TLE8458 INFINEON | Alldatasheet

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Technical content

Rev. 1.1, 2014-04-01 TLE8458 LIN Transceiver with integrated Voltage Regulator TLE8458G TLE8458GV33

Data Sheet 2 Rev. 1.1 2014-04-01

TLE8458G PG-DSO-8-16 8458G VCC = 5 V TLE8458GV33 PG-DSO-8-16 8458GV3 VCC = 3.3 V PG-DSO-8-16 Data Sheet 3 Rev. 1.1, 2014-04-01 LIN Transceiver with integrated Voltage Regulator LIN-LDO TLE8458 1O v e r v i e w

Features

  • LIN Transceiver compliant to LIN 2.1
  • 5 V or 3.3 V Low Drop Voltage Regulator
  • 50 mA output current capability
  • Normal, Stop, and Sleep modes
  • Wake-up via bus from Sleep Mode
  • Wake-up from Local WK pin
  • Very low quiescent current in Stop Mode
  • Very low quiescent current in Sleep Mode
  • Very high ESD Robustness ± 10 kV according IEC61000-4-2
  • Bus short to ground and VBat protection
  • Software Flash mode
  • Over-Temperature protection
  • Pin- and function compatible to single LIN Transceivers, like TLE7259-3GE
  • Green (RoHS compliant) product
  • AEC Qualified

Description

The TLE8458G and TLE8458GV33 integrate a low drop voltage regulator and a LIN transceiver on one monolithic circuit. The device is suitable to supply microcontrollers and driving a LIN bus at the same time. The TLE8458 is pin compatible to stand-alone LIN transceivers like the TLE7259-3GE. The combination of a voltage regulator and a LIN transceiver on one circuit decreases the quiescent current for a typical application to a value of 8 μA, while the TLE8458 is still able to wake-up off a LIN bus sign al or a signal change on th e local wake-up input WK. Compliant to all LIN standards and with a wide operat ional supply range, the TLE8458 can be used in all automotive applications. Based on the Infineon Smart Power Technology SPT ®, the TLE8458 provides excellent ESD robustness together with a very high electro-magnetic i mmunity (EMI). The TLE8458 reaches a very low level of electro-magnetic emission (EME) within a broad frequency range. The TLE8458 family and the Infineon SPT® technology are AEC qualified and tailored to withstand the harsh conditions in the automotive environment.

Data Sheet 4 Rev. 1.1, 2014-04-01

2 Block Diagram

Temp .- Protection Current Limit Output Stage Supply TxD Input Mode Control Receiver RxD Filter LIN TxD EN VCC VS RBUS Filter Timeout GND REN RTxD Bandgap Reference Overtemperature Shutdown Charge Pump WK Vcc

Data Sheet 5 Rev. 1.1, 2014-04-01

3 Pin Configuration

3.1 Pin Assignments

Figure 2 Pin Configuration

3.2 Pin Definitions and Functions

1R x D Receive Data Output; Low in dominant state, active low after a Wake-up event on BUS or WK pin. 2E N Enable Input; Integrated pull-down resistor, device set to normal operation mode when HIGH. 3W K Wake-up Input; Active LOW, negative edge triggered, internal pull-up. 4T x D Transmit Data Input; Integrated pull-down resistor, LOW in dominant state. Active LOW after Wake-up via WK pin. 5G N D Ground 6L I N Bus Output / Input; LIN bus input / Output, LOW in dominant state, Internal termination and pull-up current source.

7 VS Battery Supply Input

8 VCC Output Voltage;

Decouple to GND with a capacitor CVcc ≥ 470 nF, ESR < 6 Ω at 10 kHz, Active during Normal Mode, disabled in Sleep Mode. RxD 1 EN WK TxD VS LIN GND VCC

General Product Characteristics Data Sheet 6 Rev. 1.1, 2014-04-01

4 General Product Characteristics

4.1 Absolute Maximum Ratings

  1. Stresses above the ones listed here may cause perma nent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Integrated protection func tions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Table 2 Absolute Maximum Ratings 1) All voltages with respect to ground, positive current flowing into pin (unless otherwise specified) 1) Not subject to production test; specified by design. Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Voltages Supply Voltage on VS pin VS -0.3 – 40 V LIN2.1 Param 11 P_4.1.1 Input Voltage on LIN, WK pin versus GND VLIN,G -40 – 40 V – P_4.1.2 Logic Voltages at EN, TxD, RxD pin VL,max -0.3 – 5.5 V – P_4.1.3 Output Voltage at VCC pin VCC -0.3 – 5.5 V Static P_4.1.4 Temperatures Junction Temperature Storage Temperature Tstg -55 – 150 °C – P_4.1.6 ESD Resistivity ESD all pins VESD,HBM -2 – 2 kV HBM 2) 2) ESD susceptibility, HB M according to ANSI/ESDA/JEDEC JS-001 (1.5 kΩ, 100pF) P_4.1.7 ESD VS, WK, LIN versus GND VESD,HBM -8 – 8 kV HBM 2) P_4.1.8 ESD Resistivity all pins versus GND VESD,CDM -750 – 750 V CDM 3) 3) ESD susceptibility, Charged Device Model “CDM” EIA / JESD 22-C101 or ESDA STM5.3.1 P_4.1.9

General Product Characteristics Data Sheet 7 Rev. 1.1, 2014-04-01

4.2 Functional Range

Note: Within the functional range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table.

