuration register two 0x00 0xAB CFG3 R/W Configuration register three 0x0C 0xC0 POFFSET_L R/W Proximity offset value 0x00-0xFF 0xC1 POFFSET_H R/W Proximity offset sign 0x00-0xFF 0xD7 CALIB R/W Calibration control 0x00 0xD9 CALIBCFG R/W Calibration configuration 0x00 0xDC CALIBSTAT R/W Calibration status bit 0x00 0xDD INTENAB R/W Interrupt enables 0x00 Register Description
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Register Description ENABLE Register (0x80) Figure 12: ENABLE Register The Mode/Parameter fields should be written before pen is asserted. The function pen require pon to be asserted for the respective function to operate correctly. PRATE Register (0x82) Figure 13: PRATE Register 0x80: ENABLE Field Name Reset Type Description 7:4 Reserved 0 RW Reserved 3w e n0 R W Wait Enable. This bit activates the wait feature. Writing a one actives the wait timer. Writing a zero disables the wait timer. 2p e n0 R W Proximity Detect Enable. This field activates the proximity detection.
1 Reserved 0 RW Reserved
Power On. This field activates the internal oscillator to permit the timers and ADC channels to operate. Writing a one activates the oscillator. Writing a zero disables the oscillator. 0x82: PRATE Field Name Reset Type Description 7:0 prate 0x1F RW When averaging is turned on, this register defines the time between proximity measurements. The time will be 88μs times this register's value.
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Register Description WTIME Register (0x83) Figure 14: WTIME Register The wait timer is implemented with a down counter with 0x00 as the terminal count. Loading 0x00 will generate a 2.81ms wait time, loading 0x01 will generate a 5.6ms wait time, and so forth; by asserting wlong, in register 0x8D the wait time is given in multiples of 33.8ms (12x). 0x83: WTIME Field Name Reset Type Description 7:0 wtime 0x00 RW Wait Time. Eight bit value that specifies the time Value Wait Cycles Wait Time 0x00 1 2.81ms/ 33.8ms 0x01 2 5.6ms/ 67.6ms 0x3f 63 180ms/ 2.16s 0xff 255 721ms/ 8.65s
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Register Description PERS Register (0x8C) This register controls the interrupt filtering capabilities of the device. Configurable filtering is provided to allow interrupts to be generated after a proximity cycle or if the integration cycle has produced a result that is ou tside of the values specified by threshold register for some specified number of times. Figure 17: PERS Register CFG0 Register (0x8D) Figure 18: CFG0 Register 0x8C: PERS Field Name Reset Type Description 7:4 ppers 0 RW Proximity Persistence Filtering Value Interrupt generated when...
0 Every proximity cycle
1 Any proximity value outside of threshold range
2 2 consecutive proximity values out of range 3 3 consecutive proximity values out of range 15 15 consecutive proximity values out of range 3:0 Reserved 0 RW Reserved 0x8D: CFG0 Field Name Reset Type Description 7:3 Reserved 1 0 0 0 0 RW Reserved. Must be set to 10000. 2w l o n g 0 R W Wait Long. When asserted, the wait cycle is increased by a factor 12x from that programmed in the WTIME register. 1:0 Reserved 0 0 RW Reserved. Must be set to 00.
