T0P243G

TOP242-249 POWERINT | Alldatasheet

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Technical content

Extended Power, Design Flexible, EcoSmart , Integrated Off-line Switcher July 2001 Figure 1. Typical Flyback Application. Table 1. Notes: 1. Typical continuous power in a non-ventilated Key Applications for detailed conditions. Assumes 3 sq. in. of 2 oz. copper heat sink area for R package. 3. See Part Ordering Information.

1. 230 V AC or 100/115 V AC with doubler.

230 VAC ±15%4

10 W 22 W 7 W 14 W

13 W 25 W 9 W 15 W

20 W 43 W 15 W 23 W

13 W 45 W 15 W 30 W

16 W 30 W 11 W 20 W

28 W 52 W 18 W 28 W

30 W 65 W 20 W 45 W

33 W 58 W 20 W 32 W

40 W 85 W 26 W 60 W

37 W 65 W 24 W 36 W

60 W 125 W 40 W 90 W

41 W 73 W 26 W 43 W

85 W 165 W 55 W 125 W

43 W 78 W 28 W 48 W

105 W 205 W 70 W 155 W

45 W 82 W 30 W 52 W

120 W 250 W 80 W 180 W

• Extended power range to 250 W
• Features eliminate or reduce cost of external components
• Fully integrated soft-start for minimum stress/overshoot
• Externally programmable accurate current limit
• Wider duty cycle for more power, smaller input capacitor
• Separate line sense and current limit pins on Y/R packages
• Line under-voltage (UV) detection: no turn off glitches
• Line overvoltage (OV) shutdown extends line surge limit
• Line feed forward with maximum duty cycle (DC MAX) reduction rejects line ripple and limits DCMAX at high line
• Frequency jittering reduces EMI and EMI filtering costs
• Regulates to zero load without dummy loading
• 132 kHz frequency reduces transformer/power supply size
• Half frequency option in Y/R packages for video applications
• Hysteretic thermal shutdown for automatic fault recovery
• Large thermal hysteresis prevents PC board overheating EcoSmart - Energy Efficient
• Extremely low consumption in remote off mode (80 mW @ 110 VAC, 160 mW @ 230 VAC)
• Frequency lowered with load for high standby efficiency
• Allows shutdown/wake-up via LAN/input port

Description

TOPSwitch-GX uses the same proven topology as TOPSwitch, cost effectively integrating the high voltage power MOSFET, PWM control, fault protection and other control circuitry onto a single CMOS chip. Many new functions are integrated to reduce system cost and improve design flexibility, performance and energy efficiency. Depending on package type, the TOPSwitch-GX family has either 1 or 3 additional pins over the standard DRAIN, SOURCE and CONTROL terminals. allowing the following functions: line sensing (OV/UV, line feedforward/DC max reduction), accurate externally set current limit, remote on/off, and synchronization to an external lower frequency and frequency selection (132 kHz/66 kHz). All package types provide the following transparent features: Soft-start, 132 kHz switching frequency (automatically reduced at light load), frequency jittering for lower EMI, wider DC MAX, hysteretic thermal shutdown and larger creepage packages. In addition, all critical parameters (i.e. current limit, frequency, PWM gain) have tighter temperature and absolute tolerance, to simplify design and optimize system cost. TOP242 P or G TOP242 R TOP242 Y TOP243 P or G TOP243 R TOP243 Y TOP244 P or G TOP244 R TOP244 Y TOP245 R TOP245 Y TOP246 R TOP246 Y TOP247 R TOP247 Y TOP248 R TOP248 Y TOP249 R TOP249 Y

E 7/01 August 8, 2000 Section List

pin current as shown in Figure 7.

1. A fully integrated 10 ms soft-start limits peak currents and

eliminates output overshoot in most applications. input voltage requirement and/or higher power capability.

1. Frequency reduction at light loads lowers the switching
2. Higher switching frequency of 132 kHz reduces the

transformer size with no noticeable impact on EMI.

1. Frequency jittering reduces EMI.
2. Hysteretic over-temperature shutdown ensures automatic
3. Packages with omitted pins and lead forming provide large
4. Tighter absolute tolerances and smaller temperature vari-

ations on switching frequency, current limit and PWM gain. above the under-voltage threshold. See Table 2 and Figure 11. synchronization input in both modes. See Table 2 and Figure 11. mutually exclusive as shown in Table 3. can be chosen by connecting this pin to CONTROL pin instead. Leaving this pin open is not recommended. Note: For P and G packages IL is replaced with IM. Figure 7. Relationship of Duty Cycle and Frequency to CONTROL

auto-restart timing as well as control loop compensation. the capacitor on the CONTROL pin discharges towards 4.8 V. turning on again until eight discharge/charge cycles have elapsed. achieved through closure of the feedback loop. Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-restart (4) Power Down.

Figure 9. Switching Frequency Jitter. (Idealized VDRAIN waveform) excess of the internal supply current of the chip (see Figure 7). before the duty cycle begins to change. E as a voltage error signal. the output MOSFET off until the start of the next clock cycle. DS(ON) of the output MOSFET. The default current limit of TOPSwitch-GX is preset internally.