4.3 Thermal Characteristics

Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Extended Supply Range VS(EXT) 5.5 – 40 V Parameter deviations possible P_4.2.1 Supply Voltage for Normal Operation VS(Nor) 7 – 27 V LIN 2.1 Param. 11 P_4.2.3 Junction Temperature Tj -40 – 150 °C – P_4.2.2 Table 4 Thermal Resistance Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Thermal Resistance Junction to Case PG-DSO-8-16 RthJC,G –5 5 –K / W 1) 1) Not subject to production tes t. Simulated thermal resistance P_4.3.1 Junction to Ambient PG-DSO-8-16 RthJA,G –1 2 0 –K / W 1), 2) 2) The RthJA values are according to Jedec JESD51-2,-7 at natural convection on 2s2p board for 1 W. Package was simulated on a 76.2 × 114.3 × 1.5 mm³ board with 2 inner copper layers (70 µm thick). P_4.3.2 Thermal Shutdown Junction Temperature VCC Shutdown Temperature TSD,Vcc 150 – 200 °C 3) 3) Not subject to production test, specified by design. P_4.3.5 VCC Thermal Shutdown Hysteresis ∆TSD,Vcc –3 5 –K 3) P_4.3.6 LIN Shutdown Temperature TSD,LIN 150 – 200 °C 3) P_4.3.7 LIN Thermal Shutdown Hysteresis ∆TSD,LIN –1 0 –K 3) P_4.3.8

Data Sheet 8 Rev. 1.1, 2014-04-01 5M o d e C o n t r o l

5.1 Operation Mode State Diagram

Figure 3 Operation Mode State Diagram Standby Mode Normal Slope Mode Sleep Mode Start Up Power Up EN WK pin or Wake Up BUS Vcc on BUS off EN TxD EN Software Flash ModeVcc on BUS on Vcc off BUS off Stop Mode WK pin orEN Vcc on BUS off EN TxD Go to Normal trmode Go to Sleep tmode Go to Sleep tmode EN Go to Stop tmode EN TxDTxD Wake Up BUS EN TxD EN TxD ENEN RxD TxD Wake Source

0 WK pin

11) LIN Bus

1 Power-up

Wake-Up Source indication on the Pins RxD, TxD in Stand-By Mode 1)weak pull-down, to see high signal a external pull-up resistor is required 11)1- Normal Operation Mode Vcc on BUS on

Data Sheet 9 Rev. 1.1, 2014-04-01

5.2 Description of Mode Control

The TLE8458 has 4 major operation modes:

  • Normal Operation Mode
  • Stand-By Mode
  • Sleep Mode
  • Stop Mode The Normal Operation mode contains 2 sub-operation modes, which differentiate by the slew rate control of the LIN Bus signal (see Figure 3). Sub-operation modes with different slew rates on the BUS pin:
  • Normal Slope Mode, for data transmission rates up to 20 kBaud
  • Software Flash mode, for programming of the external microcontroller The operation mode of the TLE8458 is selected by the EN pin and the TxD pin. (see Table 5, see Figure 4). Table 5 Operation Modes Mode EN TxD RxD VCC LIN Bus Termination Comments Normal Operation Mode HIGH LOW HIGH1) 1) The TxD pin acts as an input LOW HIGH ON 30 k Ω (typical) TxD drives the data to the bus, RxD indicates the data on the bus. Stand-By Mode LOW LOW HIGH 2) The TxD pin acts as an output and indicates the Wake-up sour ce.The TxD input needs an external termination to indicate a HIGH or a LOW signal. The external termination could be a pull-up resistor or an active microcontroller output. LOW HIGH ON 30 k Ω (typical) In Stand-By Mode the RxD and TxD pins indicate the Wake-up source Sleep Mode LOW HIGH Float OFF High Impedance For Sleep Mode TxD needs to be HIGH for the time tmode1 Stop Mode LOW LOW Float ON High Impedance For Stop Mode TxD needs to be LOW for the time tmode1

Data Sheet 10 Rev. 1.1, 2014-04-01 Figure 4 Mode Transition Data Transmission Data Transmission tmode3 Don’t Care Stand-by Mode EN tMode_NO Normal Operation Mode TxD Don’t Care Data Transmission ttorec Stand-By Mode to Normal Operation Mode EN TxD Normal Operation Mode1) Sleep Mode Normal Operation Mode1) to Sleep Mode Normal Operation Mode1) Stop Mode EN Normal Operation Mode1) to Stop Mode tmode1 tmode1 tmode2 TxD Stop Mode to Sleep Mode EN Don’t Caretmode1TxD Stop Mode Sleep Mode 1) Normal Operation Mode can be either Normal Slope Mode or Software Flash Mode

Data Sheet 11 Rev. 1.1, 2014-04-01

5.2.1 Stand-By Mode

The Stand-By Mode is an idle operation mode, which di sables the communication to the LIN bus. The TLE8458 enters automatically the Stand-By Mode after a Power-up. By setting the EN pin to HIGH, the operation mode changes to Normal Operation Mode, regardless of the signal applied to the TxD pin. The TLE8458 can be transferred to Stand-By mode by the following options:

