SP1233 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, 20A (8/20 as defined in IEC 61000-4-5 2nd edition)
  • Low clamping voltage
  • Low leakage current
  • AEC-Q101 qualified
  • Moisture Sensitivity Level(MSL -1)
  • Halogen free, lead free and RoHS compliant
  • Switches / Buttons
  • Test Equipment / Instrumentation
  • Point-of-Sale Terminals
  • Medical Equipment
  • Notebooks / Desktops / Servers
  • Computer Peripherals Pinout and Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP1233 20A Discrete Bidirectional TVS Diode PIN 1 PIN 2 SP1233 RoHS Pb GREEN The SP1233 includes TVS diodes fabricated in a proprietary silicon avalanche technology to protect each I/O pin and provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC61000-4-2) without performance degradation. Additionally, the SP1233 offers up to 20A 8/20 surge rating with low clamping voltages

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/30/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1103C Series Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units Ipp Peak Pulse Current (tp=8/20μs) 20 A Ppk Peak Pulse Power (tp=8/20μs) 180 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR≤1μA 3.3 V Breakdown Voltage VBR IR=1mA 4.2 V Leakage Current ILEAK VR=3.3V 0.02 0.5 μA Clamp Voltage1 VC IPP=10A, tp=8/20µs, Fwd 6.1 V IPP=20A, tP=8/20μs, Fwd 8.5 V Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to GND 0.07 Ω Peak Pulse Current Ipp tp=8/20µs 20 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V , f=1MHz 35 pF Note: 1 . Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns SP1233 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/30/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1103C Series Clamping voltage vs. IPP for 8/20μS waveshape 0 5 10 15 20 Clamp Voltage (VC) Peak Pulse Current-IPP (A) Positive T ransmission Line Pulsing (TLP) Plot 0 2 4 6 8 TLP Voltage (V) TLP Current (A) Negative T ransmission Line Pulsing (TLP) Plot -25 -20 -15 -10 -8 -6 -4 -2 0 TLP Voltage (V) TLP Current (A) SP1233 Capacitance vs. Reverse Bias 0.0 10.0 20.0 30.0 40.0 0 1.1 2.2 3.3 Capacitance (pF) Bias Voltage (V) IEC 61000−4−2 +8 kV Contact ESD Clamping Voltage IEC 61000−4−2 -8 kV Contact ESD Clamping Voltage

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/30/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1103C Series Part Numbering System Part Marking System 1233 01 T G Series Number of Channels Package T= Tape & Reel G= Green SOD882 ESP TVS Diode Arrays (SPA Diodes) H Date codePart code

Ordering Information

Part Number Package Marking Min. Order Qty. SP1233-01ETG SOD882 H* 10,000 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters SP1233 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0. Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr.

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/30/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1103C Series Embossed Carrier T ape & Reel Specification W AO P1 0.50 ±0.05 Do 1.50 0.10 0.00 2.00 0.05(I) PO 4.00 0.1(II) F(III) 1.75 0.1 Y Y X X BO KO T 0.20 0.02 SECTION Y-Y REF 3° SECTION X-X User Feeding Direction Pin 1 Location Symbol Millimeters A0 1 .14 +/- 0.03 B0 1 .75 +/- 0.03 K0 0.67 +/- 0.05 F 3.50 +/- 0.05 P1 2.00 +/- 0.10 W 8.00 +/- 0.10 Package Dimensions Recommended soldering pad layout 0.30mm0.40mm 1.10mm 0.65mm Package outline D E PIN1 Top View Bottom View Side View e A h Symbol SOD882 Millimeters Min Nor Max A 0.40 0.45 0.55 A1 - 0.02 0.05 L1 0.20 0.25 0.30 L2 0.45 0.50 0.55 D 0.90 1. 0 0 1. 10 E 0.50 0.60 0.70 e 0.65 BSC h 0.125 (x 45°) Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ,Ref. ,Ref. ,Ref. 8mm TAPE AND REEL SP1233 Device Orientation in Tape