3D5-SBC-AML-ADN KONTRON | Alldatasheet

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3.5" Single Board Computer with Intel® Atom® x7000(R)E Series, Intel® Core™ i3 N-Series & Intel® N-Series Processors 3.5”-SBC-AML/ADN Upgraded processing and graphics performance + faster AI inference capability Next-gen DDR5 memory support with up to 4800 MT/s data transfer rate Time Coordinated Computing / Time Sensitive Networking for real-time communication Additional Rear I/O expansion via board-to-board connector DP Alt Mode over USB-C support to carry video / audio, data & power over a single port

2 www.kontron.com 3.5”-SBC-AML/ADNProduct Highlights 3.5" Single Board Computer w/ Intel® Atom® x7000(R)E Series, Core™ i3 N-Series & Intel® N-Series Intel® Atom® x7000(R)E Series Processors Intel® Core™ i3 N-Series Processors Intel® N-Series Processors 1x DDR5 SO-DIMM memory socket 2x 2.5 GbE LAN for Ethernet 3x DP (2x full DP, 1x USB-C), 1x LVDS / eDP for 3-display 3x USB 3.2 Gen 2 / Gen 1 (2x Type A, 1x Type C), 3x USB 2.0 4x RS232/422/485 for serial devices 4x DI, 4x DO for device / signal control 1x SATA 3.0 for storage device 1x M.2 Key B for SSD, WWAN or other possible expansion 1x M.2 Key E for WLAN, Bluetooth or other expansion 1x M.2 Key M for SSD 1x Board-to-board connector for additional rear I/Os TPM 2.0 support Extreme operating temperature range: -40 °C ~ 85 °C Block Diagram 3.5"-SBC-AML/ADN is a 3.5" single board computer powered by Intel® Atom® x7000RE Series (codenamed Amston Lake), Intel® Atom® x7000E Series, Intel® Core™ i3 N-Series and Intel® N-Series (codenamed Alder Lake N) processors integrated with Intel® UHD Graphics Gen12 as well as support for a next-gen high-speed DDR5 memory. Thus, it can deliver upgraded performance, enhanced media transcoding and faster AI inference. Partial models support time sensitive networking (TSN) for real-time communication, making it an ideal baseboard to be integrated into a compact Io T edge system or an all-in-one solution for a variety of applications, such as smart retail, industrial automation, healthcare, video processing and office automation. USB 2.0 DP USB-C 3.2 Gen 2 / Gen 1 DPDP

2.5 GbE

USB 3.2 Gen 2 USB 3.2 Gen 2 Internal Connector Front / Rear Panel Connector Intel® Atom® x7000(R)E Series, Intel® Core™ i3 N-Series& Intel® N-Series Processors 1x SO-DIMM Slot DDR5 1x LVDS / eDP Connector Chrontel CH7513A eDP (DDIA)LVDS (24-bit, 2-ch) 1x SATA Connector SATA 3.0 1x M.2 Key B Slot PCIe x1 / USB 2.0 / UIM 1x M.2 Key M Slot SATA 3.0 / PCIe x1 (optional) TPM 2.0 Infineon SLB 9672 SPI TSI 92HD91B HDAL-in/L-out /M-in Audio Header 2x SPKR-out Wafer SPKR-out S/PDIF Wafer S/PDIF-out

9 V ~ 36 V DC

2x USB 3.2 Gen 2 Type A Connector USB 3.2 Gen 2 2x DP Connector DDIB / TCP1 1x RJ45 Connector

2.5 GbEPCIe Intel®

2.5 GbEPCIe

1x USB 2.0 Type A Connector USB 2.0 1x USB 3.2 Gen 2/1 Type C Connector TCP0 Intel® I226-V/IT 2x RS232/ Transceiver 2x COM Port Wafer 2x RS232/ 2x UART Nuvoton NCT5124D eSPI 1x M.2 Key E Slot PCIe x1 2x USB 2.0 Header USB 2.0 Board-to- board Connector PCIe x1 / SM Bus / I2C / UART / GSPI Power: 12 V, 5 V & 3.3 V optional route USB 2.0 / (CNVi) optional route