  • After Power-up on the supply VS, the TLE8458 starts in Stand-By Mode.
  • From Sleep Mode or from Stop Mode the TLE8458 changes to Stand-By Mode if a Wake-up event occurs on the LIN bus.
  • From Sleep Mode or from Stop Mode the TLE8458 changes to Stand-By Mode if a Wake-up event occurs on the local Wake input WK.
  • In case of an undervoltage event on VS, the TLE8458 changes to Stand-By Mode regardless of selected operation mode. In Stand-By mode the external power supply VCC is active and LIN bus output stage is disabled. The TLE8458 provides the following functionality in Stand-By Mode:
  • The power supply VCC is active and functional.
  • The LIN transceiver output stage is disabled , no communication to the LIN bus is possible.
  • The LIN transceiver bus input receiver is disabled.
  • The LIN bus is terminated by the 30 k Ω.
  • Both digital pins, the TxD pin and the RxD pin act as ou tput pins and indicate a Wake-up or a Power-up event 2).
  • The EN input pin is active. By sett ing the EN pin to HIGH the TLE8458 changes the operation mode to Normal Operation Mode (see Figure 3).
  • The Wake-up logic is disabled. Wake-up events don’t trigger an operation mode change.

5.2.2 Normal Operation Mode

The TLE8458 enters the Normal Operation Mode after the microcontroller sets EN to “High” (see Figure 4). In Normal Operation mode the LIN bus receiver and the LIN bus transmitter are active. The TLE8458 converts the logical HIGH and LOW signals on the TxD input pi n to DOMINANT and RECESSIVE signals to the LIN bus. Simultaneously the input receiver of the TLE8458 converts the DOMINANT and RECESSIVE signals on the LIN bus to HIGH and LOW signals to the RxD output. In Normal Operation mode the output voltage VCC is active and the bus termination is set to 30 kΩ. Normal Slope Mode and the Software Flash Mode are Normal Operation Modes. In these two sub-modes the behavior of the power supply VCC and the bus termination are the same. Per default the TLE8458 always enters into Normal Slope Mode, either from Sleep Mode, Stop Mode or from Stand-By Mode. The Software Flash Mode can only be entered from Normal Slope mode. Table 6 Logic table for Wake-up monitoring 1) 1) The Wake-up monitor is only active in Stand-By Mode Power-up Wake-up event RxD TxD 2) 2) The TxD input needs an external termination to indicate a “High” or a “Low” signal. The external termination could be a pull- up resistor or an active microcontroller output. Comments Yes No HIGH LOW Power Up event No Via LIN Bus LOW HIGH Wake-up via LIN Bus No Via WK Pin LOW LOW Wake-up via local Wake pin WK

Data Sheet 12 Rev. 1.1, 2014-04-01 In order to avoid any bus disturbance during a mode change, the output stage of the TLE8458 is disabled and set to recessive state during the mode change procedure. To release the TLE8458 for data communication on the LIN bus, the TxD pin needs to be set to HIGH for the time ttorec after the operation mode change.

5.2.2.1 Normal Slope Mode

In Normal Slope Mode the maximum data transmission rate of the LIN transceiver is limited by the slope control mechanism of LIN output signal. The limi tation of the slew rate of the LIN ou tput signal results in an optimized radiated emission fulfilling automotive EMC requirements. The data transmission rate of the TLE8458G and the TLE8458GV33 is limited to 20 kBaud in Normal Operation Mode and the devices are compliant to the specification LIN2.1.

5.2.2.2 Software Flash Mode

Software Flash Mode is a Normal Operation Mode and it is possible to transmit data to the LIN bus and receive data from the LIN bus. The slope control mechanism of the LIN transmitter output stage is disabled and therefore it is possible to reach higher data transmission rates, disregarding the EMC limitation of the LIN network. The Software Flash Mode can be used for programming the external microcontroller via the LIN bus, got example during the production flow of the ECU. The Software Flash Mode can only be entered from Normal Slope Mode (see Figure 3). By setting the EN pin to low for the time tfl1 and by generating a falling and a rising edge at the TxD pin with the time tfl2 and tfl3 during the low phase of the EN pin, the TLE8458 changes to the Software Flash Mode (see Figure 5) . Vice versa , t he TLE8458 changes from Software Flash Mode to Normal Slope Mode by applying the same sequence to the EN pin and the TxD pin. In any case, regardless if the device is in Normal Slope Mode or in Software Flash Mode, a LOW signal on the EN pin changes the operation mode to Sleep Mode or Stop Mode. The slope control me chanism will be activated, when the device changes to the Normal Operation Mode again. Figure 5 Software Flash Mode TO20070515.vsd Normal Mode TxD EN tfl3 tfl1 Software Flash Mode tfl2 tfl3 tfl3 tfl1 tfl2 tfl3 Normal Mode

Data Sheet 13 Rev. 1.1, 2014-04-01

5.2.3 Stop Mode

The Stop Mode is a Low Power Mode, meaning the quiesce nt current of the TLE8458 is reduced to a minimum, while the device is still able to recognized Wake-up events. The following functions are available in Stop Mode:

  • The power supply VCC is active and functional.
  • The LIN transceiver output stage is disabled , no communication to the LIN bus is possible.
  • The LIN transceiver input receiver is disabled.
  • The internal LIN bus termination is switched off.
  • The TxD input and the RxD output is inactive.
  • The EN input is active. A HIGH signal on the EN pi n changes the operation mode to Normal Operation Mode.
  • The LIN bus Wake-up receiver is active, a Wake-up event on the LIN bus changes the operation mode to Stand-By Mode.
  • The wake input WK is active, a Wake-up event on the WK pin changes the operation mode to Stand-By Mode. Entering Stop Mode is only possible from the Normal Operation Mode, regardless if the device is in Normal Slope Mode or Software Flash Mode. Setting the signal on the EN pin to LOW, followed by a LOW signal on the TxD pin for the time tMode1 changes the operation mode to Stop Mode (see Figure 4).

