COME-BCL6 KONTRON | Alldatasheet
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COMe-bCL6(R E2S) COM Express ® Basic Type 6 with 8th/9th Generation Intel ® Core™ / Xeon ® Processors Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH Up to 128 GByte DDR4 non-ECC/ECC memory Optional NVMe SSD onboard Industrial grade versions
// 2 www.kontron.com TECHNICAL INFORMATION CPU VARIANTS COMPLIANCE COM Express® basic, Pin-out Type 6 DIMENSIONS (H X W) 125 x 95 mm CPU Intel® 8th/9th Generation Core™ series / Xeon® E family For details see table (CPU variants) given below CHIPSET Intel® Mobile CM246/Intel® Mobile QM370 MAIN MEMORY Up to 4x DDR4-2666 SO-DIMM with up to 128 GByte (non-ECC/ECC) (3rd/4th socket on request) GRAPHICS CONTROLLER Intel® UHD Graphics P630 for Xeon® processor Intel® UHD Graphics 630 for Core™ processors Intel® UHD Graphics 610 for Celeron® processors ETHERNET CONTROLLER Intel® I219LM ETHERNET 10/100/1000 MBit Ethernet STORAGE 4x SATA 6Gb/s FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 8x PCIe x1, 1x PEG x16 DISPLAY DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit USB 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 SERIAL 2x serial interface (RX/TX only) AUDIO Intel® High Definition Audio OTHER FEATURES SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe SPECIAL FEATURES POSCAP capacitors, Trusted Platfom Module TPM 2.0, 4k Resolutions, Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants) FEATURES ON REQUEST vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset, 3rd/4th DDR4 SO-DIMM socket, NVMe SSD, Security Chip POWER MANAGEMENT ACPI 6.0 POWER SUPPLY 8.5 V – 20 V Wide Range, Single Supply Power BIOS AMI Aptio V OPERATING SYSTEM Windows® 10, Linux, VxWorks TEMPERATURE Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) 8th GENERATION CPU E-2176M i7-8850H i5-8400H i3-8100H CORES 6 6 4 4 TDP 45 W/35 W 45 W/35 W 45 W/35 W 45 W/35 W CACHE 12 MByte 9 MByte 8 MByte 6 MByte 9th GENERATION CPU E-2276ME E-2276ML E-2254ME E-2254ML i7-9850HE i7-9850HL i3-9100HL G4930E G4932E CORES 6 6 4 4 6 6 4 2 2 TDP 45 W/35 W 25 W 45 W/35 W 25 W 45 W/35 W 25 W 25 W 35 W 25 W CACHE 12 MByte 12 MByte 8 MByte 8 MByte 9 MByte 9 MByte 6 MByte 2 MByte 2 MByte
// 3 www.kontron.com BLOCK DIAGRAM LPC PCIe LVDS VGA SMB GPIO Ctrl Mgmt HDA USB SATA#0-3 SPI Intel® Mobile CM246 / QM370 PCH GPIO PCIe #6-7 PEG x16 USB #0-3 (USB3.1) PwrCtrl SysMgmt PCIe USB #0-3 (USB2.0) PWM FAN2 I2C SER0 SER1 eDP x2 USB #4-7 (USB 2.0) PCIe #0-5 Intel® 8th/9th Generation Core / Intel® Xeon E Family Coffee Lake-H (Refresh) Series LID Sleep SPI BIOS Flash Connector OptionStandard component LAN Embedded Controller HWM Gen9 iGFX FAN1 eDP2 LVDS COM Express® connector AB – Pin-out Type 6 LAN Intel® I219LM VCC 5VSB VBAT HWM SMB Power sequencing Watchdog LPC2I2C GPIO Buffer I2C S5eco EEPROM TPM UART COM Express® connector CD – Pin-out Type 6 DDR4 SODIMM ECC/non-ECC VCC DDR4 SODIMM ECC/non-ECC xHCI DP++ CONFIG x16/x8/x4 PEG Config CPLD JTAG SPD GbE MAC Security Chip xHCI DP2 VGA 2nd SODIMM 2nd SODIMM NVMe VARIANTS PART NO. CPU PCH SO-DIMM FLASH OP. TEMPERATURE 38034-0000-27-6 E-2176M CM246 non-ECC/ECC - 0 °C - 60 °C 38034-0000-26-7 i7-8850H QM370 non-ECC - 0 °C - 60 °C 38034-0000-25-5 i5-8400H QM370 non-ECC - 0 °C - 60 °C 38034-0000-30-3 i3-8100H QM370 non-ECC - 0 °C - 60 °C 