3www.kontron.com 3.5”-SBC-AML/ADNTechnical Information Intel® Atom® x7211RE (Dual Core, 6M Cache, 1.0 / 3.2 GHz, 6 W TDP) Intel® Atom® x7433RE (Quad Core, 6M Cache, 1.5 / 3.4 GHz, 9 W TDP) Intel® Atom® x7835RE (Octa Core, 6M Cache, 1.3 / 3.6 GHz, 12 W TDP) Intel® Core™ i3-N305 (Octa Core, 6M Cache, 1.8 / 3.8 GHz, 9 W ø 15 W TDP) Intel® N97 (Quad Core, 6M Cache, 2.0 / 3.6 GHz, 12 W TDP) Intel® Atom® x7213RE (Dual Core, 6M Cache, 2.0 / 3.4 GHz, 9 W TDP) Intel® Atom® x7211E (Dual Core, 6M Cache, 1.0 / 3.2 GHz, 6 W TDP) Intel® Atom® x7213E (Dual Core, 6M Cache, 1.7 / 3.2 GHz, 10 W TDP) Intel® Atom® x7425E (Quad Core, 6M Cache, 1.5 / 3.4 GHz, 12 W TDP) Intel® N50 (Dual Core, 6M Cache, 1.0 / 3.4 GHz, 6 W TDP) Intel® N200 (Quad Core, 6M Cache, 1.0 / 3.7 GHz, 6 W TDP) 1x DDR5 4800 SO-DIMM up to 16 GByte Intel® UHD Graphics Gen12 1x LVDS / eDP (24-bit, 2-ch, 1920 x 1200 @ 60 Hz / 4096 x 2160 @ 60 Hz) 3x DP (4096 x 2160 @ 60 Hz, 2x Full-size DP on rear, 1x DP USB-C on rear) Triple Display TSI 92HD91B 1x Speaker-out (Stereo, 3 W, by header) 1x Line-in (by header) 1x Line-out (by header) 1x Mic-in (by header) 1x S/PDIF Out (by header) 2x 2.5 GbE LAN (RJ45 on rear, Intel® I226-V/IT, TSN support*) 2x USB 3.2 Gen 2 Type A (on rear) 1x USB 3.2 Gen 2 Type C (on rear, w/ DP & PD 5 V / 3 A, except Atom® x7000RE) 1x USB 3.2 Gen 1 Type C (on rear, w/ DP & PD 5 V / 3 A, only Atom® x7000RE) 3x USB 2.0 (1x Type A on rear, 2x by header (optl. routed to B2B connector)) 4x RS232/422/485 (2x Tx/Rx only in RS232 signal, by header) 4x DI (by wafer) 4x DO (by wafer) 1x SATA 3.0 1x M.2 Key B (Type 2242 / 3042 / 3052 / 2280, w/ PCIe x1 / USB 2.0 / UIM) 1x M.2 Key E (Type 2230, w/ PCIe x1 (optl. routed to B2B) / USB 2.0 / CNVi**) 1x M.2 Key M (Type 2280, w/ SATA 3.0 (default) / PCIe x1 (optional)) 1x SIM Card Holder (by header) 1x PCIe x1 (default) / 2x PCIe x1 (optional, 1x replacing PCIe in M.2 Key E) 1x SM Bus 1x I2C 1x UART 1x GSPI 2x USB 2.0 (optional, replacing the route to 2x internal USB 2.0) DC 9 V ~ 36 V 1x4-pin pitch 3.0 mm Wafer AMI uEFI BIOS w/ 256 Mb SPI Flash Programmable WDT to generate system reset event Voltages, T emperatures Processor integrated RTC TPM 2.0 Support (Infineon SLB 9672) 1x Power Buttom (on rear) 1x Power LED (Green, on rear) 1x Standby LED (Yellow, on rear) 1x Internal Buzzer 1x Header for Reset Button, M.2 Key M LED & External Buzzer 1x Header for Power Button, Power LED & SM Bus 2x Header for 2.5 GbE LAN LED 1x Wafer for Smart Fan Windows 11, Windows 10, Linux ECX (146 mm x 105 mm / 5.75" x 4.13") 0 °C~ 60 °C / 32 °F ~ 140 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme) 0 % ~ 95 % CE Class B, FCC Class B, ICES Class B, UKCA, UR (UL Recognized) PROCESSOR (STANDARD) PROCESSOR (PROJECT BASE) MEMORY GRAPHICS DISPLAY INTERFACE MULTIPLE DISPLAY AUDIO CODEC AUDIO INTERFACE ETHERNET USB SERIAL PORT OTHER I/Os SATA M.2 SIM CARD HOLDER BOARD-TO-BOARD CONNECTOR INPUT VOLTAGE CONNECTOR BIOS WATCHDOG H/W MONITOR REAL TIME CLOCK SECURITY BUTTON, SWITCH & INDICATOR FP HEADER FAN OS SUPPORT DIMENSION (L x W) OPERATING TEMPERATURE STORAGE TEMPERATURE HUMIDITY EMC & SAFETY SYSTEM VIDEO AUDIO NETWORK CONNECTION PERIPHERAL CONNECTION STORAGE & EXPANSION POWER FIRMWARE SYSTEM CONTROL & MONITORING COOLING SOFTWARE MECHANICAL ENVIRONMENTAL COMPLIANCE * TSN support for models with Atom® processors ** Atom® x7000RE Series processors do not support CNVi