5.2.4 Sleep Mode

The Sleep Mode is a Low Power Mode as well, in comparison to the Stop Mode, the quiescent current of the TLE8458 is even further reduced. In Sleep Mode the TLE8458 is able as well to recognized Wake-up events. The Wake-up behavior in Sleep Mode is the same as in Stop Mode. The only difference between Sleep Mode and Stop Mode is, that in Stop Mode the output voltage VCC is active, in Sleep Mode the output voltage VCC is disabled. Sleep Mode can be entered from Normal Operation Mode by setting the EN pin to LOW and simultaneously setting the TxD pin to HIGH for the time tMode1 (see Figure 4). The Sleep Mode can be also entered from Stop Mode, by setting the signal on the TxD pin to HIGH for the time tMode1.

5.2.5 Wake-up Events in Sleep and Stop Mode

A Wake-up event in Sleep Mode or Stop Mode changes the operation mode of the TLE8458 to Stand-By Mode. There are 3 different options to Wake-up the TLE8458 from Sleep Mode or Stop Mode:

  • A bus Wake-up event, caused by a message on the LIN bus.
  • A local Wake-up event, caused by a logical LOW signal on the WK pin.
  • A signal change to logical HIGH on the EN pin.

Data Sheet 14 Rev. 1.1, 2014-04-01

5.2.5.1 Bus Wake-up Event

A falling edge on the LIN bus, followed by a dominant bus signal for the time t > twk,Bus causes a bus Wake-up or also called remote Wake-up. The mode change becomes active with the following rising edge on the LIN bus (see Figure 6). In Stand-By Mode the Wake-up source is indicated by the TxD and RxD pins (see Table 6). Figure 6 Bus Wake-up

5.2.5.2 Local Wake-up Event

A Wake-up via LOW signal on the pin WK is called local Wake-up. A falling edge of the signal on the pin WK followed by a LOW signal for the time t >tWK change the operation mode from Sleep Mode or Stop Mode to Stand- By Mode. In the case the LOW sign al is shorter then the time t < tWk, the Wake-up is ignored and the TLE8458 remains in Sleep Mode or Stop Mode. In Stand-By Mode the Wake-up source is indicated by the TxD and RxD pins (see Table 6). In order to avoid unintended Wake-up´s via the local wake pin Wk, the Wk pin should get connected by a serial resistor to the power supply Vs (see Figure 15). Before the TLE8458 enters into Sleep Mode it is required to set the Voltage on the WK pin to the Vs power supply. VBUS VBUS,dom VBUS,wk LIN BUS Signal VCC tWK,Bus Sleep Mode Stand-By Mode Stop Mode Stand-By Mode VCC Note: In Sleep Mode the Output Voltage VCC is disabled and will be actived by a mode change to Stand-By Mode. In Stop Mode the Output Voltage VCC is active and remains active after the mode change to Stand-By Mode.

Data Sheet 15 Rev. 1.1, 2014-04-01 Figure 7 Local Bus Wake-up

5.2.5.3 Mode Transition via EN pin

The EN pin is used for the mode selection. In case the power supply VCC is present, like in Stop Mode or Sleep Mode, the TLE8458 can be directly transferred into Norma l Operation Mode by setting the EN pin to HIGH. An integrated pull-down resistor at the EN pin avoids mode changes due to floating signals on the EN input. The TLE8458 changes the operation mode to Normal Operation Mode, from Stop Mode or from Sleep Mode if the EN pin is HIGH for the time t > tMode1 (see Figure 8). An integrated hysteresis on the EN pin avoids bit toggling. The mode transition via the EN pin will not be indicated in Stand-By Mode. Figure 8 Mode Transition via EN pin VWK VWK,L WK Signal Sleep Mode Stand-By Mode tWK VCC Stop Mode Stand-By Mode VCC Note: In Sleep Mode the Output Voltage VCC is disabled and will be actived by a mode change to Stand-By Mode. In Stop Mode the Output Voltage VCC is active and remains active after the mode change to Stand-By Mode. VENEN Signal VEN,OFF Stop Mode / Stand-By Mode tMode_NO VEN,ON EN Hysteresis Sleep ModeNormal Operation Mode tMode1

Data Sheet 16 Rev. 1.1, 2014-04-01

5.2.6 Power Up

After a Power-up the device enters per default into Stand-By Mode. Above VS,PU the VCC output voltage follows the supply VS closely. In Stand-By Mode, the Power-up is indicated by a HIGH signal on the RxD pin and a LOW signal on the TxD pin. Figure 9 Power-up Level