38034-0000-28-6 E-2276ME CM246 non-ECC/ECC - 0 °C - 60 °C 38034-0000-20-6 E-2276ML CM246 non-ECC/ECC - 0 °C - 60 °C 38034-0000-26-4 E-2254ME CM246 non-ECC/ECC - 0 °C - 60 °C 38034-0000-17-4 E-2254ML CM246 non-ECC/ECC - 0 °C - 60 °C 38034-0000-27-7 i7-9850HE QM370 non-ECC - 0 °C - 60 °C 38034-0000-19-7 i7-9850HL QM370 non-ECC - 0 °C - 60 °C 38034-0000-16-3 i3-9100HL QM370 non-ECC - 0 °C - 60 °C 38034-0000-24-2 G4930E QM370 non-ECC - 0 °C - 60 °C 38034-0000-19-2 G4932E QM370 non-ECC - 0 °C - 60 °C 38035-0000-27-6 E-2176M CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-26-7 i7-8850H QM370 non-ECC - -40 °C - 85 °C 38035-0000-25-5 i5-8400H QM370 non-ECC - -40 °C - 85 °C 38035-0000-30-3 i3-8100H CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-28-6 E-2276ME CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-20-6 E-2276ML CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-26-4 E-2254ME CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-17-4 E-2254ML CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-27-7 i7-9850HE QM370 non-ECC - -40 °C - 85 °C 38035-0000-19-7 i7-9850HL QM370 non-ECC - -40 °C - 85 °C 38035-0000-16-3 i3-9100HL CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-24-2 G4930E CM246 non-ECC/ECC - -40 °C - 85 °C 38035-0000-19-2 G4932E CM246 non-ECC/ECC - -40 °C - 85 °C
// 4 GLOBAL HEADQUARTERS Kontron Europe GmbH Gutenbergstraße 2
85737 Ismaning, Germany
T el.: + 49 821 4086-0 Fax: + 49 821 4086-111 info@kontron.com www.kontron.com CARRIER COOLING ARTICLE PART NO. DESCRIPTION COMe EVAL CARRIER2 T6 38116-0000-00-5 COM Express® Evaluation Carrier Type 6 COMe REF.CARRIER–I T6 TMI 38115-0000-00-x COM Express® Reference Carrier Type 6 for industrial temperature ARTICLE PART NO. DESCRIPTION HSP COMe-bSL6/bKL6/bCL6 CU-CORE THREADED 38030-0000-99-0 Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6, Cu-core, threaded mounting holes HSP COMe-bSL6/bKL6/bCL6 CU-CORE THROUGH 38030-0000-99-1 Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6, Cu-core, through mounting holes HSK COMe-BASIC ACTIVE (W/O HSP) 38025-0000-99-0C05 Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP HSK COMe-BASIC PASSIVE (W/O HSP) 38025-0000-99-0C06 Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP MEMORY PART NO. MIN. SPEC. SIZE ECC OP. TEMPERATURE 97017-3200-27-0 DDR4-2666 32 GByte no 0 °C to +60 °C 97017-1600-27-0 DDR4-2666 16 GByte no 0 °C to +60 °C 97017-8192-27-0 DDR4-2666 8 GByte no 0 °C to +60 °C 97017-4096-27-0 DDR4-2666 4 GByte no 0 °C to +60 °C 97017-3200-27-2 DDR4-2666 32 GByte no -40 °C to +85 °C 97017-1600-27-2 DDR4-2666 16 GByte no -40 °C to +85 °C 97017-8192-27-2 DDR4-2666 8 GByte no -40 °C to +85 °C 97017-4096-27-2 DDR4-2666 4 GByte no -40 °C to +85 °C 97018-3200-27-0 DDR4-2666 32 GByte yes 0 °C to +60 °C 97018-1600-27-0 DDR4-2666 16 GByte yes 0 °C to +60 °C 97018-8192-27-0 DDR4-2666 8 GByte yes 0 °C to +60 °C 97018-4096-27-0 DDR4-2666 4 GByte yes 0 °C to +60 °C 97018-3200-27-2 DDR4-2666 32 GByte yes -40 °C to +85 °C 97018-1600-27-2 DDR4-2666 16 GByte yes -40 °C to +85 °C 97018-8192-27-2 DDR4-2666 8 GByte yes -40 °C to +85 °C 97018-4096-27-2 DDR4-2666 4 GByte yes -40 °C to +85 °C Copyright © 2022 Kontron. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized. Specifications are subject to change without notice. COMe-bCL6 (R E2S)-20220221 - WMH