9August 8, 2000 E DCMAX at higher line voltages helps prevent transformer saturation due to large load transients in forward converter applications. DC MAX of 38% at the OV threshold was chosen to ensure that the power capability of the TOPSwitch-GX is not restricted by this feature under normal operation. Remote ON/OFF and Synchronization TOPSwitch-GX can be turned on or off by controlling the current into the LINE-SENSE pin or out from the EXTERNAL CURRENT LIMIT pin (Y or R package) and into or out from the MULTI-FUNCTION pin (P or G package) (see Figure 11). In addition, the LINE-SENSE pin has a 1 V threshold comparator connected at its input. This voltage threshold can also be used to perform remote ON/OFF control. This allows easy implementation of remote ON/OFF control of TOPSwitch-GX in several different ways. A transistor or an optocoupler output connected between the EXTERNAL CURRENT LIMIT or LINE-SENSE pins (Y or R package) or the MULTI-FUNCTION pin (P or G package) and the SOURCE pin implements this function with “active-on” (Figure 22, 29 and 36) while a transistor or an optocoupler output connected between the LINE-SENSE pin (Y or R package) or the MULTI-FUNCTION (P or G package) pin and the CONTROL pin implements the function with “active-off” (Figure 23 and 37). When a signal is received at the LINE-SENSE pin or the EXTERNAL CURRENT LIMIT pin (Y or R package) or the MULTI-FUNCTION pin (P or G package) to disable the output through any of the pin functions such as OV, UV and remote ON/OFF, TOPSwitch-GX always completes its current switching cycle, as illustrated in Figure 10, before the output is forced off. The internal oscillator is stopped slightly before the end of the current cycle and stays there as long as the disable signal exists. When the signal at the above pins changes state from disable to enable, the internal oscillator starts the next switching cycle. This approach allows the use of this pin to synchronize TOPSwitch-GX to any external signal with a frequency lower than its internal switching frequency. As seen above, the remote ON/OFF feature allows the TOPSwitch-GX to be turned on and off instantly, on a cycle-by- cycle basis, with very little delay. However, remote ON/OFF can also be used as a standby or power switch to turn off the TOPSwitch-GX and keep it in a very low power consumption state for indefinitely long periods. If the TOPSwitch-GX is held in remote off state for long enough time to allow the CONTROL pin to dishcharge to the internal supply under-voltage threshold of 4.8 V (approximately 32 ms for a 47 µF CONTROL pin capacitance), the CONTROL pin goes into the hysteretic mode of regulation. In this mode, the CONTROL pin goes through alternate charge and discharge cycles between 4.8 V and 5.8 V (see CONTROL pin operation section above) and runs entirely off the high voltage DC input, but with very low power consumption (160 mW typical at 230 VAC with M or X pins open). When the TOPSwitch-GX is remotely turned on after entering this mode, it will initiate a normal start-up sequence with soft-start the next time the CONTROL pin reaches 5.8 V. In the worst case, the delay from remote on to start-up can be equal to the full discharge/charge cycle time of the CONTROL pin, which is approximately 125 ms for a 47 µF CONTROL pin capacitor. This reduced consumption remote off mode can eliminate expensive and unreliable in-line mechanical switches. It also allows for microprocessor controlled turn-on and turn- off sequences that may be required in certain applications such as inkjet and laser printers. Soft-Start Two on-chip soft-start functions are activated at start-up with a duration of 10 ms (typical). Maximum duty cycle starts from 0% and linearly increases to the default maximum of 78% at the end of the 10 ms duration and the current limit starts from about 85% and linearly increases to 100% at the end of the 10ms duration. In addition to start-up, soft-start is also activated at each restart attempt during auto-restart and when restarting after being in hysteretic regulation of CONTROL pin voltage C), due to remote off or thermal shutdown conditions. This effectively minimizes current and voltage stresses on the output MOSFET, the clamp circuit and the output rectifier during start- up. This feature also helps minimize output overshoot and prevents saturation of the transformer during start-up. Shutdown/Auto-Restart To minimize TOPSwitch-GX power dissipation under fault conditions, the shutdown/auto-restart circuit turns the power supply on and off at an auto-restart duty cycle of typically 4% if an out of regulation condition persists. Loss of regulation interrupts the external current into the CONTROL pin. V C regulation changes from shunt mode to the hysteretic auto- restart mode as described in CONTROL pin operation section. When the fault condition is removed, the power supply output becomes regulated, V C regulation returns to shunt mode, and normal operation of the power supply resumes. Hysteretic Over-Temperature Protection Temperature protection is provided by a precision analog circuit that turns the output MOSFET off when the junction temperature exceeds the thermal shutdown temperature (140 °C typical). When the junction temperature cools to below the hysteretic temperature, normal operation resumes providing automatic recovery. A large hysteresis of 70 °C (typical) is provided to prevent overheating of the PC board due to a continuous fault condition. V C is regulated in hysteretic mode and a 4.8 V to 5.8 V (typical) sawtooth waveform is present on the CONTROL pin while in thermal shutdown. Bandgap Reference All critical TOPSwitch-GX internal voltages are derived from a temperature-compensated bandgap reference. This reference is

E 7/01 August 8, 2000 also used to generate a temperature-compensated current reference which is trimmed to accurately set the switching frequency, MOSFET gate drive current, current limit, and the line OV/UV thresholds. TOPSwitch-GX has improved circuitry to maintain all of the above critical parameters within very tight absolute and temperature tolerances. High-Voltage Bias Current Source This current source biases TOPSwitch-GX from the DRAIN pin and charges the CONTROL pin external capacitance during start-up or hysteretic operation. Hysteretic operation occurs during auto-restart, remote off and over-temperature shutdown. In this mode of operation, the current source is switched on and off with an effective duty cycle of approximately 35%. This duty cycle is determined by the ratio of CONTROL pin charge C) and discharge currents (ICD1 and ICD2). This current source is turned off during normal operation when the output MOSFET is switching. The effect of the current source switching will be seen on the DRAIN voltage waveform as small disturbances and is normal.

