SSC-HB1701 SEOUL | Alldatasheet

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Technical content

*Customer: SPECIFICATION ITEM CHIP LED DEVICE MODEL SSC-HB1701 Revision Date [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Charact eristic Diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use 10. Reliability Result 11. RoHS Customer Approved by Approved by Approved by Supplier Drawn by Checked by Approved by SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 1/7- SSC-HB1701Seoul Semiconductor SSC-QP-0401-06(REV.0) Pb Free

  1. Features Package : 2.1×0.6×0.9 mm Untinted, Clear mold Wavelength : 465㎚ Reverse type 2. Absolute Maximum Ratings ( Ta=25℃) Parameter Symbol Value Unit Power Dissipation PD 64 ㎽ Forward Current IF 20 ㎃ Peak Forward Current IFM *1 50 ㎃ Reverse Voltage VR 5 V Operating Temperature Topr -35 ~ 85 ℃ Storage Temperature Tstg -40 ~100 ℃ *1 I FM conditions: Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10 3. Electro-Optical Characteristics ( Ta=25℃) Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF=5㎃ 2.75 3.05 3.15 V Reverse Current IR VR=5V - - 10 ㎂ Luminous Intensity*2 IV IF=5㎃ 11 17 27 mcd Wavelength λ D IF=5㎃ 460 465 470 ㎚ Spectral Bandwidth Δλ IF=5㎃ - 25 - ㎚ Viewing angle*3 2θ 1/2 IF=5㎃ - 150 - ˚ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the l isted minimum and maximum specifications for electric and optical characteristics, when operated at 5mA, 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 2/7- SSC-HB1701SSC-QP-0401-06(REV.0) (Tolerance: VF ±0.1V, IV ±10%, λd ±2nm)
  1. Characteristic Diagrams #350 #25 #20 SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 3/7- SSC-HB1701SSC-QP-0401-06(REV.0) Forward Current Derating Curve Radiation Diagram Luminous Intensity vs Forward Current 0 5 10 15 20 25 30 100 150 200 250 300 400 Relative Intensity IV [%] Forward Current IF [mA] -25 0 25 50 75 100 15Forward current IF(mA) Ambient temperature Ta( )℃ Forward Current vs Forward Voltage 100 Forward Current IF[mA] Forward Voltage VF [V] 120 150 180

5.Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 240℃max. for 5 seconds max. Temperature rise: 5°C/sec. -5°C/sec. Cooling: Pre-heating Operation heating 60 to 120 sec. 5sec. max 120 150 240 LED Surface tem perature (2) Lead-Free Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 260℃max. for 10 seconds max. 120 60 to 120 sec. 260 150 LED Surface temperature Pre-heating rise: 5°C/sec. Temperature Operation heating -5°C/sec. Cooling: 10 sec. (3) Hand Soldering conditions -Not more than 3 seconds @MAX280℃, under Soldering iron. SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 4/7- SSC-HB1701SSC-QP-0401-06(REV.0) [Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.

0.5 2.1 0.6 Cathode Anode 0.3 0.48

0.3 Ho le

0.4 1.3 1.0 1.1 0.9 7. Packing 4.0 2.0 4.0 2.3 1.25 1.75 8.0 (2.75) 3.5 0.7 1.30 0.2 (1) Quantity : 3,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10˚ angle to be the carrier tape. (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 5/7- SSC-HB1701SSC-QP-0401-06(REV.0) Tolerance: ±0.2, Unit: ㎜

  1. Reel Packing Structure 제품명 SSC-HB1701 SIZE(mm)TYPE 142 c a CHIP LED b CHIP LED PART : SSC-HB1701 CODE : DATE : LOT NO : SEOUL SEMICONDUCTOR CO.,LTD c 7inch 245 a 220 b Aluminum Vinyl Bag Outer Box Reel *Material: Paper(SW3B(B)) 제품명 SSC-HB1701 수량 : 3000 수량 : 3000 Q'YT :30,000EA SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 6/7- SSC-HB1701SSC-QP-0401-06(REV.0)
  1. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5℃~30℃ H umidity : 60%HR max. (2) Attention after opened However LED is co rresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction T emperature : 5 ~40 Hu midity : less than 30%℃℃ (3) In case o f more than 1 week passe d after o pening or change col or of indicator o n desi ccant components shall be dried 10-12hr. at 60±5 .℃ (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 80±5 or 12Hr at 100±5 .℃℃ (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (10) When the LEDs are illumin ating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored t o maintain a clean atm osphere. If t he LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. (15) Static Electricity and surge damages the Blue/Green LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be properly grounded. (16) It is recommended to use individual resistor separately when the LEDs applies in parallel circuit so that it may improve the light deviations. SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 7/7- SSC-HB1701SSC-QP-0401-06(REV.0)