SS22F UMW | Alldatasheet
Document overview
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Technical content
Features
Metal silicon junction, majority carrier conduction For surface mounted applications Low power loss, high efficiency High forward surge current capability For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications MECHANICAL DATA
- Case: SMAF
- Terminals: Solderable per MIL-STD-750, Method 2026
- 27mg / 0.00095ozApprox. Weight: 0.5 T = 2 5°Ca T =100 °Ca IR 0.3 80Typical Thermal Resistance ° C/W RθJA UMW SS22F THRU SS220F （1） （2） Measured at 1 MHz and applied reverse voltage of 4 V D.C （2） （1） 20V-200V 2A UMW R R www.umw-ic.com 1 友台半导体有限公司友台半导体有限公司
Fig.4 Typical Junction Capacitance 0.1 Junction Capacitance ( pF) Reverse Voltage (V) 100 200 500 1001 SS22F/SS24F SS26F-SS220F T =25J °C 0.1 0 0.4 1.4 Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) 1.0 SS22F/SS24F SS26F/SS28F SS210F/SS212F SS215F/SS220F Fig.1 Forward Current Derating Curve 0.5 1.0 1.5 2.0 2.5 3.0 0.0 25 50 75 100 125 150 Average Forward Current (A) Single phase half-wave 60 Hz resistive or inductive load 10 1001 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles at 60Hz 8.3 ms Single Half Sine Wave (JEDEC Method) SS22F-SS28F SS210F-SS220F Fig.2 Typical Reverse Characteristics Instaneous Current ( μA)Reverse 20 40 60 800 T =25J °C T =100J °C Percent of Rated Peak Reverse Voltage （%） 100 10 0 101 10 2 10 3 10 4 T =75J °C SS22F/SS24F SS26F-SS220F 0.01 100 100 Fig.6- Typical Transient Thermal Impedance Transient Thermal Impedance （ /W）°C t, Pulse Duration （sec） 0.1 1 10 Case Temperature ( °C) UMW SS22F THRU SS220F 20V-200V 2A UMW R Rwww.umw-ic.com 2 友台半导体有限公司友台半导体有限公司
ww.umw-ic.com 3 友台半导体有限公司 UMW SS22F THRU SS220F 20V-200V 2A UMW R R