11August 8, 2000 E Refer to Table 2 for possible combinations of the functions with example circuits shown in Figure 16 through Figure 40. A description of specific functions in terms of the LINE-SENSE pin I/V characteristic is shown in Figure 11 (right hand side). The horizontal axis represents LINE-SENSE pin current with positive polarity indicating currents flowing into the pin. The meaning of the vertical axes varies with functions. For those that control the on/off states of the output such as UV, OV and remote ON/OFF, the vertical axis represents the enable/disable states of the output. UV triggers at I UV (+50 µA typical with 30 µA hysteresis) and OV triggers at IOV (+225 µA typical with 8 µA hysteresis). Between the UV and OV thresholds, the output is enabled. For line feed forward with DCMAX reduction, the vertical axis represents the magnitude of the DCMAX. Line feed forward with DCMAX reduction lowers maximum duty cycle from 78% at IL(DC) (+60 µA typical) to 38% at IOV (+225 µA). EXTERNAL CURRENT LIMIT (X) Pin Operation (Y and R Packages) When current is drawn out of the EXTERNAL CURRENT LIMIT pin, it works as a voltage source of approximately 1.3 V up to a maximum current of –240 µA (typical). At –240 µA, it turns into a constant current source (refer to Figure 12a). There are two functions available through the use of the EXTERNAL CURRENT LIMIT pin: external current limit and remote ON/OFF. Connecting the EXTERNAL CURRENT LIMIT pin and SOURCE pin disables the two functions. In high efficiency applications this pin can be used to reduce the current limit externally to a value close to the operating peak current, by connecting the pin to the SOURCE pin through a resistor. The pin can also be used as a remote on/off. Table 2 shows several possible combinations using this pin. See Figure FREQUENCY (F) Pin Operation The FREQUENCY pin is a digital input pin available in the Y or R package only. Shorting the FREQUENCY pin to SOURCE pin selects the nominal switching frequency of 132 kHz (Figure 13) which is suited for most applications. For other cases that may benefit from lower switching frequency such as noise sensitive video applications, a 66 kHz switching frequency (half frequency) can be selected by shorting the FREQUENCY pin to the CONTROL pin (Figure 14). In addition, an example circuit shown in Figure 15 may be used to lower the switching frequency from 132 kHz in normal operation to 66 kHz in standby mode for very low standby power consumption. LINE-SENSE (L) Pin Operation (Y and R Packages) When current is fed into the LINE-SENSE pin, it works as a voltage source of approximately 2.6 V up to a maximum current of +400 µA (typical). At +400 µA, this pin turns into a constant current sink. Refer to Figure 12a. In addition, a comparator with a threshold of 1 V is connected at the pin and is used to detect when the pin is shorted to the SOURCE pin. There are a total of four functions available through the use of the LINE-SENSE pin: OV, UV, line feed forward with DC MAX reduction, and remote ON/OFF. Connecting the LINE-SENSE pin to the SOURCE pin disables all four functions. The LINE- SENSE pin is typically used for line sensing by connecting a resistor from this pin to the rectified DC high voltage bus to implement OV, UV and DC MAX reduction with line voltage. In this mode, the value of the resistor determines the line OV/UV thresholds, and the DC MAX is reduced linearly with rectified DC high voltage starting from just above the UV threshold. The pin can also be used as a remote on/off and a synchronization input. Using Feature Pins ✔✔ ✔ ✔ 16 17 18 19 20 21 22 23 24 25 26 27 28 29Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations. LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE* *This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin configurations that are possible. L Figure Number Three Terminal Operation Under-Voltage Overvoltage Line Feed Forward (DC MAX) Overload Power Limiting External Current Limit Remote ON/OFF

Table 3. Typical MULTI-FUNCTION Pin Configurations. *This table is only a partial list of many MULTI-FUNCTION pin configurations that are possible. LINE-SENSE pin is removed in this case as shown in Figure 2b. (typical). At +400 µA, this pin turns into a constant current sink. into a constant current source. Refer to Figure 12b. with positive polarity indicating currents flowing into the pin. and OV triggers at IOV (+225 µA typical with 30 µA hysteresis).

Figure 11. MULTI-FUNCTION (P or G package), LINE-SENSE, and EXTERNAL CURRENT LIMIT (Y or R package) Pin Characteristics. table and typical performance characteristics sections of the data sheet for measured data.

E 7/01 August 8, 2000 Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simplified Schematic. Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic. VBG + VT

1 VVBG

240 µA 400 µA CONTROL Pin Y and R Package (Voltage Sense) (Positive Current Sense - Under-Voltage, Overvoltage, ON/OFF Maximum Duty Cycle Reduction) (Negative Current Sense - ON/OFF, Current Limit Adjustment) PI-2634-033001 TOPSwitch-GX LINE-SENSE (L) EXTERNAL CURRENT LIMIT (X) VBG + VT VBG 240 µA 400 µA CONTROL Pin MULTI-FUNCTION (M) (Positive Current Sense - Under-Voltage, Overvoltage, Maximum Duty Cycle Reduction) (Negative Current Sense - ON/OFF, Current Limit Adjustment) PI-2548-092399 TOPSwitch-GX P and G Package

2.5 MΩRLS

Figure 16. Three Terminal Operation (LINE-SENSE and EXTERNAL CURRENT LIMIT Features Disabled. Figure 17. Line-Sensing for Under-Voltage, Overvoltage and Figure 18. Line-Sensing for Under-Voltage Only (Overvoltage Figure 19. Line-Sensing for Overvoltage Only (Under-Voltage Figure 20. Externally Set Current Limit. Figure 21. Current Limit Reduction with Line Voltage.

Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.

30 W at 12 V, from an 85 to 265 VAC input, at an ambient of

80% at full load is achieved using TOP244Y. CISPR 22 (FCC B) specification. 12 V output level, over line and load and component variations.

10 V, 2%

3.15 AJ1

250 VAC CONTROLCONTROL

VAC rising to 90% at 230 VAC input. the bias voltage from falling during zero to full load transients. keeping the bias voltage constant even at high output loads. common returns directly to the DC bulk capacitor (C1). Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV. All resistors 1/8 W 5% unless otherwise stated.

input. DC input is shown, as typically at this power level a p.f.c. output diode and capacitors are reasonably sized. normal, preventing device damage. required if a large heat sink area is not acceptable. Figure 43. 250 W, 48 V Power Supply using TOP249.

the voltage error for the higher voltage outputs. the differential surge protection to 6 kV from 4 kV. keeping the DRAIN voltage below 700 V under all conditions. dissipates very little power except during overload conditions. (C1, L1 and C6) and the output grounded. for the 5 V output is a PN type to center the 5 V output at 5 V. is provided by L2 to L5 and C8, C10, C12, C15 and C18. Figure 44. 60 W Multiple Output Power Supply using TOP246.

30 V @

18 V @

12 V @

5 V @

3.3 V @

50 VXF

3.3 V: ± 5%

5 V: ± 5%

12 V: ± 7%

18 V: ± 7%

30 V: ± 8%

E 7/01 August 8, 2000 In addition to using a minimum number of components, TOPSwitch-GX provides many technical advantages in this type of application: 1. Extremely low power consumption in the off mode: 80 mW typical at 110 VAC and 160 mW typical at 230 VAC. This is because in the remote/off mode the TOPSwitch-GX consumes very little power, and the external circuitry does not consume any current (either M, L or X pin is open) from the high voltage DC input. 2. A very low cost, low voltage/current, momentary contact switch can be used. 3. No debouncing circuitry for the momentary switch is required. During turn-on, the start-up time of the power supply (typically 10 to 20 ms) plus the microprocessor initiation time act as a debouncing filter, allowing a turn-on only if the switch is depressed firmly for at least the above delay time. During turn-off, the microprocessor initiates the shutdown sequence when it detects the first closure of the switch, and subsequent bouncing of the switch has no effect. If necessary, the microprocessor could implement the switch debouncing in software during turn-off, or a filter capacitor can be used at the switch status input. 4. No external current limiting circuitry is needed for the operation of the U4 optocoupler output due to internal limiting of M pin current. 5. No high voltage resistors to the input DC voltage rail are required to power the external circuitry in the primary. Even the LED current for U3 can be derived from the CONTROL pin. This not only saves components and simplifies layout, but also eliminates the power loss associated with the high voltage resistors in both on and off states. 6. Robust design: There is no on/off latch that can be accidentally triggered by transients. Instead, the power supply is held in the on-state through the secondary side microprocessor.

27August 8, 2000 E Key Application Considerations TOPSwitch-II vs. TOPSwitch-GX Table 4 compares the features and performance differences between TOPSwitch-GX and TOPSwitch-II. Many of the new features eliminate the need for additional discrete components. Other features increase the robustness of design allowing cost savings in the transformer and other power components. Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages Soft-Start N/A* 10 ms • Limits peak current and voltage component stresses during start-up

• Eliminates external components used for soft-start in most

applications

• Reduces or eliminates output overshoot External Current Limit N/A* Programmable 11,20,21, • Smaller transformer 100% to 30% of 24,25,27, • Higher efficiency default current 28,34,35, • Allows power limiting (constant over- limit 38,39 load power independent of line voltage
• Allows use of larger device for lower losses, higher efficiency and smaller heatsink DC MAX 67% 78% 7 • Smaller input cap (wider dynamic range)
• Higher power capability (when used with RCD clamp for large VOR)
• Allows use of Schottky secondary rectifier diode for up to 15 V output for high efficiency Line Feed Forward with N/A* 78% to 38% 7,11,17, • Rejects line ripple DC MAX Reduction 26,27,28, 31,40 Line OV Shutdown N/A* Single resistor 11,17,19, • Increases voltage withstand cap- programmable 26,27,28, ability against line surge 31,33,40 Line UV Detection N/A* Single resistor 11,17,18, • Prevents auto-restart glitches programmable 26,27,28, during power down 31,32,40 Switching Frequency 100 kHz ±10% 132 kHz ±6% 13,15 • Smaller transformer
• Below start of conducted EMI limits Switching Frequency N/A* 66 kHz ±7% 14,15 • Lower losses when using RC and Option (Y and R RCD snubber for noise reduction in Packages) video applications
• Allows for higher efficiency in standby mode
• Lower EMI (second harmonic below 150 kHz) Frequency Jitter N/A* ±4 kHz@132 kHz 9,46 • Reduces conducted EMI ±2 kHz@66 kHz Frequency Reduction N/A* At a Duty Cycle 7 • Zero load regulation without dummy below 10% load
• Low power consumption at no load

**Table 4. Comparison Between TOPSwitch-II and TOPSwitch-GX. (continued on next page) *Not available**

features eliminate the need for additional discrete components. savings in the transformer and other power components.

• Permits shutdown/wake-up of peripherals via LAN or parallel port Synchronization N/A* Single transistor • Synchronization to external lower or optocoupler frequency signal interface • Starts new switching cycle on demand Thermal Shutdown 125 °C min. Hysteretic 130 °C • Automatic recovery from thermal Latched min. Shutdown (with fault 75 °C hysteresis) • Large hysteresis prevents circuit board overheating Current Limit Tolerance ±10% (@25 °C) ±7% (@25 °C) • 10% higher power capability due to -8% (0 °C to100 °C) -4% (0 °C to 100 °C) tighter tolerance DRAIN DIP 0.037" / 0.94 mm 0.137" / 3.48 mm • Greater immunity to arcing as a Creepage SMD 0.037" / 0.94 mm 0.137" / 3.48 mm result of build-up of dust, debris and at Package TO-220 0.046" / 1.17 mm 0.068" / 1.73 mm other contaminants DRAIN Creepage at 0.045" / 1.14 mm 0.113" / 2.87 mm • Preformed leads accommodate PCB for Y and R (R Package N/A*) (preformed leads) large creepage for PCB layout Packages • Easier to meet Safety (UL/VDE)

Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page)

29August 8, 2000 E Table 5 (cont). Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available TOPSwitch-GX Design Considerations Power Table Datasheet power table represents the maximum practical continuous output power based on the following conditions: TOP242 to TOP246: 12 V output, Schottky output diode,

150 V reflected voltage (VOR) and efficiency estimates from

curves contained in application note AN-29. TOP247 to TOP249: Higher output voltages used with a maximum output current of 6 A. For all devices a 100 VDC minimum for 85-265 VAC and 250 VDC minimum for 230 VDC are assumed and sufficient heat sinking to keep device temperature ≤ 100 °C. Power levels shown in the power table for the R package device assume 6.45 cm 2 of 610 g/m 2 copper heat sink area in an enclosed adapter, or 19.4 cm2 in an open frame. TOPSwitch-GX Selection Selecting the optimum TOPSwitch-GX depends upon required maximum output power, efficiency, heat sinking constraints and cost goals. With the option to externally reduce current limit, a larger TOPSwitch-GX may be used for lower power Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages P/G Package Current Identical to Y TOP243P or G and • Matches device current limit to Limits packages TOP244P or G internal package dissipation capability current limits reduced • Allows more continuous design to lower device dissipation (lower RMS currents) Y/R Package Current 100% 90% (for equivalent R DS (ON)) • Minimizes transformer core size Limits (R package N/A*) • Optimizes efficiency for most Thermal Shutdown 125 °C min. 130 °C min. 75 °C • Allows higher output powers in 70 °C hysteresis hysteresis high ambient temperature Maximum Duty Cycle 90 µA 60 µA • Reduces output line frequency Reduction Threshold ripple at low line