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Register Description PCFG0 Register (0x8E) Figure 19: PCFG0 Register 0x8E: PCFG0 Field Name Reset Type Description 7:6 ppulse_len 1 RW Proximity Pulse Length Value Pulse Length 04 μ s 18 μ s 21 6 μ s 33 2 μ s 5:0 ppulse 15 RW Maximum Number of Pulses in Proximity Value Number of Pulses 63 64
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Register Description PCFG1 Register (0x8F) Figure 20: PCFG1 Register REVID Register (0x91) Figure 21: REVID Register 0x8F: PCFG1 Field Name Reset Type Description 7:6 pgain 2 RW Proximity Gain Control. Sets the gain of the proximity receiver. Value Gain Value 01 x 12 x 24 x 38 x
5 Reserved 0 RW Reserved
4:0 pldrive 0 RW Proximity LED Drive Strength. This is configured linearly in steps of 6mA, this is the nominal value. The actual value depends on the trim procedure. Value LED Current 06 m A 11 2 m A 31 192mA 0x91: REVID Field Name Reset Type Description 7:3 Reserved 0 RO Reserved 2:0 rev_id RO Revision Number Identification
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Register Description ID Register (0x92) Figure 22: ID Register 0x92: ID Field Name Reset Type Description 7:2 ID 0x35 RO Part Number Identification Value Meaning
110101 TMD2620
1:0 Reserved 00 RO Reserved
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Register Description STATUS Register (0x93) Figure 23: STATUS Register STATUS flags are reset with reading from STATUS address, or with writing 1 to dedicated bits of STATUS address. PDATA Register (0x9C) Figure 24: PDATA Register 0x93: STATUS Field Name Reset Type Description
7 Reserved 0 R, SC Reserved
6p s a t0 R , S C Proximity Saturation. Indicates that an ambient- or reflective-saturation event occurred during a previous proximity cycle. Writing a 1 will clear this status flag; to enable clear-by-read function, the register CFG3.int_read_clear must be set 1 5p i n t0 R , S C Proximity Interrupt. Indicates that the device is asserting a proximity interrupt. Writing a 1 will clear this status flag; to enable clear-by-read function, the register CFG3.int_read_ clear must be set 1
4 Reserved 0 R, SC Reserved
3c i n t0 R , S C Calibration Interrupt. Writing a 1 will clear this status flag; to enable clear-by-read function, the register CFG3.int_read_ clear must be set 1 2z i n t0 R , S C Zero Detection Interrupt. Writing a 1 will clear this status flag. Enable clear-byread with CFG3 1 psat_ reflective 0R , S C psat interrupt is from reflective light saturation writing a 1 to psat or psat_reflective will clear this status flag; to enable clear-by-read function, the register CFG3.int_read_clear must be set 1 0 psat_ ambient 0R , S C psat interrupt is from ambient light or idac threshold saturation writing a 1 to psat or psat_ambient will clear this status flag; to enable clear-by-read function, the register CFG3.int_read_clear must be set 1 0x9C: PDATA Field Name Reset Type Description 7:0 pdata 0 RO This register contains the 8-bit proximity data.
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Register Description CALIBCFG Register (0xD9) Figure 30: CALIBCFG Register 0xD9: CALIBCFG Field Name Reset Type Description 7:5 binsrch_target 0x2 RW ADC target during binary search Value Target 41 5 53 1 66 3 71 2 7 Note: This target is relative to 8-bit ADC values. In the circuit, a 10-bit target is used (x4) of which the lowest 2 bits are always ignored when checking for zero during binary search and zero detection. In hardware, this defines a mask of which bits to ignore when comparing to zero. e.g. binsrch_ target=4 (target=15) means that values from the ADC are AND'ed with 0xffc0 before comparing to zero. Only values 16 or larger are taken as positive ADC values. 4 Reserved 0 RW Reserved. Set to 0. 3 prox_auto_offset_ adjust 0S C This bit enables an automatic adjustment of the offset used in proximity measurements. If this bit is set, when a measurement returns zero, the value of 0xC0 will be decremented and offset_adjusted flag will be set, bit 2 in 0xDC.
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Register Description CALIBSTAT Register (0xDC) Figure 31: CALIBSTA T Register 2:0 prx_data_avg 0 R_PUSH Prox data calculation is done by averaging consecutive windows of constant size. At the end of the window, PDATA is updated. Typical use case is HRM measurement Value Window Size 0d i s a b l e 41 6 53 2 66 4 71 2 8 0xDC: CALIBSTAT Field Name Reset Type Description 7:3 Reserved 0 Reserved 2 offset_adjusted 0 SC This bit is a flag that the automatic proximity offset adjustment has changed the offset in register 0xDC. See 0xD9 for “prox_auto_offset_adjust” .
1 Reserved 0 Reserved
0 calib_finished 0 R/W Offset calibration has finished. Clear bit by writing '1' to it. Bit generates interrupt if cien is asserted. 0xD9: CALIBCFG Field Name Reset Type Description
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Register Description INTENAB Register (0xDD) Figure 32: INTENAB Register 0xDD: INTENAB Field Name Reset Type Description 6 psien 0 RW Writing '1' to this bit enables psat. 5 pien 0 RW Writing '1' to this bit enables prox interrupt. 3 cien 0 RW Writing '1' to this bi t enables calibration interrupt. 2 zien 0 RW Writing '1' to this bit enab les zero_detection/offset_adjustment.