5.2.7 Over-Temperature Protection

The TLE8458 is protected against ther mal over-heating. Over-heating could be caused by a short circuit on the VCC power supply or by a permanent short on the LIN bus combined with a high ambient temperature. In case of an over-temperature event, the TLE8458 eliminates the r oot cause of the over-tempera ture event. Two different temperature sensors are implemented inside the TLE8458. One temperature sensor protects the voltage regulator and controls the output voltage VCC, the second temperature sensor protects the LIN transmitter output stage. In case the junction temperature on the LI N output stage raises above the threshold T > TSD,LIN, the temperature sensor disables the LIN output stage. The TLE8458 is still able to receive data from the LIN bus. If the temperature falls below the threshold, T < TSD,LIN, the output stage will be enabled and the communication can start again. An integrated hysteresis on the temperature sensor av oids toggling during over-tem perature events. An over- temperature event on the LIN bus will not cause any operation mode change. In case the junction temperature on the VCC power output stage raises above the threshold T > TSD,VCC, the temperature sensor shuts down the output voltage VCC. If the junction temperatur e falls below the threshold, T> TSD,VCC, the power supply VCC will be enabled again. An integrated hysteresis on the temperature sensor avoids toggling during over-temperature events. Stand-by ModePower Down EN TxD RxD Power Down VS VCC VS,PU VRxD,H VCC VS VS,PU

Data Sheet 17 Rev. 1.1, 2014-04-01

5.3 Current Consumption

Table 7 Electrical Characteristics: Current Consumption VS = 13.5 V, Tj = -40 °C +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Current Consumption Current Consumption in Normal Mode at VS in LIN Recessive State IS_rec – 1.3 2.2 mA Recessive state, without RL; VTxD = VCC; ICC = 100 µA P_5.3.1 Current Consumption in Normal Mode at VS in LIN Dominant State IS_dom – 1.8 3.2 mA Dominant state, without RL; VTxD = 0 V; ICC = 100 µA P_5.3.2 Current Consumption at VS in Sleep Mode IS_sleep – 8 12 µA Sleep Mode, VLIN = VS; VCC = 0 V P_5.3.3 Current Consumption at VS in Stop Mode IS_stop ––4 0 µ A S t o p M o d e ; VLIN = VS; no load on VCC P_5.3.4 Current Consumption in Sleep Mode, Bus Shorted to Ground IS_sleep_short 6 40 72 µA Sleep Mode, VLIN = 0 V VCC = 0 V P_5.3.5

Data Sheet 18 Rev. 1.1, 2014-04-01

5.4 Electrical Character istics EN and WK Pins

5.5 Power Up, Power Down

Table 8 Electrical Characteristics: Mode Pins 7V< VS <2 7V , Tj = -40 °C +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. EN Pin HIGH Level Input Voltage VEN,H 2––V – P_5.4.6 LOW Level Input Voltage VEN,L ––0 . 8 V – P_5.4.7 EN Input Hysteresis VEN,hys –0 . 3 –V – P_5.4.8 EN pull-down Resistance REN 20 40 80 k Ω – P_5.4.9 Filter Time for Mode Change tmode1 50 – 150 µs – P_5.4.10 TxD low delay time tmode2 0 – 50 µs Stop Mode transfer P_5.4.11 TxD high time tmode3 10 – – µs Stop Mode transfer P_5.4.12 Time for Mode Change from Stop or Sleep Mode to Normal Operation Mode tMode_NO –1 0 –µ s 1)Transfer to Normal Operation Mode 1) Not subject to production test, specified by design P_5.4.1 Time for Flash Mode activation tfl1 25 – 50 µs 1) EN pin low P_5.4.13 TxD Time for Flash Mode activation tfl2 5––µ s 1) P_5.4.14 TxD Time for Flash Mode activation tfl3 10 – – µs 1) P_5.4.15 WK Pin High Level Input Voltage VWK,H VS - 1 – VS + 3 V VS = 13.5 V P_5.4.16 Low Level Input Voltage VWK,L -0.3 – VS - 4 V VS = 13.5 V P_5.4.17 Pull-up Current IWK,PU -60 -30 -3 µA VWK = 0V VS = 13.5 V P_5.4.18 High Level Leakage Current IWK,L -5 – 5 µA VS = 0 V; VWK = 40 V P_5.4.19 Dominant Time for Wake-up tWK 30 – 150 µs – P_5.4.20 Table 9 Electrical Characteristics: Power-up Tj = -40 °C +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Vs Pin VS Power-up Voltage Threshold VS,PU ––3 . 5 V ICC =4 0m A , VCC >3 . 0V P_5.5.21

Data Sheet 19 Rev. 1.1, 2014-04-01

6 Voltage Regulator

6.1 Description of Voltage Regulator

The TLE8458G has a monolithic integrated voltage regu lator dedicated for microcontroller supplies under harsh automotive environment conditions. Due to its ultra low cu rrent consumption, the TLE8458 is perfectly suited for applications permanently connected to a battery. Additi onally, the regulator is swit ched off in Sleep Mode to achieve a very low quiescent current. The TLE8458 is equipped with protection functions against overloading, short circuits, and over temperature.

6.2 Electrical Characteristi cs of the Voltage Regulator

Table 10 Electrical Characteristics: Voltage Regulator VS = 5.5 V to 13.5 V, Tj = -40 °C +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Output Voltage for TLE8458G VCC,5 4 . 95 5 . 1V 1 m A < ICC < 50 mA;

5.5 V < VS <1 8V

P_6.2.1 Output Voltage for TLE8458G VCC,5 4 . 95 5 . 1V ICC = 10 mA;