• DMAX reduction optimized for forward design Line Under-Voltage N/A* 40% of positive (turn-on) • Provides a well defined turn-off Negative (turn-off) threshold threshold as the line voltage falls Threshold Soft-Start 10 ms (duty cycle) 10 ms (duty cycle + current • Gradually increasing current limit limit) in addition to duty cycle during soft- start further reduces peak current and voltage
• Further reduces component stresses during start up applications where higher efficiency is needed or minimal heat sinking is available. Input Capacitor The input capacitor must be chosen to provide the minimum DC voltage required for the TOPSwitch-GX converter to maintain regulation at the lowest specified input voltage and maximum output power. Since TOPSwitch-GX has a higher DC MAX than TOPSwitch-II, it is possible to use a smaller input capacitor. For TOPSwitch-GX, a capacitance of 2 µF per watt is possible for universal input with an appropriately designed transformer. Primary Clamp and Output Reflected Voltage VOR A primary clamp is necessary to limit the peak TOPSwitch-GX drain to source voltage. A Zener clamp requires few parts and takes up little board space. For good efficiency, the clamp Zener should be selected to be at least 1.5 times the output reflected voltage V OR as this keeps the leakage spike conduction time short. When using a Zener clamp in a universal input application, a V OR of less than 135 V is recommended to allow for the absolute tolerances and temperature variations of the Zener. This will ensure efficient operation of the clamp circuit and will also keep the maximum drain voltage below the rated breakdown voltage of the TOPSwitch-GX MOSFET.

31August 8, 2000 E switching frequency and soft-start features of TOPSwitch-GX contribute to a smaller transformer when compared to TOPSwitch-II. Standby Consumption Frequency reduction can significantly reduce power loss at light or no load, especially when a Zener clamp is used. For very low secondary power consumption use a TL431 regulator for feedback control. Alternately, switching losses can be significantly reduced by changing from 132 kHz in normal operation to 66 kHz under light load conditions. TOPSwitch-GX Layout Considerations As TOPSwitch-GX has additional pins and operates at much higher power levels compared to previous TOPSwitch families, the following guidelines should be carefully followed. Primary Side Connections Use a single point (Kelvin) connection at the negative terminal of the input filter capacitor for TOPSwitch-GX source pin and bias winding return. This improves surge capabilities by returning surge currents from the bias winding directly to the input filter capacitor. The CONTROL pin bypass capacitor should be located as close as possible to the SOURCE and CONTROL pins and its SOURCE connection trace should not be shared by the main MOSFET switching currents. All SOURCE pin referenced components connected to the MULTI-FUNCTION, LINE- SENSE or EXTERNAL CURRENT LIMIT pins should also be located closely between their respective pin and SOURCE. Once again the SOURCE connection trace of these components should not be shared by the main MOSFET switching currents. It is very critical that SOURCE pin switching currents are returned to the input capacitor negative terminal through a seperate trace that is not shared by the components connected to CONTROL, MULTI-FUNCTION, LINE-SENSE or EXTERNAL CURRENT LIMIT pins. This is because the SOURCE pin is also the controller ground reference pin. Any traces to the M, L or X pins should be kept as short as possible and away from the DRAIN trace to prevent noise coupling. LINE-SENSE resistor (R1 in figures 47-49) should be located close to the M or L pin to minimize the trace length on the M or L pin side. In addition to the 47 µF CONTROL pin capacitor, a high frequency bypass capacitor in parallel may be used for better noise immunity. The feedback optocoupler output should also be located close to the CONTROL and SOURCE pins of TOPSwitch-GX. Y-Capacitor The Y-capacitor should be connected close to the secondary output return pin(s) and the positive primary DC input pin of the transformer. Heat Sinking The tab of the Y package (TO-220) is internally electrically tied to the SOURCE pin. To avoid circulating currents, a heat sink attached to the tab should not be electrically tied to any primary ground/source nodes on the PC board. When using a P (DIP-8), G (SMD-8) or R (TO-263) package, a copper area underneath the package connected to the SOURCE pins will act as an effective heat sink. On double sided boards (Figure 49), top side and bottom side areas connected with vias can be used to increase the effective heat sinking area. In addition, sufficient copper area should be provided at the anode and cathode leads of the output diode(s) for heat sinking. In Figures 47, 48 and 49 a narrow trace is shown between the output rectifier and output filter capacitor. This trace acts as a thermal relief between the rectifier and filter capacitor to prevent excessive heating of the capacitor. Quick Design Checklist As with any power supply design, all TOPSwitch-GX designs should be verified on the bench to make sure that components specifications are not exceeded under worst case conditions. The following minimum set of tests is strongly recommended: 1. Maximum drain voltage – Verify that peak V DS does not exceed 675 V at highest input voltage and maximum overload output power. Maximum overload output power occurs when the output is overloaded to a level just before the power supply goes into auto-restart (loss of regulation). 2. Maximum drain current – At maximum ambient temperature, maximum input voltage and maximum output load, verify drain current waveforms at start-up for any signs of transformer saturation and excessive leading edge current spikes. TOPSwitch-GX has a leading edge blanking time of 220 ns to prevent premature termination of the on-cycle. Verify that the leading edge current spike is below the allowed current limit envelope (see Figure 52) for the drain current waveform at the end of the 220 ns blanking period. 3. Thermal check – At maximum output power, minimum input voltage and maximum ambient temperature, verify that temperature specifications are not exceeded for TOPSwitch-GX, transformer, output diodes and output capacitors. Enough thermal margin should be allowed for

Figure 49. Layout Considerations for TOPSwitch-GX using R Package.