3.5”-SBC-AML/ADN Global Headquarters Kontron Europe GmbH Gutenbergstraße 2

85737 Ismaning, Germany

Tel.: + 49 821 4086-0 info@kontron.com www.kontron.com Copyri ght © 2024 Kontron. All rights reserved. All data is for information purpose s only and not guaranteed for legal purpose s. Information has been carefully checked and is believed to be accurate;however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.Specifications are subject to change without notice. 3.5”-SBC-AML/ADN- 20241219 - b my

Ordering Information

ORDERING CODE* 3.5"-SBC-AML-0-x7211RE-XT 3.5"-SBC-AML-1-x7433RE-XT 3.5"-SBC-AML-2-x7835RE-XT 3.5"-SBC-ADN-0-N97 3.5”-SBC-ADN-3-i3-N305 * For ordering code for APAC, contact your local account manager. (Contact your account manager for other processor variants or other operating temperature ranges.) Intel® Atom® x7211RE, Intel® I226-IT, Operating Temperature: -40 °C ~ 85 °C Intel® Atom® x7433RE, Intel® I226-IT, Operating Temperature: -40 °C ~ 85 °C Intel® Atom® x7835RE, Intel® I226-IT, Operating Temperature: -40 °C ~ 85 °C Intel® N97, Intel® I226-V, Operating Temperature: 0 °C ~ 60 °C Intel® Core™ i3-N305, Intel® I226-V, Operating Temperature: 0 °C ~ 60 °C Accessories DC IN CABLE* SATA CABLE SATA POWER CABLE COM PORT CABLE DIO CABLE USB CABLE (2 PORT) AUDIO CABLE ADAPTER SCREW COPPER PILLAR KIT HEATSINK I/O CARD (3.5"-eIO-GPA-0) I/O CARD (3.5"-eIO-GPA-1) I/O CARD (3.5"-eIO-GPA-2-XT) EMEA / AMERICA 1064-2433 1064-2431 1064-2430 1064-2427 1065-3137 1069-7893 1070-1245 1069-3055 TBD 1070-1238 1069-6159 1069-6922 1073-9682 2.5 mm DC Jack to H-300F-XX 1x4P 3.0 mm pitch, L = 300 mm 1x7p connector with lock, pitch = 1.27 mm, L = 460 mm 1x4P 2.0 mm pitch to SATA 1x15P 1.27 mm pitch, L = 460 mm 1x10P 1.25 mm pitch to DB9 connector, L = 350 mm D-SUB-9P (Female) to MX51021-10P 1x10P 1.25 mm pitch, L = 200 mm 2x5P 2.0 mm pitch to 2x USB 2.0 Type A female w/ bracket, L = 27 cm 2x5P 1.25 mm pitch to 3x 3.5 mm ear phone jack, L = 400 mm Input: AC 90 V ~ 264 V, output: DC 12 V @ 5 A Max. 60 W 4x 39.6 mm pillar, 3x 19 mm pillar, 4x 15 mm screw, 1x 5 mm screw Aluminum heatsink w/ thermal pad & 2x screw 2x DP, 2x 2.5 GbE, 1x UART, 1x I2C, 1x SMBus, 1x GSPI, 1x DC In, 0 ~ 60 °C 2x DP, 2x 2.5 GbE, 1x UART, 1x I2C, 1x SMBus, 1x GSPI, 0 ~ 60 °C 2x DP, 2x 2.5 GbE, 1x UART, 1x I2C, 1x SMBus, 1x GSPI, 1x DC In, -40~85°C ARTICLE DESCRIPTIONNO. (*: standard supplied accessories for single-piece box packing) APAC 0C5020000004220L 0C5020000004240L 0C5020000004230L 0C5020000005130L 0C5020000003360L 0C5020003000010L 0C5020000005840L 0I0902GST60A101L 0ZHK35SBC0000001 0ZHK35SEKL000001 B35EGPA0-001001T B35EGPA0-011001T B35EGPAI-021000T ORDERING CODE Starter Kits STARTER KIT FOR 3.5"-SBC-AML/ADN ARTICLE EMEA / AMERICA 1070-4932 Including above accessories table No. 1 ~ 10

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