ST75LAPA

ST75LAPA SEOUL | Alldatasheet

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www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 1Rev1.1, July 22, 2019 Product Data Sheet Product Brief

Description

Superior high Flux for High Voltage System ST75LAPA

5050 Series

• This White Colored surface-mount LED comes in standard package dimension. Package Size : 5.0x5.0x0.7mm
• It has a substrate made up of a molded plastic reflector sitting on top of a lead frame.
• The die is attached within the reflector cavity and the cavity is encapsulated by silicone.
• The package design coupled with careful selection of component materials allow these products to perform with high reliability
• High Intensity output and high luminance
• Designed for high voltage operation
• SMT solderable
• RoHS compliant
• CRI75
• General lighting
• Architectural lighting
• LED Bulbs
• Decorative / Pathway lighting Part Number CCT CRI Color Min. Typ. Max. ST75LAPA Cool White 6000K 5000K 4700K 75Neutral White 4200K 4000K 3700K Warm White 3200K 3000K 2900K

Table 1. Product Selection Table

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 2Rev1.1, July 22, 2019 Table of Contents Index

• Product Brief 1
• Table of Contents 2
• Performance Characteristics 3
• Characteristics Graph 4
• Color Bin Structure 13
• Mechanical Dimensions 14
• Recommended Solder Pad 15
• Reflow Soldering Characteristics 16
• Emitter Tape & Reel Packaging 17
• Handling of Silicone Resin for LEDs 19
• Precaution For Use 20
• Company Information 23

Table 3. Absolute Maximum Ratings (1) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements. (2) ФV is the total luminous flux output as measured with an integrating sphere. (3) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.005, CCT 5% tolerance. (4) Tolerance is 2.0 on CRI measurements.

• Calculated performance values are for reference only.
• All measurements were made under the standardized environment of Seoul Semiconductor.
• Thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly.

Table 2. Characteristics, IF=180mA, Tj=25ºC Viewing Angle 2Θ1/2 - 120 - deg.

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 4Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Angle [deg.] Relative Luminous Flux [a.u.] 350 400 450 500 550 600 650 700 750 800 0.0 0.2 0.4 0.6 0.8 1.0 Relative Spectral Power Distribution Wavelength [nm] Cool White Neutral White Warm White Fig 1. Color Spectrum, Tj=25℃, IF=180mA Fig 2. Radiant pattern, Tj=25℃, IF=180mA

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 5Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj=25℃ Fig 4. Forward Current vs. Relative Luminous Flux, Tj=25℃ 0 1 2 3 4 5 6 7 8 100 200 300 400 500 600 700 800 900 1000 Forward Current [IF, mA] Forward Voltage [VF, V] 100 200 300 400 500 600 700 800 900 1000 Relative luminous flux [a.u.] Forward Current [mA]

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 6Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph 0.370 0.375 0.380 0.385 0.390 360mA 1000mA 100mA 640mA CIE Y CIE X 180mA Fig 5. Forward Current vs. CIE X, Y Shift , Tj=25℃ (4700K~7000K) (3700K~4700K) 0.330 0.335 0.340 0.345 0.350 0.355 0.360 0.365 360mA 1000mA 100mA 640mA CIE Y CIE X 180mA

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 7Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph 0.390 0.395 0.400 0.405 0.410 360mA 1000mA 100mA 640mA CIE Y CIE X 180mA Fig 5. Forward Current vs. CIE X, Y Shift , Tj=25℃ (3700K~2600K)

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 8Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph Fig 6. Relative Light Output vs. Junction Temperature, IF=180mA Fig 7. Relative Forward Voltage vs. Junction Temperature, IF=180mA 20 40 60 80 100 120 1400.7 0.8 0.9 1.0 1.1 Relative Forward Voltage [a.u.] Junction Temperature [oC] 20 40 60 80 100 120 1400.7 0.8 0.9 1.0 1.1 Junction Temperature [oC] Relative Light Output [a.u.]