E 7/01 August 8, 2000 ABSOLUTE MAXIMUM RATINGS(1) I C = 3 mA; TJ = 25 °C IC = ICD1 fOSC DC(ONSET) fOSC (DMIN) fM DCMAX tSOFT CONTROL FUNCTIONS Conditions (Unless Otherwise Specified) See Figure 53 SOURCE = 0 V; TJ = -40 to 125 °C Min Typ MaxParameter Symbol Units THERMAL IMPEDANCE kHz kHz kHz Hz ms P or G Package: Notes: 1. Free standing with no heatsink. 2. Measured at the back surface of tab. 3. Soldered to 0.36 sq. inch (232 mm 2), 2oz. (610 gm/m2) copper clad. 4. Soldered to 1 sq. inch (645 mm2), 2oz. (610 gm/m2) copper clad. 5. Measured on the SOURCE pin close to plastic interface. 124 132 140 61.5 66 70.5 ± 4 ± 2 250 75 78 83 28 38 50 10 15 FREQUENCY Pin Connected to SOURCE FREQUENCY Pin Connected to CONTROL 132 kHz Operation 66 kHz Operation IL ≤ IL (DC) or IM ≤ IM(DC) IL or IM = 190 µA TJ = 25 °C; DCMIN to DCMAX Switching Frequency (average) Duty Cycle at ONSET of Fre- quency Reduction Switching Frequency near 0% Duty Cycle Frequency Jitter Deviation Frequency Jitter Modulation Rate Maximum Duty Cycle Soft Start Time 132 kHz Operation 66 kHz Operation Operating Junction Temperature Notes: 1. All voltages referenced to SOURCE, T A = 25 °C. 2. Normally limited by internal circuitry. 3. 1/16" from case for 5 seconds.

35August 8, 2000 E CONTROL FUNCTIONS (cont.) Conditions (Unless Otherwise Specified) See Figure 53 SOURCE = 0 V; TJ = -40 to 125 °C Min Typ MaxParameter Symbol Units See Note A See Figure 7 TJ = 25 °C IC = 4 mA; TJ = 25 °C See Figure 51 DCreg lB lC(OFF) ZC PWM Gain Temperature Drift External Bias Current CONTROL Current at 0% Duty Cycle Dynamic Impedance Dynamic Impedance Temperature Drift Control Pin Internal Filter Pole %/mA/°C mA mA Ω %/°C kHz SHUTDOWN/AUTO-RESTART VC = 0 V VC = 5 V lC (CH) VC(AR)U VC(AR)L VC(AR)hyst DC(AR) f(AR) Control Pin Charging Current Charging Current Temperature Drift Auto-restart Upper Threshold Voltage Auto-restart Lower Threshold Voltage Auto-restart Hysteresis Voltage Auto-restart Duty Cycle Auto-restart Frequency mA %/°C V V V Hz -5.0 -3.5 -2.0 -3.0 -1.8 -0.6 0.5 5.8 4.5 4.8 5.1 0.8 1.0 1.0 TJ = 25 °C See Note A PWM Gain IC = 4 mA; TJ = 25 °C -28 -23 -18 %/mA TOP242-245 TOP246-249 TOP242-245 TOP246-249 -0.01 1.2 2.0 3.0 1.6 2.6 4.0 6.0 7.0 6.6 8.0 10 15 22 0.18

E 7/01 August 8, 2000 Conditions (Unless Otherwise Specified) See Figure 53 SOURCE = 0 V; TJ = -40 to 125 °C Min Typ MaxParameter Symbol Units µA µA µA µA V µA µA µA µA V V V µA %/µA mA 44 50 54 210 225 240 0.5 1.0 1.6 -35 -27 -20 300 400 520 -300 -240 -180 -110 -90 -70 1.90 2.50 3.00 2.30 2.90 3.30 1.26 1.33 1.40 1.18 1.24 1.30 1.24 1.31 1.39 1.13 1.19 1.25 40 60 75 0.25 0.6 1.0 1.0 1.6 TJ = 25 °C TJ = 25 °C Threshold Hysteresis TJ = 25 °C Threshold Hysteresis Line Under-Voltage Threshold Current and Hysteresis (M or L Pin) Line Over-Voltage or Remote ON/ OFF Threshold Current and Hys- teresis (M or L Pin) L Pin Voltage Threshold Remote ON/OFF Negative Threshold Current and Hyster- esis (M or X Pin) L or M Pin Short Circuit Current X or M Pin Short Circuit Current L or M Pin Voltage (Positive Current) X Pin Voltage (Negative Current) M Pin Voltage (Negative Current) Maximum Duty Cycle Reduction Onset Threshold Current Maximum Duty Cycle Reduction Slope Remote OFF DRAIN Supply Current Threshold Hysteresis MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS L or M Pin Shorted to CONTROL VL, VM = VC Normal Mode Auto-restart Mode lL or lM = 50 µA lL or lM = 225 µA lX = -50 µA lX = -150 µA lM = -50 µA lM = -150 µA lUV IOV VL(TH) IREM (N) IL (SC) or IM (SC) IX (SC) or IM (SC) VL, VM VX VM IL (DC) or IM (DC) ID(RMT) VX, VM = 0 V X, L or M Pin Floating TJ = 25 °C IL > IL(DC) or IM > IM (DC) See Figure 70 VDRAIN = 150 V TJ = 25 °C

