SPA252010FAR24M SUPERWORLD | Alldatasheet

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Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 1. Part No. Expression: S P A 2 5 2 0 1 0 F A □ □ □ M (a) (b) (c) (d) (e) a) Series Code d) Inductance Code b) Dimension Code e) Tolerance Code c ) T y p e C o d e 2. Configuration & Dimensions: Unit: mm A B C D E L G H Recommended PC Board Pattern H L G

Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 3. Material List: 4. General Specification: (a) Core (b) Glue (c) Termination (d) Wire (a) Operating Temp. : -40°C to +125°C (including self-temperature rise) (b) Storage Temp. : -40°C to +125°C (on board) (c) Humidity Range : 85 ± 2% RH (d) Heat Rated Current (Irms) will cause the coil temperature rise approximately ∆t of 40°C (keep 1min) (e) Saturation Current (Isat Typ.) will cause L0 to drop approximately 30%. (f) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. (g) Storage condition (component in its packaging) i) Temperature: Less than 40°C ii)Humidity : 60% RH Appearance of exposed wire tolerance limit : 1. Width direction （dimension a）：Acceptable when a≦w/2 N o n - a c c e p t a b l e w h e n a ＞w/2 2. Length direction （dimension b）：Dimension b is not specified. 3. The total acceptable area of exposed wire occurring to each sides is no greater than 50% of coating resin area.

Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 5. Electrical Characteristics: *Tolerance code : M = 20% *For Irms (A) Max. values with ’(1)’ or ‘(2)’, refer to notes below for board test conditions. Notes: 1) At all times, the current supplied to the product should not exceed Irms Max. value 2) Irms Max. board test conditions: I r m s ( 1 ) I r m s ( 2 ) M a t e r i a l : F R 4 M a t e r i a l : F R 4 Board dimensions: 100 X 50 X 1.6t mm Board dimensions: 100 X 50 X 1.6t mm Pattern dimensions: 45 X 30 mm (Double side board) Pattern dimensions: 45 X 45 mm (Double side board) Pattern thickness: 50 μm P a t t e r n t h i c k n e s s : 7 0 μm Part Number Inductance (uH) Tolerance (%) Test Frequency (Hz) DCR (Ω) Max. I sat (A) Max. I rms (A) Max. SPA252010FAR24M 0.24 ±20 1V/1M 0.022 8.00 5.00 (1) 5.50 (2) SPA252010FAR33M 0.33 ±20 1V/1M 0.028 6.50 4.80 (1) 5.10 (2) SPA252010FAR47M 0.47 ±20 1V/1M 0.035 5.90 4.20 (1) 4.80 (2) SPA252010FAR68M 0.68 ±20 1V/1M 0.040 4.60 3.80 (1) 4.00 (2) SPA252010FA1R0M 1.0 ±20 1V/1M 0.053 4.30 3.10( 1) 3.40 (2) SPA252010FA1R5M 1.5 ±20 1V/1M 0.074 3.10 2.80 (1) 3.00 (2) SPA252010FA2R2M 2.2 ±20 1V/1M 0.093 2.30 2.30 (1) 2.50 (2) SPA252010FA4R7M 4.7 ±20 1V/1M 0.216 1.40 1.50 (1) 1.60 (2)

Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 6. Characteristics Curves:

Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 7. Soldering: Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all re-flow solderin g systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air. 8-1 Solder Re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 8-2 Soldering Iron (Figure 2): Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. N o t e : a) Preheat circuit and products to 150°C. b) 355°C tip temperature (Max.) c ) N e v e r c o n t a c t t h e c e r a m i c w i t h t h e i r o n t i p d) 1.0mm tip diameter (Max.) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f ) L i m i t s o l d e r i n g t i m e t o 4 ~ 5 s e c s .

Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 8. Packaging Information: 8 - 1 R e e l D i m e n s i o n 8 - 2 T a p e D i m e n s i o n 8-3 Packaging Quantity A B D C 7"x8mm Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 8.4±1.0 50 min. 13±0.8 178±2 Series Size Bo(mm) Ao( mm) Ko(mm) P(mm) t(mm) Chip size 252010 Chip / Reel 2000

Low Profile Power Inductors – SPA252010FA Series NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 24/02/2017 8-4 Tearing Off Force Application Notice: 1. Storage Conditions: To maintain the solderabililty of terminal electrodes: a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation: a) Products should be handled with care to av oid damage or contamination from perspiration and skin oils. b) Vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300