SSL54F FOSHAN | Alldatasheet
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SSL54F~SSL56F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 1 / 6 表面贴装肖特基整流二极管，反向电压：40~60V，正向电流：5.0A，薄型 SMAF 封装。 Surface Mount Schottky Barrier Rectifier, Reverse Voltage：40 to 60 V, Forward Current:5.0A ,SMAF thin package. 低功耗，高效率，正向浪涌电流大，适用于低压高频逆变器和极性保护，表面贴装。无卤产品。 Low power loss, high efficiency, High forward surge current capability, For use in low voltage, high frequency inverters, and polarity protection applications,For surface mounted applications.Halogen free product. 一般用途. General purpose. 印章代码 / M a r k i n g 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g
SSL54F~SSL56F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit SSL54F SSL56F Maximum Repetitive Peak Reverse Voltage VRRM 40 60 V Maximum RMS voltage VRMS 28 42 V Maximum DC Blocking Voltage VDC 40 60 V Maximum Average Forward Rectified Current IF（AV） 5.0 A Peak Forward Surge Current,8.3ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) IFSM 150 A Typical Junction Capacitance1) Ci 800 500 pF Typical Thermal Resistance2) RθJA 45 ℃/W Operating Junction Temperature Range Tj -55~125 ℃ Storage Temperature Range Tstg -55~150 ℃ Note: 1） Measured at 1MHz and applied reverse voltage of 4 V D.C. 参数 Parameter 符号 Symbol 测试条件 Test Conditions 数值 Rating 单位 Unit SSL54F SSL56F Max Instantaneous Forward Voltage VF IF=5.0A 0.45 0.55 V Maximum DC Reverse Current at Rated DC Reverse Voltage I R Ta=25℃ 1.0 mA Ta=100℃ 5.0 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)
SSL54F~SSL56F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve
SSL54F~SSL56F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions
SSL54F~SSL56F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions
SSL54F~SSL56F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SMAF 3000 5 15000 5 75000 7 〞×11 185X180X105 550X220X210 使用说明 / N o t i c e s