5.5 V < VS <4 0V

P_6.2.8 Output Voltage for TLE8458GV33 VCC,3.3 3.234 3.3 3.366 V 1 mA < ICC < 50 mA; P_6.2.2 Output Voltage for TLE8458GV33 VCC,3.3 3.234 3.3 3.366 V ICC = 10 mA; P_6.2.9 Output Current Limitation TLE8458G ICC,lim 60 – – mA VCC,5 > 4.5V VS =1 3 . 5V P_6.2.3 Output Current Limitation TLE8458GV33 ICC,lim 50 – – mA VCC3,3 > 2.8V VS =1 3 . 5V P_6.2.10 Output Voltage Drop VDR – 250 500 mV ICC = 40 mA1) 1) Measured when the output voltage has drop ped 100 mV from the nominal value obtained at VS =1 3 . 5V P_6.2.4 Load Regulation ∆VCC,LO –2 5 5 0 m V 1 m A < ICC < 50 mA VS =13.5 V P_6.2.5 Line Regulation ∆VCC,LI –2 5 5 0 m V ICC = 1 mA; 6V < VS < 28 V P_6.2.6 Power Supply Ripple Rejection PSRR –6 0 –d B f = 100 Hz; Vr = 0.5 Vpp2)3) 2) Voltage of ripple Vr is 0.5 V peak-to-peak 3) Not subject to production test; specified by design. P_6.2.7

Data Sheet 20 Rev. 1.1, 2014-04-01

7 LIN Transceiver

7.1 Functional Description

The LIN Bus is a single wire, bi-direc tional bus, used for in-vehicle networks. The LIN Transceiver implemented inside the TLE8458 is the interface between the microcontroller and the physical LIN Bus. (see Figure 1 and Figure 15). The digital output data from the microcontroller are driven to the LIN bus via the TxD input pin on the TLE8458. The transmit data stream on the TxD input is converted to a LIN bus signal with optimized slew rate to minimize the EME level of the LIN network. The RxD outpu t sends back the information from the LIN bus to the microcontroller. The receiver has an integrated filter network to suppress noise on the LIN Bus and to increase the EMI (Electro Magnetic Immunity) level of the transceiver. Two logical states are possible on the LIN bus according to the LIN Specification 2.1 (see Figure 10): In dominant state, the voltage on the LIN bus is set close to the GND level. In recessive state, the voltage on the LIN bus is set close to the supply voltage VS. By setting the TxD input of the TLE8458 to LOW the transceiver generates a dominant level on the LIN interface pin. The RxD output reads back the signal on the LIN bus and indicates a dominant LIN bus signal with a logical LOW to the microcontroller. Setting the TxD pin to HIGH the transceiver TLE8458 sets the LIN interface pin LIN to the recessive level, at the same time the recessive level on the LIN bus is indicated by a logical “High” on the RxD output. Every LIN network consists of a master node and one or more slave nodes. To configure the TLE8458 for master node applications, a resist or in the range of 1 k Ω and a reverse diode must be connected between the LIN bus and the power supply VS. (see Figure 15). Figure 10 LIN Bus Signals t TxD VCC Recessive LIN VS t t RxD Dominant VCC Recessive Recessive Dominant Recessive RecessiveDominantRecessive

Data Sheet 21 Rev. 1.1, 2014-04-01

7.1.1 Undervoltage Detection

A dropping power supply VS on a local ECU can effect the communication of the whole LIN network. To avoid any blocking of the LIN network by a local ECU the TLE8458 has an integrated Power-On reset at the supply VS and an undervoltage detection at the supply VS. In case the supply voltage VS is dropping below the Power-On reset level VS < VS,UV,PON, the TLE8458 changes the operation mode to Stand-By mode. In Stand-By mode the output stage of the TLE8458 is disabled and no communication to the LIN bus is possible. The internal bus termination remains active as well as the VCC output voltage. (see Figure 1 and Figure 11). In Stand-By mode the RxD pin indicates the low power supply condition with a logical HIGH signal. Setting the EN pin to logical HIGH changes the operation mode back to Normal Operation mode. In case the supply voltage VS is dropping below the undervoltage reset level VS < VSUV (see Figure 11), the TLE8458 disables the output and receiver stages. This feature secures the communication on the LIN bus. If the power supply VS reaches a higher level as the undervoltage reset level VS > VSUV the TLE8458 continues with normal operation. A mode change on ly applies if the power supply VS drops below the power on reset level (VS < VS,UV,PON). Figure 11 Under-Voltage Detection Supply voltage Vs Power on reset level VS,UV,PON Power On reset Normal Operation Mode Reset and Communication blocked Stand-By Mode Blanking time tUV Supply voltage Vs Power on reset level VS,UV,PON Normal Operation Mode Communication blocked Blanking time tUV Under Voltage level VSUV Normal Operation Mode Under Voltage Detection VS

Data Sheet 22 Rev. 1.1, 2014-04-01

7.1.2 TxD Time-Out

If the TxD signal is dominant for the time t >ttimeout, the TxD time-out function deactivates the LIN transmitter output stage. The device remains in recessive state. The TxD time-out functions prevents the LIN bus from being blocked by a permanent LOW signal on the TxD pin, caused by a failure. The transmit ter output stage is released again, after a rising edge on the TxD pin has been detected (see Figure 12). Figure 12 TxD Time-Out function

7.1.3 LIN Specifications

The LIN network is standardized by international regulations. The devices TLE8458G and the TLE8458GV33 are compliant to the specification LIN 2.1. The physical layer specification LIN 2.1 is a super set of the previous LIN specifications, like LIN 2.0 or LIN 1.3. The TLE8458G and the TLE8458GV33 have been qualified according to the LIN 2.1 standard, conformance test results are available on request. TxD LIN ttorecttimeout Normal Communication Normal Communication TxD Time-Out due to microcontroller error Release after TxD Time-out Recovery of the microcontroller error t t

