SPWW8F0E SEOUL | Alldatasheet
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Technical content
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Specification SPWW8F0E Customer Customer Customer Customer Approval Approval Drawn SSC SSC SSC SSC
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) SPWW8F0E 1. Description 2. Absolute Maximum Ratings 3. Electro- Optical Characteristics 4. Characteristic Diagram 5. CIE Chromaticity Diagram 6. Binning Table 7. Outline Dimension 8. Reel Structure 9. Packing 10. Soldering 11. Precaution for use 12. Handling of silicon Resin LEDs
서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com SPWW8F0E
Features
Applications
It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame (AG Plating). The die is attached within the reflector cavity and the cavity is encapsulated by silicone The high reliability feature is crucial to automotive front, Interior lamp and General Lights 1. Description SPWW8F0E SPWW8F0E SPWW8F0E SPWW8F0E
- Industry Standard SMT package
- Low thermal resistance
- Lead free product
- RoHS Compliant
- Lighting
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) ℃125 T jJunction Temperature ℃-40 ~ +100 T stg St orage Temperature K/W 13 R th-J S Thermal Resistance ℃-40 ~ +85 T opr Operating Temperature mA 100 (min.) 300 (typ.) 400 (max.) I F Forward Current (Ta = 25℃) W1P dPower Dissipation [1] Unit Value Symbol Parameter [1]. Care is to be taken that power dissipation doe s not exceed the absolute maximum rating of the pro duct. 3. Electro-Optical characteristics [1]. The lum inous Flux was m easured at the peak of the spatial pattern which m ay not be aligned with the m echanical axis of the LED package. Luminous Fl ux Measurem ent allowance is ±10% [2]. Correlated Color Tem perature is derived from t he CIE 1931 Chromaticity diagram. Color coordinate : 0.005, CCT ± 5% tolerance [3]. 2 θ ½ is the off-axis where the lum inous intensity is 1/2 of the peak intensity.
3000 KCCT Correlated Color Temperature [ 2]
-80 RaCRI deg. 120 2θ ½Viewing Angle [ 3] lm 95 Φ VLuminance Flux [ 1] V3.75 3.4 -VFForward Voltage Unit Max Typ Min Symbo lParameter 2. Absolute Maximum Ratings (IF=300mA)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 4. Characteristic Diagram J unc tion Te mperat ure [ T j ] Relative Forward Voltage Wavelength vs. Relative Spectral Power Distribution (IF=300mA) 25 50 75 100 125 150 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 4. Characteristic Diagram Forward Current vs. Forward Voltage Relative Luminous Intensity vs Forward Current (Ta=25 OC ) For ward Vo ltage V F (V) Forward Current I F A ] Relative Lum inous Flux For ward Current I F [ mA] (Ta=25 OC ) 100 200 300 400 0 100 200 300 400 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 4. Characteristic Diagram J unc tion Te mperat ure [ T j ] Relative Forward Voltage Relative Forward Voltage vs. Junction Temperature Relative Lum inous Intensity Relative Luminous Intensity vs. Junction Temperature (IF=300mA) (IF=300mA) J unc tion Te mperat ure [ T j ] 25 50 75 100 125 150 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 4. Characteristic Diagram J unc tion Te mperat ure [ T j ] Relative Dom inant wavelength Relative Dominant Wavelength vs. Junction Temperature (IF=300mA) 25 50 75 100 125 150
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 0 20 40 60 80 100 120 140 100 200 300 400 500 4. Characteristic Diagram -90 -60 -30 Radiation Diagram Ambient Temperature vs. Forward Current Te mperat ure [ T ] Forward Current I F A ] Te mperat ure [ T ] 1.Rja = 35 1.Rja = 35 1.Rja = 35 1.Rja = 35 ℃℃ ℃℃ /W /W /W /W 2. 2. 2. 2.Rja = 45 Rja = 45 Rja = 45 Rja = 45 ℃℃ ℃℃ /W /W /W /W 3. 3. 3. 3.Rja = 55 Rja = 55 Rja = 55 Rja = 55 ℃℃ ℃℃ /W /W /W /W tt tt tt tt tt tt
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 0.34 0.36 0.38 0.40 0.42 0.44 0.46 ENERGE STAR RANK 2600K 2700K 2900K 3000K 3200K 3500K 3700K CIE X CIE Y G4 G5 H8 H9 H0 H1 H2 H3 H4 H5 H6 H7 5. CIE Chromaticity Diagram CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y H0 H1 F5 F6 F7 F8 F9 F0 F1 F2 F3 G2 G3 G4 G6 G7 G8 G9 H2 H3 H4 H5 H6 H7 H8 H9
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 109 100 U2 118 109 U3 100 91 U1 91 80 T2 Max. Min. Bin Code Luminous Flux (lm) @ IF =300mA Bin Code Forward Voltage (V) @ IF =300mA Luminous Flux (lm) @ IF =300mA Color Chromaticity Coordinate @ IF =300mA Available ranks 3.75 3.50 J 3.50 3.25 I 3.25 3.0 H Max. Min. Bin Code Forward Voltage (V) @ IF =300mA Max. Min. Bin Code Ref. 10 pages Color Chromaticity Coordinate @ IF =300mA 6. Binning Table
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) ( Tolerance: ± 0.2, Unit: mm ) < Package Outline > < Solder Pattern > 7. outline dimension
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 180 15.4± 1.0 13± 0.3 8. Reel Structure ( Tolerance: ± 0.2, Unit: mm ) (1) Quantity : 1,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 4.80± 0.1 (4.75) 12.0± 0.2 0.25± 0.05 4± 0.1 2± 0.05 8.0± 0.1 Φ 1.5+0.1, - 0 Φ 1.5 min Package Marking
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 9. Packing
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 10 sec. Max. Soldering time Condition 240 ℃℃ ℃℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time Lead Solder 10 sec. Max. Soldering time Condition 260 ℃℃ ℃℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time Lead Free Solder Lead Solder 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Lead-free Solder 1~5 C / sec. o o o o1~5 C / sec. Pre-heating 150~200 C 120sec. Max. 60sec. Max. Above 220 C o260 C Max. 10 sec. Max. 10. Soldering
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 ± 5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. 11. precaution for use
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.00 Rev. 0.00 March 2011. March 2011. www.Acrich.comwww.Acrich.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) 12. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.