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(a) (b) (d) 1. PART NO. EXPRESSION : (b) Dimension code (a) Series code 2. CONFIGURATION & DIMENSIONS : SPS201610D SERIESSMD POWER INDUCTOR PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.08.2013 BD 0.80 Ref. E Unit:m/m 2.0 A C 1.02 Max. 0.60 Ref. SUPERWORLD ELECTRONICS (S) PTE LTD S P S 2 0 1 6 1 0 D R 2 4 M F +0.3 -0. 1 1.6 +0.3 -0. 1 A BC D E D 3. MATERIALS : (a) Core : Ferrite Core (b) Coating : Epoxy with magnetic powder (c) Termination : Tin Pb Free (d) Wire :Enameled Copper Wire c d b a (e) (e) Tolerance code : M=±20% (d) Inductance code : R24 = 0.24 μH Exposed wire tolerance limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. b a w (c) (c) Material code (f) (f) F : RoHS Compliant
PG. 2 4. ELECTRICAL CHARACTERISTICS : SPS201610DR24MF Part Number 0.56 1.0 2.2 0.68 0.24 Inductance ( μH ) DCR ±20% 0.180 0.065 0.108 Max. ( Ω ) 0.065 0.045 Isat 1.45 2.60 2.50 2.80 4.40 Max. ( A )Frequency 0.1V/1M ( Hz ) TestTolerance ( % ) 2.80 1.60 3.20 3.50 Typ. ( A ) 5.20 Isat 0.1V/1M 0.1V/1M 0.1V/1M 0.1V/1M SUPERWORLD ELECTRONICS (S) PTE LTD DCR 0.150 0.055 0.090 Typ. ( Ω ) 0.050 0.035 Irms 1.60 2.80 2.30 2.90 3.30 Typ. ( A ) Irms 1.45 2.50 2.00 2.40 2.90 Max. ( A ) SPS201610DR56MF SPS201610DR68MF SPS201610D1R0MF SPS201610D2R2MF ±20% ±20% ±20% ±20% 5. GENERAL SPECIFICATION : 15.08.2013 NOTE : Specifications subject to change without notice. Please check our website for latest information. (b) Isat：Based on inductance change ( ΔL/L0：≦-30%) (c) Irms：Based on temperature rise ( ΔT：40°C) (a) ambient temp. : 25°C (d) Operating Temperature : -40~+85°C (For products in unopened tape package, less than 40°C) SMD POWER INDUCTOR SPS201610D SERIES
SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 Bending More than 95% of the terminal electr ode Terminal Strength Solderability Test should be covered with solder. seconds Preheating 245°C 150°C 4±1 seconds cooling Dipping Natural Solder : Sn99.5%-Cu0.5% Flux for lead free: Rosin.9.5% Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder Temperature : 245±5°C Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. (>0805:1kg <=0805:0.5kg)to the side of a for 60 +1 seconds. Also the force shall be applied gradually as not to shock the Component mounted on a PCB apply a forc device being tested. This force shall be applied component being tested. following dimensions:>=0805:40x 100x1.2mm Bending depth:>=0805:1.2mm <0805:0.8mm Shall be mounted on a FR4 substrate of the Duration of 10 sec for a min. <0805:40x100x0.8mm Depth: completely cover t he t erminat ion Resistance to Soldering Refer to standard electrical characteristics list PERFORMANCE Electrical Characteristics Test Inductance L ITEM Agilent-4291, Agilent- 4287 Agilent-4291 TEST CONDITION Appearance ：No damage. to drop approximately ΔL(%). Saturation DC Current (Isat) will cause L0 Agilent-4338 Heat Base on temp. rise & ΔL/L0A 30%.≦ Q SRF DC Resistance Rated Current rise approximately ΔT(°C) without core loss. Heat Rated Current (Irms) will cause the coil temperature ΔT 40°CMaxTemperature Rise Test 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Mechanical Performance Test 150°C 10±1.0 seconds seconds Preheating 260°C Dipping Natural cooling Agilent-4192, Agilent- 4285 Inductance ：within±10% of initial value Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Preheat: 150°C,60sec. Solder: Sn99.5%-Cu0.5% Solder tamperature: 260±5°C Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 10±1sec. Temp.: 260±5°C 7. RELIABILITY & TEST CONDITION : Inductance ：within±10% of initial value Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value 15.08.2013 NOTE : Specifications subject to change without notice. Please check our website for latest information. SMD POWER INDUCTOR SPS201610D SERIES
SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 Shock ITEM Test condition: PERFORMANCE TEST CONDITION Life test Humidity : 85±2% RH. Temperature : 85±2°C Duration: 1000hrs Min. with 100% rated current Duration : 1000± 12hrs Applied Current : rated current Temperature : 125±2 ( bead),℃ Measured at room temperature after placing for 24±2 hrs. Measured at room temperature after placing for 24±2 hrs. Load Humidity Thermal Shock Number of cycles : 500 Step2 : +25±2°C 0.5min≦ Measured at room temperature after placing for 24±2 hrs. Condition for 1 cycle Step1 : -40±2°C 30±5 min. IR>1GΩInsulation Resistance Chip Inductor Only Test Voltage:100±10%V for 30Sec. 7. RELIABILITY & TEST CONDITION : Vibration Test Equipment ： Vibration checker Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Oscillation Fr equency: 10 ～2K～10Hz for 20 minutes Total Amplitude:0. 15mm±10% Step3: +105±2°C 30±5min Peak Value (g's) Type Normal duration (D)(ms) Wave form Veloclty change (Vi)ft/sec SMD Lead 1.500 0.5 Half-sine 15.4 100 6 Half-sine 12.3 Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value 85±2 (inductor)℃ Number of cycles : 500 Step2 : +25±2°C 0.5min≦ Measured at room temperature after placing for 24±2 hrs. Chip Inductor Only Step1 : -40±2°C 30±5 min. Step3: +105±2 30±5min℃ Condition for 1 cycle 15.08.2013 NOTE : Specifications subject to change without notice. Please check our website for latest information. Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value Q：Shall not exceed the specification value. RDC ：Shall not exceed the specification value. Appearance ：No damage. Inductance ：within±10% of initial value Moisture Resitance SMD POWER INDUCTOR SPS201610D SERIES
PG. 7 8. SOLDERING AND MOUNTING : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a) Preheat circuit and products to 150°C. b) 355°C tip temperature (max) c) Never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. Reflow times: 3 times Max. Time(sec.) 60~150s 20~40s Soldering TEMPERATURE ° C480s max. 60~180s 150 TP(260°C /40s m ax . ) 217 200 Preheating Note : Gradual Cooling cooling Natural TEMPERATURE ° C Over 60s Iron Soldering times: 1 times Max. Preheating 350 150 w i t h i n 4-5s Soldering e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) cooling Natural 8-1. Recommended PC Board Pattern 9-2.2 Soldering Iron (Figure 2) : 9-2.1 Lead Free Solder Re-flow : wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused Recommended temperature profiles for re-flow soldering in Figure 1. air soldering tools. 9-2. Soldering 2.4 1.8 0.8 Time(sec.) SUPERWORLD ELECTRONICS (S) PTE LTD 15.08.2013 NOTE : Specifications subject to change without notice. Please check our website for latest information. SMD POWER INDUCTOR SPS201610D SERIES Fig.1 Fig.2
- PACKAGING INFORMATION : 9-1. Reel Dimension D B C A C(mm) 13±0.8 7" x 8mm 7" x 8mm 50 Min.8.4±1.0 Type B(mm)A( mm) 178±2 D(mm) P Po:4±0.1 9-2 Tape Dimension / 8mm P2:2±0.05 W:8.0±0.1 Ao Bo Ko t Ko(mm) Series Bo(mm)Ao(mm) 4.0±0.1 P( mm) 0.23±0.05 t(mm) 9-3 Packaging Quantity Chip / Reel 2000 Series SPS201610 Bottom View SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 15.08.2013 NOTE : Specifications subject to change without notice. Please check our website for latest information. SMD POWER INDUCTOR SPS201610D SERIES
a) Temperature and humidity conditions : Less than 40°C and 60% RH. To maintain the solderabililty of terminal electrodes : b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. Transportation : 1. Storage Conditions : 9-4. Tearing Off Force Top cover tape F 165° to 180° 860~1060 Room atm in the arrow direction under the following conditions. The force for tearing off cover tape is 15 to 80 grams Base tape 5~35 (°C) Room Temp. (%) 45~85 Room Humidity (mm/min) Tearing Speed (hPa) 300 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 15.08.2013 NOTE : Specifications subject to change without notice. Please check our website for latest information. SMD POWER INDUCTOR SPS201610D SERIES