Data Sheet 23 Rev. 1.1, 2014-04-01

7.2 Electrical Characteris tics of the LIN Transceiver

Table 11 Electrical Characteristics: LIN Transceiver Supply VS = 7 V to 27 V, Tj = -40 °C +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Voltage Supply Undervoltage switch-off Vsuv 4–5V – P_7.2.1 Power-On Reset Level VS,UV,PON 2–4V 1) P_7.2.52 Blanking Time for Under- Voltage switch-off tuv –1 0 –µ s 1) 1) Not subject to production test; specified by design. P_7.2.2 Table 12 Electrical Characteristics: LIN Transceiver VS = 7 V to 27 V, Tj = -40 °C +150 °C, RL = 500 Ω, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Receiver Output (RxD pin) HIGH Level Output Voltage VRxD,H 0.8 × VCC ––V IRxD = -1.6 mA; Vbus = VS P_7.2.3 LOW Level Output Voltage VRxD,L ––0 . 2 × VCC V IRxD = 1.6 mA Vbus = 0 V P_7.2.4 Transmission Input (TxD pin) HIGH Level Input Voltage VTxD,H 0.7 × VCC – – V Recessive State P_7.2.5 TxD Input Hysteresis VTxD,hys – 0.12 × VCC –m V – P_7.2.6 LOW Level Input Voltage VTxD,L ––0 . 3 × VCC V Dominant State P_7.2.7 TxD Pull-down Resistance RTxD – 300 – k Ω VTxD = 0 V P_7.2.8 TxD Low Level Current (Standby Mode, after Wake-up via WK) ITxD,L 1.5 3 10 mA VTxD = 0.9 V P_7.2.9

Data Sheet 24 Rev. 1.1, 2014-04-01 LIN Bus Receiver (LIN Pin) Receiver Threshold Voltage, Recessive to Dominant Edge VBus,rd 0.4 × VS 0.45 × VS –V VBus,rec < VBus < 27 V P_7.2.10 Receiver Dominant State VBus,dom ––0 . 4 × VS V LIN2.1 Param. 17 P_7.2.11 Receiver Threshold Voltage, Dominant to Recessive Edge VBus,dr – 0.55 × VS 0.60 × VS V VBus,rec < VBus < 27 V P_7.2.12 Receiver Recessive State VBus,rec 0.6 × VS – – V LIN2.1 Param 18 P_7.2.13 Receiver Center Voltage VBus,c 0.475 × VS 0.5 × VS 0.525 VS V LIN2.1 Param 19 P_7.2.14 Receiver Hysteresis VBus,hys 0.07 × VS 0.1 × VS 0.175 × VS V Vbus,hys = Vbus,rec - Vbus,dom LIN2.1 Param 20 P_7.2.15 Wake-up Threshold Voltage VBus,wk 0.40 × VS 0.5 × VS 0.6 × VS V– P_7.2.16 Dominant Time for Bus Wake-up tWK,Bus 30 – 150 µs – P_7.2.17 LIN Bus Transmitter (LIN Pin) Bus Recessive Output Voltage VBUS,ro 0.8 × VS – VS V VTxD = high Level P_7.2.18 Bus Dominant Output Voltage VBUS,do ––1 . 2 V VTxD = 0 V; P_7.2.53 Bus Dominant Output Voltage VBUS,do ––0 . 2 x VS V VTxD = 0 V; 7.3 V ≤ VS ≤ 10.0 V; P_7.2.19 Bus Dominant Output Voltage VBUS,do ––2 . 0 V VTxD = 0 V; 10.0 V ≤ VS ≤ 18.0 V; P_7.2.20 Bus Short Circuit Current IBUS,sc 40 100 150 mA VBUS = 13.5 V; LIN2.1 Param 12 P_7.2.23 Leakage Current Loss of Ground IBUS,lk -1000 -450 0 µA VS = 0 V; VBUS = -12 V; LIN2.1 Param 15 P_7.2.24 Leakage Current Loss of Battery IBUS,lk ––5µ A VS = 0 V; VBUS = 18 V; LIN2.1 Param 16 P_7.2.25 Leakage Current IBUS,lk -1 – – mA VS = 18 V; VBUS = 0 V; LIN2.1 Param 13 P_7.2.26 Leakage Current Driver Off IBUS,lk ––5µ A VS = 8 V; VBUS = 18 V; LIN2.1 Param 14 P_7.2.27 Bus Pull-up Resistance RBUS 20 30 47 k Ω Normal Mode LIN2.1 Param 26 P_7.2.28 Table 12 Electrical Characteristics: LIN Transceiver (cont’d) VS = 7 V to 27 V, Tj = -40 °C +150 °C, RL = 500 Ω, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max.