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Application Information Figure 33: Typical Application Hardware Circuit Note(s): 1. Place the 4.7μF and 10μF capacitors within 5mm of the module. 2. The value of the I²C pull up resistors RPU should be based on the 1.8V bus voltage, system bus speed and trace capacitance. 3. The bulk capacitor can affect the stability of a regulated su pply output and should be chosen with the regulator characteris tics in mind. 4. GND and PGND should be connected to the same solid ground plane as close to the device as possible.
Application Information
1.8V 3.0V RPU 10μF Bulk System Capacitance VBUS INT SCL SDA 4.7μF R = 22Ω TMD2620 LEDA GND VDD PGND INT SCL SDA I/C RINT = 10KΩ
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − PCB Pad Layout Figure 34: Recommended PCB Pad Layout Note(s): 1. All linear dimensions are in millimeters. 2. Dimension tolerances are 0.05mm unless otherwise noted. 3. This drawing is subject to change without notice. PCB Pad Layout
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Packaging Mechanical Data Figure 35: Package Drawing Note(s): 1. All linear dimensions are in millimeters. 2. Dimension tolerances are 0.05mm unless otherwise noted. 3. Contact finish is Au. 4. This package contains no lead (Pb). 5. This drawing is subject to change without notice. Packaging Mechanical Data 0 & $% 0 & $% 6<1& ,175 3*1' /('$ 6&/ 6'$ 966 9'' '(9,&(3,1287 %277209,(: Green RoHS /(' 3$57&/ 7223(1,1*&/ 3$57&/ 72352;&/ 352;&/ 72/('&/ &/ 3,1,1',&$725 & $% I/C
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Tape & Reel Information Figure 36: Tape & Reel Information Note(s): 1. Measured from centreline of spro cket hole to centreline of pocket. 2. Cumulative tolerance of 10 sprocket holes is ± 0.20. 3. Measured from centreline of spro cket hole to centreline of pocket. 4. Other material available. Tape & Reel Information /g20/g17/g19/g19/g3/g48/g44/g49 /g53/g19/g17/g20/g19 /g55/g60/g51/g44/g38/g36/g47 /g51/g21 /g20/g17/g24/g19/g3 /g21/g17/g19/g19/g3/g147/g19/g17/g19/g24/g3/g11/g44/g12 /g3/g51/g20/g3 /g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g3/g23/g17/g19/g19/g19/g17/g20/g19/g3/g11/g44/g44/g12 /g51/g82 /g3/g58/g3 /g19/g17/g20/g19/g19/g17/g19/g19/g3 /g19/g17/g20/g19/g14 /g39/g20 /g3/g41/g3/g11/g44/g44/g44/g12/g3 /g40/g20 /g20/g17/g26/g24 /g39/g82 /g3/g36/g82/g3 /g60 /g60 /g54/g40/g38/g55/g44/g50/g49/g3/g60/g16/g60 /g3/g37/g82/g3 /g55 /g19/g17/g21/g24/g3/g147/g19/g17/g19/g22 /g3/g46/g82/g3 W F +/- 0.05 +/- 0.10 +0.3/-0.1 3.50 4.00 8.00 +/- 0.051.25 Ao 2.25 +/- 0.05 Ko Bo 3.35 +/- 0.05
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Soldering & Storage Information Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 12 months
- Ambient Temperature: <40°C
- Relative Humidity: <90% Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: <30°C
- Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Ordering & Contact Information Figure 39:
Ordering Information
Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package I²C Addr Delivery Form Delivery Quantity TMD26203 Module 29h 3.30mm reel 5000 pcs/reel TMD26203M Module 29h 3.30mm reel 1000 pcs/reel Ordering & Contact Information
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used with out the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limite d to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Document Feedback [v1-01] 2016-Aug-02 TMD2620 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-00 (2016-Jun-28) to current revision 1-01 (2016-Aug-02) Page Added note under Figure 35 24 Updated Figure 39 28 Revision Information
[v1-01] 2016-Aug-02 Document Feedback TMD2620 − Content Guide
1 General Description
1 Applications
3P i n A s s i g n m e n t 4A b s o l u t e M a x i m u m R a t i n g s