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75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 1 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com 16-pin SOIC Wide Body Package with Exposed Backside Ground Pad

Applications

  • CATV Line Amplifiers
  • HFC Nodes
  • Head End Equipment

Ordering Information

Part No. Description TAT2801 CATV Output Stage Amplifier TAT2801-PCB 40-1000 MHz Evaluation Board Standard T/R size = 1000 pieces on a 7” reel Functional Block Diagram GND VG2 ADJ RFIN 1 GND GND RFIN 2 IDD ADJ GND Backside Pad - RF/DC GND Pin 1 Reference Mark GND VDD RFOUT 1 GND GND RFOUT 2 VDD GND Product Features

  • Wide Bandwidth (40– 1000 MHz)
  • 100% production tested for DOCSIS Edge QAM.
  • In-package ESD protection
  • Flat Gain
  • High Power Compression
  • Excellent Input/Output Match
  • Low DC Power Consumption
  • Bias optimization through external voltage General Description The TAT2801 is a high power, high linearity GaAs MMIC amplifier intended for output stage amplification in CATV infrastructure applications. Featuring a single die design and providing flat gain with l ow distortion, this amplifier is ideal for use in CATV dist ribution systems requiring high output powers and low distortion. The TAT2 801 draws 575 mA from a 12 V supply Bias current and voltage may be adjusted externally to optimize output performance for specific applications. The TAT 2801 integrates two TQP200002 ESD protection devices that provide bi -directional protection with very low leakage currents and extremely low capacitance. The TAT2801 is packaged in an industry standard 16 pin SOIC WB package. Pin Configuration Pin No. Label

2 VG2 ADJ

7 IDD ADJ

10 VDD

15 VDD

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 2 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Recommended Operating Conditions Parameter Min Typ Max Units Device Voltage (VDD) 11.7 12 12.3 V Case Temperature -40 +85 °C Tj (for >106 hours MTTF) 200 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Absolute Maximum Ratings Parameter Rating Storage Temperature -40 to 150°C Device Voltage (VDD) +16 V Device Current (IDD) 700 mA RF Input Power (single tone) 75 dBmV Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test cond itions unless otherwise noted: VDD=+12 V, ICC=575 mA (typ.), TAMBIENT=+25°C, 75 Ω system Parameter Conditions Min Typ Max Units Operational Frequency Range 40 1000 MHz Current 575 mA Gain 10.6 11.2 12.0 dB Gain Flatness Peak deviation from least squared fit curve. ±0.25 ±0.3 dB Gain Slope -1 0 dB Input Return Loss 20 dB Output Return Loss 20 dB CSO 80 ch. NTSC, + 56 dBmV/ch at 1002 MHz, 15.6 dB tilt, QAM from 553 MHz to 1002 MHz at 6 dB offset. -65 dBc CTB -76 dBc XMOD -70 dBc CIN 58 dB EQAM Vout 4−Ch. ACPR(1) ACPR2 (750 kHz – 6 MHz) ACPR3 (6 MHz – 12 MHz) ACPR4 (12 MHz – 18 MHz) dBmV/ch 1-Ch. Harmonics Pout = 68 dBmV -63 dBc Output P1dB 31 dBm Output IP3 f1=950 MHz, f2=1000 MHz, Pout=+17 dBm/tone 54 dBm Thermal Resistance, θjc Junction to case 12 °C/W Notes: 1. Measured against DOCSIS 3.0 specified limits for out of band spurious emissions in adjacent channels

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 3 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com C11 RF Output RF Input C12 C10 T2T1 VDD VDD VDD VDD VDD C13 C14 C15 VDD+12 V Bill of Material − TAT2801-PCB Reference Value Description Manuf. Part Number U1 -- 40 MHz – 1 GHz, CATV Gain Block TriQuint TAT2801 C1, C2, C3, C4 0.01 uF Cap, Chip, 0402, 16V, 10% Various C5, C6, C11, C12 0.7 pF Cap, Chip, 0402, 25V, +/-0.075, NPO/COG Various C7, C8, C13, C14 0.01 uF Cap, Chip, 0603, 25V, 5%, X7R Various C9, C10 330 pF Cap, Chip, 0402, 50V, 10%, X7R Various C15 DNP Various R2 7.5 kΩ Res, Chip, 0402, 1%, 1/16W Various L1, L2 500 nH Ind, Chip, Ferrite, 1206, 10%, 260mA Various L3 0.9 uH Ind, Chip, 1008, 5%, 1.4A Coilcraft 1008AF-901XJL TX1, TX2 1:1 SMT, 75 OHM, BALUN 1:1, SM-118A M/A-COM MABA-008483-CT1760