Data Sheet 25 Rev. 1.1, 2014-04-01 LIN Output Current IBUS -60 -30 -5 µA Sleep Mode VS = 12 V; EN = 0 V; VLIN = 0 V P_7.2.29 LIN Input Capacitance CBUS 15 pF 1) P_7.2.55 Receiver propagation delay bus dominant to RxD LOW td(L),R –16µ s CRxD = 20 pF; LIN2.1 Param 31 P_7.2.38 Receiver propagation delay bus recessive to RxD HIGH td(H),R –16µ s CRxD = 20 pF; LIN2.1 Param 31 P_7.2.39 Receiver delay symmetry tsym,R -2 – 2 µs tsym,R = td(L),R - td(H),R; LIN2.1 Param 32 P_7.2.40 TxD Dominant Time Out ttimeout 61 2 2 0 m s VTxD = 0 V P_7.2.44 TxD Dominant Time Out Recovery Time ttorec –1 0 –µ s 1) P_7.2.45 Duty Cycle D1 (For worst case at 20 kbit/s) LIN2.1 Normal Slope D1 0.396 – – 2) THRec(max) = 0.744 × VS; THDom(max) = 0.581 × VS; VS = 7.0 … 18 V; tbit = 50 µs; D1 = tbus_rec(min)/2 tbit; LIN2.1 Param 27 P_7.2.46 Duty Cycle D2 (for worst case at 20 kbit/s) LIN2.1 Normal Slope D 2 ––0 . 5 8 1 2)THRec(min.) = 0.422 × VS; THDom(min.) = 0.284 × VS; VS = 7.6 … 18 V; tbit = 50 µs; D2 = tbus_rec(max)/2 tbit; LIN2.1 Param 28 P_7.2.47 1) Not subject to production test, specified by design. 2) Bus load conditions concerning LIN spec 2.1 CLIN, RLIN = 1 nF, 1 kΩ / 6.8 nF, 660 Ω / 10 nF, 500 Ω Table 12 Electrical Characteristics: LIN Transceiver (cont’d) VS = 7 V to 27 V, Tj = -40 °C +150 °C, RL = 500 Ω, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max.

Application Information

Data Sheet 27 Rev. 1.1, 2014-04-01

8 Application Information

Note: The following information is given as a hint for the implementation of the device only and should not be regarded as a description or warranty of a certain functionality, condition or quality o f the device. Figure 15 Application Example Note: This is a simplified example of an application circuit. The function must be verified in the actual application. ECU 1 TxD GND TLE7259 -3GE Bus 100 nF XC22XX GND Master Node WKINH VS e. g. TLE 4263 VQ 5 V GND INH 100 nF µF 22 µFVI 1 kΩ 1 nF 100 nF RxD EN TxD GND TLE8458 G LIN XC22XX GND Slave Node WK 100 nF VS RxD EN VBat LIN Bus µF 220 pF Vcc µF 100 nF ECU X 10 kΩ 10 kΩ

Data Sheet 28 Rev. 1.1, 2014-04-01

8.1 ESD Tests

Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330Ω) have been performed. The results and test conditions are available in a separate test report (see Table 13).

8.1.1 EMC Measurement

The EMC performance has been qualified by an external test house according to the LIN EMC Test specification Version 1.0 (August 1, 2004). For t he DPI measurements according to the LI N EMC Test Specification, Section 4.2 (ISO62132 part 1: 2006, ISO62132 part 4: 2006) the verification limit for the output voltage VCC, was set to a limit of +/- 100 mV. External test reports are available on request.

8.2 Pin Compatibility to Stand-Alone LIN transceivers

The TLE8458G is pin - and function compatible to the single LIN transceivers like the TLE7259-3GE (see Figure 16). Instead of the INH output pin on the single LIN transceiver TLE7259-3GE the VCC power supply output can be connected to the external microcontroller. The TLE8458G provides the same operation modes and features as single LIN transceiver TLE7259-3GE. Figure 16 Pinning of TLE8458G versus the TLE7259-3GE Table 13 ESD “Gun test” Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Performed Test ESD at VS, LIN versus GND VESD,GUN -10 – 10 kV GUN 1) 1) ESD susceptibility “ESD GUN” according LIN EMC Test Specification, Section 3.4.3 (IEC 61000-4-2:2001-12), tested by external test house (IBEE Zwickau, EMC Test report Nr. 05-12-13a) P_8.1.1 ESD at WK PIN VESD,GUN -6 – 6 kV GUN 1) P_8.1.1 RxD 1 EN WK TxD VS LIN GND VCC RxD 1 EN WK TxD VS LIN GND INH TLE8458G TLE7259-3GE

Data Sheet 29 Rev. 1.1, 2014-04-01

9 Package Outlines

Figure 17 PG-DSO-8-16 (SO-8 Standard, Green (RoHS compliant)) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). +0.06 0.19 0.35 x 45˚ 1)-0.24 C 8 MAX. 0.64 ±0.26 ±0.25 0.2 8xM C 1.27 +0.10.41

0.2 M A

-0.06 1.75 MAX. (1.45) ±0.070.175 B 8xB Index Marking 5-0.2 A 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area GPS01181 0.1 For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm

Revision History

Data Sheet 30 Rev. 1.1, 2014-04-01 Revision Date Changes 1.1 2014-04-01 All pages: - Editorial changes, updated with latest Infineon style guide Updated compatibility with stand alone transceiver with TLE7259-3G Updated condition for Parameter P_5.3.4: no load on VCC Removed device versions TLE8458GU and -GUV33, references and description Removed LIN Duty Cycle parameters D3 and D4 (only applicatble to -GU and -GUV33) Chapter 8.1: Updated ESD and EMC references to the latest IBEE test report 1.02 2010-03-08 all pages: Editorial changes table 10: changed Output current limitation min. to 60 mA table 11: changed power on reset values figure 15: deleted 2 resistors 1.01 2009-04-28 Editorial Change to the data sheet Update table 13 on page 30. P_8.1.1 performed test changed from: “ESD at LIN Pin” to: “ESD at VS, LIN versus GND” 1.0 2009-03-23 Initial data sheet

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© 2014 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life- support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.