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 9Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph Fig 8. Junction Temp. vs. CIE X, Y Shift, IF=180mA (4700K~7000K) (3700K~4700K) 20 40 60 80 100 120 140 -0.020 -0.015 -0.010 -0.005 0.000 0.005 CIE X CIE Y Junction Temperature [oC] 20 40 60 80 100 120 140-0.016 -0.012 -0.008 -0.004 0.000 0.004 CIE X CIE Y Junction Temperature [oC]

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 10Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph 20 40 60 80 100 120 140-0.016 -0.012 -0.008 -0.004 0.000 0.004 CIE X CIE Y Junction Temperature [oC] Fig 8. Junction Temp. vs. CIE X, Y Shift, IF=180mA (2600K~3700K)

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 11Rev1.1, July 22, 2019 Product Data Sheet Characteristics Graph 0 25 50 75 100 125 200 400 600 800 1000 1200 Rth j-a = 5K/W Rth j-a = 10K/W Rth j-a = 15K/W Forward Current (mA) Ambient Temperature ( O Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=125℃, IF=1000mA

• All measurements were made under the standardized environment of Seoul Semiconductor.

Table 4. Bin Code description Table 5. Luminous Flux & Forward Voltage rank distribution

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 13Rev1.1, July 22, 2019 Color Bin Structure CIE Chromaticity Diagram (Cool white), Tj=85℃, IF=180mA 5700K 4Step 5000K 4Step 4B 4C Center point 0.3287 : 0.3417 Center point 0.3447 : 0.3553 Major Axis a 0.0095 Major Axis a 0.0108 Minor Axis b 0.0040 Minor Axis b 0.0047 Ellipse Rotation Angle 59 Ellipse Rotation Angle 60 5700K 5Step 5000K 5Step 5B 5C Center point 0.3287 : 0.3417 Center point 0.3447 : 0.3553 Major Axis a 0.0118 Major Axis a 0.0135 Minor Axis b 0.0050 Minor Axis b 0.0058 Ellipse Rotation Angle 59 Ellipse Rotation Angle 60 0.34 0.36 0.38 0.40 0.42 5G 3000K 4000K 5000K 5600K 4000K 4Step 3000K 4Step 4E 4G Center point 0.3818 : 0.3797 Center point 0.4338 : 0.4030 Major Axis a 0.0125 Major Axis a 0.0113 Minor Axis b 0.0053 Minor Axis b 0.0055 Ellipse Rotation Angle 53 Ellipse Rotation Angle 53 4000K 5Step 3000K 5Step 5E 5G Center point 0.3818 : 0.3797 Center point 0.4338 : 0.4030 Major Axis a 0.0157 Major Axis a 0.0142 Minor Axis b 0.0067 Minor Axis b 0.0068 Ellipse Rotation Angle 53 Ellipse Rotation Angle 53

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 14Rev1.1, July 22, 2019 Mechanical Dimensions Notes : Cathode Mark Cathode Anode Mark < Top View > < Bottom View > < Side view> (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 15Rev1.1, July 22, 2019 Recommended Solder Pad Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm (4) This drawing without tolerances are for reference only.

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 16Rev1.1, July 22, 2019 Reflow Soldering Characteristics Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Table 7. Caution IPC/JEDEC J-STD-020 (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board.

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 17Rev1.1, July 22, 2019 Emitter Tape & Reel Packaging (1) Quantity : 7 inch reel type ( 1,000 pcs / Reel ± 1pcs) (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Cathode Mark Symbol W T K0 A0 B0 E Dimension (㎜) 12.00 ±0.10 0.30 ±0.30 0.95 ±0.10 5.30 ±0.10 5.30 ±0.10 1.75 ±0.10 Symbol F D0 D1 P0 P1 P2 Dimension (㎜) 5.50 ±0.10 1.60 ±0.10 1.60 ±0.10 4.00 ±0.10 8.00 ±0.10 2.00 ±0.10 Notes : (-) (+)

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 18Rev1.1, July 22, 2019 Emitter Tape & Reel Packaging

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 19Rev1.1, July 22, 2019 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space.

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 20Rev1.1, July 22, 2019 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use SMT techniques properly when you solder the LED as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 21Rev1.1, July 22, 2019 Precaution for Use (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is electrically isolated. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 22Rev1.1, July 22, 2019 Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device

www.seoulsemicon.com Product Data Sheet ST75LAPA - 5050 Series 23Rev1.1, July 22, 2019 Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice.