COMH-CARP KONTRON | Alldatasheet
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Technical content
COM HPC/Client module size A with 13th Generation Intel ® Core™ Processors COMh-caRP E2 * Up to 64 GByte DDR5 memory * Up to 2.5Gb Ethernet with TSN support * Optional NVMe SSD onboard * Industrial grade
www.kontron.com COMh-caRP E2 Technical Information CPU Variants COMPLIANCE COM HPC® Client 2x 400 pin connector DIMENSIONS (H x W) 95 x 120 mm CPU Intel® 13th Generation Core™ family For details see table (CPU variants) given below CHIPSET lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub MAIN MEMORY 2x DDR5 SODIMM dual channel up to 64 GByte non ECC GRAPHICS CONTROLLER Intel® Iris XeGraphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K) ETHERNET CONTROLLER Intel® i226 ETHERNET Up to 2x 2.5 Gb Ethernet with TSN & WOL support (depending on SKU) STORAGE 2x SATA 6Gb/s (optional) FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 1x 8 PCIe Gen 5.0 (Raptor Lake H-Series, 35-45 W) 2x 4 PCIe Gen 4.0 -> 1x4 shared with onboard NVMe 8x PCIe Gen3.0 Optional 1x PCIe for BMC DISPLAY DDI1: DP++, DDI2: DP++, DDI3: DP++, eDP (DSI, BIOS option), MIPI DSI USB 2x USB 4.0/ Thunderbolt ™; 2x USB 3.2; 8x USB 2.0 SERIAL 2x serial interface (RX/TX only) AUDIO HD Audio OTHER FEATURES (G) SPI, SMB, Fast I²C, Staged Watchdog, RTC SPECIAL FEATURES Trusted Platform Module TPM 2.0 FEATURES ON REQUEST vPRO (AMT/TXT/AES Support), up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Save via 2nd SPI Flash POWER MANAGEMENT ACPI 6.0 POWER SUPPLY Commercial T emperature: 8.0 V – 20 V Wide Range, Single Supply Power Industrial T emperature: 12 V ± 5% BIOS AMI UEFI OPERATING SYSTEM Windows®10, Linux, VxWorks TEMPERATURE Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) 13TH GEN RAPTOR LAKE H-SERIES INDUSTRIAL (45 W) P-SERIES INDUSTRIAL (28 W) CPU i7-13800HRE i5-13600HRE i3-13300HRE i7-1370PRE i5-1350PRE i3-1320PRE CORES 14 12 8 14 12 8 NUMBER OF P-CORES 6 4 4 6 4 4 NUMBER OF E-CORES 8 8 4 8 8 4 TDP 45/ 35 W 45/ 35 W 45/ 35 W 28/ 20 W 28/ 20 W 28/ 20 W CACHE 24 MByte 18 Mbyte 12 Mbyte 24 MByte 12 MByte 12 Mbyte IBECC yes yes yes yes yes yes TCC/TSN yes yes yes yes yes yes
www.kontron.com COMh-caRP E2 Block Diagram Variants PART NO. NAME CPU OP. TEMPERATURE HCA02-0000-80-7 COMh-caRP E2 i7-13800HRE i7-13800HRE - 40 °C - 85 °C HCA02-0000-60-5 COMh-caRP E2 i5-13600HRE i5-13600HRE - 40 °C - 85 °C HCA02-0000-30-3 COMh-caRP E2 i3-13300HRE i3-13300HRE - 40 °C - 85 °C HCA02-0000-70-7 COMh-caRP E2 i7-1370PRE i7-1370PRE - 40 °C - 85 °C HCA02-0000-50-5 COMh-caRP E2 i5-1350PRE i5-1350PRE - 40 °C - 85 °C HCA02-0000-20-3 COMh-caRP E2 i3-1320PRE i3-1320PRE - 40 °C - 85 °C PCIe Gen . X DDI0 DDI1 SER0 SER1 DDI2 PCIe Gen . 4 #16-23 (Group 1) SPI GSPI I2C GPIO PwrCtr l SysMg mt LID Sleep GPIO Ctrl MgmtSMB Sound- Wi re/ HD-Audi o/ I2S PCIe Gen . X SER0 SER1eDP/D SI eSPI GbE #0USB #0-1 (USB 4.0) Tunderbolt USB #0-7 (USB 2.0) SATA#1 PCIe Gen . 4 #8-15 (Group 0 High) SATA#0 PCIe Gen . #0-7 (Group 0 Low) USB #2-3 (USB 3.2) MIPI CSI (IPU) GbE #1 COM-HPC® connector J 1– Pin-out Client COM-HPC® connector J 2 – Pin-out Client Intel® 13th Generation Core Raptor Lake-P Series Module Management Controller UART Connector OptionSt andard component Alder Lake- P 35-45 W NVMe 1x4 #12-15 HWMFAN1 DDR5 SODIMM non-ECC I2C EEPROM Watchdog I2C GPIO Buffer SPI BI OS Flash 2nd Gen. TPM SLB967 LAN Intel® I226 LAN Intel® I226 DDR5 SODIMM non-ECC 2nd SPI Flash RTC Power sequencing Power sequencing
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