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 4 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Performance Plots − TAT2801-PCB Test conditions unless otherwise noted: VDD=+12 V, ICC = 575 mA (typ.) 0 200 400 600 800 1000 1200 S21 (dB) Frequency (MHz) Gain +85°C +25°C −40°C -25 -20 -15 -10 0 200 400 600 800 1000 1200 S12 (dB) Frequency (MHz) Reverse Isolation +85°C +25°C −40°C -50 -40 -30 -20 -10 0 200 400 600 800 1000 1200 S11 (dB) Frequency (MHz) Input Return Loss +85°C +25°C −40°C -60 -50 -40 -30 -20 -10 0 200 400 600 800 1000 1200 S22 (dB) Frequency (MHz) Output Return Loss +85°C +25°C −40°C -70 -68 -66 -64 -62 -60 -58 -56 56 57 58 59 60 61 62 63 64 65 ACPR (dBc) Pout (dBmV/ch) 4-ch ACPR vs Pout, Freq = 990 MHz ACPR2 ACPR3 ACPR4 -90 -80 -70 -60 -50 0 200 400 600 800 1000 1200 Harmonics (dBc) Frequency (MHz) 1-Ch. Harmonics vs Frequency + 25 deg C - 40 deg C + 85 deg C 2 x 66 MHz 3 x 66 MHz 2 x 330 MHz 3 x 330 MHz Limit: - 63 dBc Pout = 69 dBmV

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 5 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Distortion Performance: Lot to Lot Variation Over Temperature Test conditions unless otherwise noted: VDD=+12 V, ICC = 575 mA (typ.) -68 -64 -60 -56 -52 56 57 58 59 60 61 62 63 64 65 ACPR2 (dBc) Pout (dBmV/ch) ACPR2 vs Pout, Freq = 990 MHz, Temp = -40°C 7 units in total, 3 non-sequential lots -68 -64 -60 -56 -52 56 57 58 59 60 61 62 63 64 65 ACPR2 (dBc) Pout (dBmV/ch) ACPR2 vs Pout, Freq = 990 MHz, Temp = +25°C 7 units in total, 3 non-sequentiallots -68 -64 -60 -56 -52 56 57 58 59 60 61 62 63 64 65 ACPR2 (dBc) Pout (dBmV/ch) ACPR2 vs Pout, Freq = 990 MHz, T emp = +85°C 8 units in total, 3 non-sequentiallots -71 -67 -63 -59 -55 56 57 58 59 60 61 62 63 64 65 ACPR3 (dBc) Pout (dBmV/ch) ACPR3 vs Pout, Freq = 990 MHz, Temp = -40°C 7 units in total, 3 non-sequential lots -71 -67 -63 -59 -55 56 57 58 59 60 61 62 63 64 65 ACPR3 (dBc) Pout (dBmV/ch) ACPR3 vs Pout, Freq = 990 MHz, T emp = +25°C 7 units in total, 3 non-sequentiallots -71 -67 -63 -59 -55 56 57 58 59 60 61 62 63 64 65 ACPR3 (dBc) Pout (dBmV/ch) ACPR3 vs Pout, Freq = 990 MHz, Temp = +85°C 8 units in total, 3 non-sequentiallots -73 -69 -65 -61 -57 56 57 58 59 60 61 62 63 64 65 ACPR4 (dBc) Pout (dBmV/ch) ACPR4 vs Pout, Freq = 990 MHz, Temp = -40°C 7 units in total, 3 non-sequentiallots -73 -69 -65 -61 -57 56 57 58 59 60 61 62 63 64 65 ACPR4 (dBc) Pout (dBmV/ch) ACPR4 vs Pout, Freq = 990 MHz, Temp = +25°C 7 units in total, 3 non-sequentiallots -73 -69 -65 -61 -57 56 57 58 59 60 61 62 63 64 65 ACPR4 (dBc) Pout (dBmV/ch) ACPR4 vs Pout, Freq = 990 MHz, T emp = +85°C 8 units in total, 3 non-sequentiallots Note: ACPR performance measured using application circuit on pg. 3. ACPR performance at low output power levels is reflective of the limitations of the source. A better test source is likely to result in significantly better ACPR performance at these power levels.

