SSC-HYT722 SEOUL | Alldatasheet

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Technical content

*Customer: SPECIFICA TION ITEM TOP LED DEVICE MODEL SSC-HYT722 [Contents] CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 1/11 - SSC-HYT722SSC-QP-7-03-08(REV.00)

  1. Features Pb-free Reflow Soldering application RoHS Compliant Ma terial : AlInGaP Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Epoxy Resin 2. Application Indoor and outdoor displays LCD Backlights etc. Yellow – displays Autom otive Signage and Channel letter Indicato r 3. Absolute Maximum Ratings *1 (Ta=25ºC) Parameter Symbol Value Unit Power Dissipation Pd 252 mW Forward Current IF 90 mA Forward Peak Surge Current (per die) IFM *2 100 mA Reverse Voltage (per die) VR 5 V Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 2/11 - SSC-HYT722SSC-QP-7-03-08(REV.00)
  1. Electro-Optical Characteristics (Ta=25ºC) Parameter Symbol Condition Min Typ Max Unit Forward Voltage (per die) VF IF =20 mA 1.6 2.2 2.8 V Reverse Current (per die) IR VR=5V - - 10 µA Luminance Intensity *1 IV IF =60 mA 950 1400 1700 mcd Luminance Flux Φ V IF =60 mA - 4 - lm Dominant Wavelength λd IF =60 mA 582 590 598 nm Peak Wavelength λP IF =60mA - 593 - nm Spectral Bandwidth ∆λ IF =60 mA - 18 - nm Viewing Angle *2 2θ½ IF =60 mA - 120 - deg Optical Efficiency η opt IF =60 mA - 30 - lm/W *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 3/11 - SSC-HYT722SSC-QP-7-03-08(REV.00)
  1. Rank of HYT722 SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 4/11 - SSC-HYT722SSC-QP-7-03-08(REV.00) ▣ Rank Name Table X1 X2 X3 Iv λdV f ▣ Luminous Intensity [Iv] MIN MAX N 950 1150 O 1150 1400 P 1400 1700 ▣ Dominant Wavelength [λd] MIN MAX A 582 586 B 586 594 C 594 598 ▣ Forward Voltage MIN MAX 11 .6 2.0 22 .0 2.4 32 .4 2.8 Rank Name Vf (V) Rank Name λd (nm) Rank Name Iv (mcd)

6.Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 5/11 - SSC-HYT722SSC-QP-7-03-08(REV.00) Pre-heating 200 180 150 ~ Temp [°C] 220 240 260 Rising 5 °C/sec Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (min) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Cooling -5 °C/sec Time [Hr]

  • MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Epoxy Resin Electrodes Ag Plating Copper Alloy SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 6/11 - SSC-HYT722SSC-QP-7-03-08(REV.00) Rear ViewRight ViewFront View Package Outlines 1 23 456 Package Marking (Anode) 7. Outline Dimension And Material ( Tolerance: ±0.2, Unit: mm ) Recommended Solder PadCircuit Diagram 6 5 Yellow Anode Yellow Cathode Yellow Anode Yellow Cathode Yellow Anode Yellow Cathode Y1 Y2 Y3

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 7/11 - SSC-HYT722SSC-QP-7-03-08(REV.00) 8. Packing (1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Packa ge : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package ( Tolerance: ±0.2, Unit: mm )

  1. Reel Packing Structure SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 8/11 - SSC-HYT722SSC-QP-7-03-08(REV.00) QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX Outer Box Structure PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. QUANTITY : XXXX XXX XXX a TOP LED RoHS bac SIDE 2457inch 220 142 SEOUL SEMICONDUCTOR CO., LTD. Material : Paper(SW3B(B)) SIZE (mm)TYPE b c QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX Reel Aluminum Vinyl Bag PART NUMBER : XXXXXXXXXX HUMIDITY INDICATOR DESI PAK XXX SEOUL SEMICONDUCTOR CO., LTD. LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX
  1. Lot Number The lot number is composed of the following characters; H YT First Part Name ○ Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) # ~# The number of the internal quality control PART NUMBER : HYT722 XXX LOT NUMBER : HYT70426 01 512 SEOUL SEMICONDUCTOR CO., LTD. QUANTITY : 700 SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 9/11 - SSC-HYT722SSC-QP-7-03-08(REV.00)
  1. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is c orrespond to SMD, whe n L ED be solde red di p, interfacial se paration m ay affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the cas e of m ore tha n 1 week pa ssed after opening o r change col or of indicator on desi ccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) T his de vice sh ould not be use d i n a ny type of fl uid s uch as water, oil, o rganic s olvent et c. When washing is required, IPA should be used. (9) When the LEDs are illumin ating, operating current should be decided after con sidering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 10/11 - SSC-HYT722SSC-QP-7-03-08(REV.00)
  1. Characteristic Diagram SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 11/11 - SSC-HYT722SSC-QP-7-03-08(REV.00) 0 204 06 08 0 100 Foward Current IF[mA] Ambient Temperature TA[ o

3 Chip ON

Forward Voltage VF[V] Forward Current IF[mA] 0 30 60 90 120 150 180 210 240 270 300 6 Relative Luminous Intensity IV/IV(25oC)[a.u.] Forward Current IF[mA] < total Forward Current vs Forward Voltage (per die) Forward Current Derating Curve (per die) (Ta=25ºC) (Ta=25ºC) Relative Luminous Intensity vs Forward Current (Total) Radiation Diagram (TA=25ºC) -90 -60 -30