37August 8, 2000 E ILIMIT IINIT tLEB A A ns Conditions (Unless Otherwise Specified) See Figure 53 SOURCE = 0 V; TJ = -40 to 125 °C Min Typ MaxParameter Symbol Units CIRCUIT PROTECTION FREQUENCY INPUT FREQUENCY Pin Threshold Voltage FREQUENCY Pin Input Current VF = VC VF IF Self Protection Current Limit Initial Current Limit Leading Edge Blanking Time See Note B 2.9 V 10 40 100 µA MULTI-FUNCTION (M), LINE-SENSE (L) AND CURRENT LIMIT (I) INPUTS (cont) Remote ON Delay Remote OFF Setup Time tR(ON) tR(OFF) From Remote On to Drain Turn-On See Note B Minimum Time Before Drain Turn-On to Disable Cycle See Note B 2.5 µs 2.5 µs TOP242 P/G TOP242 Y/R TJ= 25 °C TOP243 P/G TJ= 25 °C TOP243 Y/R TJ= 25 °C TOP244 P/G TJ= 25 °C TOP244 Y/R TJ= 25 °C TOP245 Y/R TJ= 25 °C TOP246 Y/R TJ= 25 °C TOP247 Y/R TJ= 25 °C TOP248 Y/R TJ= 25 °C TOP249 Y/R TJ= 25 °C See Fig. 52 TJ = 25 °C ≤ 85 VAC (Rectified Line Input)

265 VAC

(Rectified Line Input) IC = 4 mA Internal; di/dt=90 mA/µs See Note C Internal; di/dt=150 mA/µs See Note C Internal; di/dt=180 mA/µs See Note C Internal; di/dt=200 mA/µs See Note C Internal; di/dt=270 mA/µs See Note C Internal; di/dt=360 mA/µs See Note C Internal; di/dt=540 mA/µs See Note C Internal; di/dt=720 mA/µs See Note C Internal; di/dt=900 mA/µs See Note C Internal;di/dt=1080 mA/µs See Note C 0.418 0.45 0.481 0.697 0.75 0.802 0.837 0.90 0.963 0.930 1.00 1.070 1.256 1.35 1.445 1.674 1.80 1.926 2.511 2.70 2.889 3.348 3.60 3.852 4.185 4.50 4.815 5.022 5.40 5.778 0.75 x ILIMIT(MIN) 0.6 x ILIMIT(MIN) 220 See Note B

E 7/01 August 8, 2000 Conditions (Unless Otherwise Specified) See Figure 53 SOURCE = 0 V; TJ = -40 to 125 °C Min Typ MaxParameter Symbol Units OUTPUT CIRCUIT PROTECTION (cont) tIL(D) VC(RESET) 100 130 140 150 1.75 3.0 4.25 ns V Current Limit Delay Thermal Shutdown Temperature Thermal Shutdown Hysteresis Power-up Reset Threshold Voltage IC = 4 mA Figure 53, S1 Open RDS(ON) ON-State Resistance TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TJ = 25 °C TJ = 100 °C TOP242 ID = 50 mA TOP243 ID = 100 mA TOP244 ID = 150 mA TOP245 ID = 200 mA TOP246 ID = 300 mA TOP247 ID = 400 mA TOP248 ID = 500 mA TOP249 ID = 600 mA 15.6 18.0 25.7 30.0 7.80 9.00 12.9 15.0 5.20 6.00 8.60 10.0 3.90 4.50 6.45 7.50 2.60 3.00 4.30 5.00 1.95 2.25 3.22 3.75 1.56 1.80 2.58 3.00 1.30 1.50 2.15 2.50 Ω Measured in a Typical Flyback Converter Application Off-State Current Breakdown Voltage Rise Time Fall Time IDSS BVDSS tR tF 400 µA 700 V 100 ns 50 ns VL, VM = Floating; IC = 4mA VDS = 560 V; TJ = 125 °C VL, VM = Floating; IC = 4mA ID = 100 µA; TJ = 25 °C

39August 8, 2000 E Conditions (Unless Otherwise Specified) See Figure 53 SOURCE = 0 V; TJ = -40 to 125 °C Min Typ MaxParameter Symbol Units SUPPLY VOLTAGE CHARACTERISTICS 5.60 5.85 6.10 ±50 1.0 1.6 2.5 1.2 2.2 3.2 0.3 0.6 1.3 V V ppm/°C mA VC(SHUNT) lCD1 lCD2 See Note D IC = 4 mA Output MOSFET Disabled VL, VM = 0 V NOTES: A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in magnitude with increasing temperature, and a positive temperature coefficient corresponds to a decrease in magnitude with increasing temperature. B. Guaranteed by characterization. Not tested in production. C. For externally adjusted current limit values, please refer to Figure 55 (Current Limit vs. External Current Limit Resistance) in the Typical Performance Characteristics section. D. It is possible to start up and operate TOPSwitch-GX at DRAIN voltages well below 36 V. However, the CONTROL pin charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart duty cycle. Refer to Figure 67, the characteristic graph on CONTROL pin charge current (I C) vs. DRAIN voltage for low voltage operation characteristics. DRAIN Supply Voltage Shunt Regulator Voltage Shunt Regulator Temperature Drift Control Supply/ Discharge Current Output MOSFET Enabled VL, VM = 0 V TOP 242-245 TOP 246-249

45August 8, 2000 E PI-2644-040501 Notes: 1. Controlling dimensions are inches. Millimeter dimensions are shown in parentheses. 2. Pin numbers start with Pin 1, and continue from left to right when viewed from the front. 3. Dimensions do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15mm) on any side. 4. Minimum metal to metal spacing at the pack- age body for omitted pin locations is .068 inch (1.73 mm). 5. Position of terminals to be measured at a location .25 (6.35) below the package body. 6. All terminals are solder plated. Y07C PIN 1 PIN 7 MOUNTING HOLE PATTERN .050 (1.27) .150 (3.81) .050 (1.27) .150 (3.81) .050 (1.27) .050 (1.27) .100 (2.54) PIN 1 .010 (.25) M .467 (11.86) .487 (12.37) .400 (10.16) .156 (3.96) .860 (21.84) .880 (22.35) .026 (.66) .032 (.81) .050 (1.27) BSC .150 (3.81) BSC .108 (2.74) REF PIN 1 & 7 7° TYP. PIN 2 & 4 .040 (1.02) .060 (1.52) .190 (4.83) .210 (5.33) .015 (.38) .020 (.51) .095 (2.41) .115 (2.92) .236 (5.99) .260 (6.60) .165 (4.19) .185 (4.70) .040 (1.02) .060 (1.52) .045 (1.14) .055 (1.40) .670 (17.02) REF. .570 (14.48) REF. TO-220-7C TOPSwitch Product Family GX Series Number Package Identifier G Plastic Surface Mount DIP P Plastic DIP Y Plastic TO-220-7C R Plastic TO-263-7C (available only with TL option) Package/Lead Options Blank Standard Configurations TL Tape & Reel, (G Package: 1 k min., R Package: 750 min.) PART ORDERING INFORMATION TOP 242 G - TL (242, 243 & 244 only)

E 7/01 August 8, 2000 SMD-8B PI-2546-040501 .004 (.10) .012 (.30) .036 (0.91) .044 (1.12) .004 (.10) 0 - ° 8° .375 (9.53) .385 (9.78) .032 (.81) .037 (.94) .128 (3.25) .132 (3.35) -D- Notes: 1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 3. Pin locations start with Pin 1, and continue counter-clock Pin 8 when viewed from the top. Pin 6 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 5. Lead width measured at package body. 6. D and E are referenced datums on the package body..057 (1.45) .063 (1.60) (NOTE 5) E S .100 (2.54) (BSC) -E- Pin 1 D S .004 (.10)⊕ G08B Heat Sink is 2 oz. Copper As Big As Possible .420 .046 .060 .060 .046 .080Pin 1 .086 .186 .286 Solder Pad Dimensions Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing. 2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted. 5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T. .010 (.25) .015 (.38) .300 (7.62) BSC (NOTE 7) .300 (7.62) .390 (9.91) .375 (9.53) .385 (9.78) .245 (6.22) .255 (6.48) .128 (3.25) .132 (3.35) .057 (1.45) .063 (1.60) .125 (3.18) .135 (3.43) 0.15 (.38) MINIMUM .048 (1.22) .053 (1.35) .100 (2.54) BSC .014 (.36) .022 (.56) -E- Pin 1 SEATING PLANE -D- -T- P08B DIP-8B PI-2551-101599 D S .004 (.10)⊕ T E D S .010 (.25) M⊕ (NOTE 6)

47August 8, 2000 E .165 (4.19) .185 (4.70) R07C TO-263-7C PI-2664-040501 -A- LD #1 .580 (14.73) .620 (15.75) .396 (10.06) .415 (10.54) .326 (8.28) .336 (8.53) .055 (1.40) .066 (1.68) .100 (2.54) Ref. .208 (5.28) Ref. .026 (0.66) .032 (0.81) .225 (5.72) min. .245 (6.22) min. .000 (0.00) .010 (0.25) .010 (0.25) .090 (2.29) .110 (2.79) .017 (0.43) .023 (0.58) °8 -°0 .045 (1.14) .055 (1.40) .050 (1.27) Notes: 1. Package Outline Exclusive of Mold Flash & Metal Burr. 2. Package Outline Inclusive of Plating Thickness. 3. Foot Length Measured at Intercept Point Between Datum A Lead Surface. 4. Controlling Dimensions are in Inches. Millimeter Dimensions are shown in Parentheses. .004 (0.10) .315 (8.00) .128 (3.25) .038 (0.97) .050 (1.27) .380 (9.65) .638 (16.21) Solder Pad Dimensions

E 7/01 August 8, 2000 Notes 1) Added R package (D2PAK). 2) Corrected abbreviations (s = seconds). 3) Corrected x-axis units in Figure 11 (µA). 4) Added missing external current limit resistor in Figure 25 (RIL). 5) Corrected spelling. 6) Added caption for Table 4. 7) Corrected Breakdown Voltage parameter condition (TJ = 25 °C) 8) Corrected font sizes in figures. 9) Figure 40 replaced. 10) Corrected schematic component values in Figure 44. Date Revision D E KOREA Power Integrations International Holdings, Inc. Rm# 402, Handuk Building 649-4 Yeoksam-Dong, Kangnam-Gu, Seoul, Korea Phone: +82-2-568-7520 e-mail: koreasales@powerint.com WORLD HEADQUARTERS AMERICAS Power Integrations, Inc.

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San Jose, CA 95138 USA Main: +1 408-414-9200 Customer Service: Phone: +1 408-414-9665 Fax: +1 408-414-9765 e-mail: usasales@powerint.com For the latest updates, visit our Web site: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein, nor does it convey any license under its patent rights or the rights of others. The PI Logo, TOPSwitch, TinySwitch and EcoSmart are registered trademarks of Power Integrations, Inc. ©Copyright 2001, Power Integrations, Inc. JAPAN Power Integrations, K.K. Keihin-Tatemono 1st Bldg. 12-20 Shin-Yokohama 2-Chome Kohoku-ku, Yokohama-shi Kanagawa 222-0033, Japan Phone: +81-45-471-1021 Fax: +81-45-471-3717 e-mail: japansales@powerint.com TAIWAN Power Integrations International Holdings, Inc. 17F-3, No. 510 Chung Hsiao E. Rd., Sec. 5, Taipei, Taiwan 110, R.O.C. Phone: +886-2-2727-1221 Fax: +886-2-2727-1223 e-mail: taiwansales@powerint.com EUROPE & AFRICA Power Integrations (Europe) Ltd. Centennial Court Easthampstead Road Bracknell Berkshire, RG12 1YQ United Kingdom Phone: +44-1344-462-300 Fax: +44-1344-311-732 e-mail: eurosales@powerint.com CHINA Power Integrations International Holdings, Inc. Rm# 1705, Bao Hua Bldg.

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Shenzhen, Guangdong 518031 China Phone: +86-755-367-5143 Fax: +86-755-377-9610 e-mail: chinasales@powerint.com INDIA (Technical Support) Innovatech #1, 8th Main Road Vasanthnagar Bangalore, India 560052 Phone: +91-80-226-6023 Fax: +91-80-228-9727 e-mail: indiasales@powerint.com APPLICATIONS HOTLINE World Wide +1-408-414-9660 APPLICATIONS FAX World Wide +1-408-414-9760