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 6 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Pin Configuration and Description GND VG2 ADJ RFIN 1 GND GND RFIN 2 IDD ADJ GND Backside Pad - RF/DC GND Pin 1 Reference Mark GND VDD RFOUT 1 GND GND RFOUT 2 VDD GND Pin No. Label Description 1, 4-5, 8-9, 12-13, 16 GND Grounded internally within the package. Provide grounded land pads. 2 VG2 ADJ Dropping resistor and bypass capacitor required. 3 / 6 RFINA / RFINB RF Input A / RF Input B. Impedance matching and DC blocking capacitors required. 7 IDD ADJ IDD current adjustment. Dropping resistor and bypass capacitor required.

10 VDD VDD supply for internal biasing

RF Output / DC supply. Impedance matching , DC block and bias choke required

15 VDD VDD supply for internal biasing

Backside Pad GND RF/DC ground. Evaluation Board PCB Information TriQuint Evaluation Board PCB Material and Stack-up 2 oz. Cu bottom layer Isola FR402 εr=4.25 typ. 2 oz. Cu top layer 0.062 ± 0.005 Finished Board Thickness

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 7 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Package Marking and Dimensions Marking: Part Number – TAT2801 Year/Week/Country Code – YYWW CCCC Lot code – AaXXXX Package Dimensions Symbol MIN TYP MAX MIN TYP MAX TOTAL THICKNESS A .087 .098 2.2 2.5 STAND OFF A1 0 .004 0 0.1 LEAD WIDTH b .014 .019 0.35 0.49 L/F THICKNESS c .009 .013 0.23 0.33 BODY SIZE D .400 .411 10.15 10.45 E1 .291 .299 7.4 7.6 E .395 .415 10.05 10.55 LEAD PITCH e 0.05 BSC 1.27 BSC L .016 .050 0.4 1.27 h .010 .030 0.25 0.75 ᶿ 0° 8° 0° 8° LEAD EDGE OFFSET aaa .010 0.25 LEAD OFFSET bbb .010 0.25 COPLANARITY ccc .004 0.10 TriQuint TAT2801 YYWW CCCC AaXXXX

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 8 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com PCB Mounting Pattern Notes: 1. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We 2. Ensure good package backside paddle solder attach for optimum electrical and thermal performance. 3. All dimensions are in millimeters. Angles are in degrees. Recommended Soldering Temperature Profile Solder paste manufacturers will recommend a "typical" solder reflow profile depending on their particular solder paste's flux and metal composition. This typical profile entails the parameters necessary for the solder to properly melt and reflow, and defines the thermal condition of the PCB soldering surface to be within an optimum temperature range. The profile is obtained by mounting a thermo couple directly to the solder surface area of the PCB, and recording the actual local surface temperature during the reflow process. The solder reflow profile shown at right is for a typical SAC 305 lead free solder paste application and assumes that standard PCB layout rules have been followed, such as solder mask to dam in molten solder during reflow to keep it from wicking away from the solder joint. The "oven profile" required to achieve the "solder reflow pr ofile" will vary depending on reflow equipment, PCB, components loaded on the PCB, and other factors such as fixturing. 100 150 200 250 0 1 2 3 4 Temperature (deg. C) Time (mins.) Recommended Re-flow Solder Profile

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 9 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Thermal Reliability 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 1.E+14 1.E+15 0 25 50 75 100 125 150 175 200 Median Lifetime, Tm (Hours) Channel Temperature, TCH (°C) Median Lifetime vs. Channel Temperature

75 Ω CATV Output Stage Amplifier Preliminary Datasheet: Rev. E 10-13-13 - 10 of 10 - Disclaimer: Subject to change without notice © 2013 TriQuint www.triquint.com Product Compliance Information ESD Sensitivity Ratings Caution! ESD-Sensitive Device ESD Rating: Class 1B Value: Passes ≥ 500 V to < 1000 V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes ≥ 1000 V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 Solderability Compatible with J -STD-020, Lead free solder, (260° maximum reflow temperature) and tin/lead (245°C maximum reflow temperature) soldering processes. Contact plating: NiPdAu RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes:

  • Lead Free
  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C15H12Br402) Free
  • PFOS Free
  • SVHC Free MSL Rating MSL Rating: Level 3 Test: 260°C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and info rmation about TriQuint: Email: info-sales@triquint.com Fax: +1.503.615.8902 For technical questions and application information: Email: sjcapplications.engineering@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obt ain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other in tellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life -saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.