SP1224 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • VBUS protection for fast charging USB circuits Pinout Functional Block Diagram Pin 1 (VBUS) Pin 5, 6 (GND) Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP1224 (100A) for USB VBUS RoHS Pb GREEN GND GND 5 6 1234 Bottom View
  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 80A (tP=5/50ns)
  • Lightning, 100A (8/20 as defined in IEC 61000-4-5 2nd edition)
  • Protection for VBUS operating up to 24V
  • High current handling capability for fast charging

applications

  • Halogen free, lead free and RoHS compliant
  • Moisture Sensitivity Level(MSL -1)

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/15/20 Surge Protection - SP1224 TVS Diode Arrays (SPA® Diodes) SP3012 Absolute Maximum Ratings Symbol Parameter Value Units IPP (Pin 1) Peak Current (tp=8/20μs) 100 A PPK(Pin1) Peak Pulse Power (tp=8/20μs) 3700 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA, Pin 1 to GND 22 V Breakdown Voltage VBR IR=1mA, Pin 1 to GND 24 27 V Reverse Leakage Current ILEAK VR=22V , Pin 1 to GND 0.02 0.5 µA Forward Voltage VF IF=10mA, GND to Pin 1 0.6 0.7 1. 0 V Clamp Voltage1 VC IPP=100A, tp=8/20µs, Fwd 35 37 V Dynamic Resistance2 RDYN TLP , tP=100ns, Pin1 to GND 0.15 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact) ±30 kV IEC 61000-4-2 (Air) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 770 850 pF 100 200 300 400 500 600 700 800 900 0246 81 01 21 41 61 82 02 2 Capacitance (pF) Bias Voltage (V) Capacitance vs. Reverse Bias (Pin1 to GND) Clamping Voltage vs. Peak Pulse Current (Pin1 to GND) Notes: 1 Parameter is guaranteed by design and/or component characterization.

2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 10 20 30 40 50 60 70 80 90 100 Clamp Voltage (VC ) Peak Pulse Current- IPP (A) CAUTION: Stresses at or above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Also due to variations in test equipment stresses shown above are averages.

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/15/20 Surge Protection - SP1224 TVS Diode Arrays (SPA® Diodes) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-dow Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - T emperature Min (Ts(min)) 150°C - T emperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) T emp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - T emperature (TL) (Liquidus) 217°C - T emperature (tL) 60 – 150 seconds Peak T emperature (TP) 260+0/-5 °C Time within 5°C of actual peak T emperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak T emperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Part Numbering System SP 1224 01 U T G Series Number of Channels Package T= Tape & Reel G= Green TVS Diode Arrays (SPA® Diodes) U= /uni03BCDFN-6 Part Marking System 1224 AYYWW 1 2 3 4 YY = Year code A = Assembly Code 1224 = Part code WW = Date codeOrdering Information Part Number Package Min. Order Qty. SP1224-01UTG µDFN-6 3000 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 T ransmission Line Pulsing (TLP) Plot IEC 61000-4-2 +8kV Contact ESD Clamping Voltage 05 10 15 20 25 30 TLP Current (A) TLP Voltage (V)

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/15/20 Surge Protection - SP1224 TVS Diode Arrays (SPA® Diodes) Package Dimensions — µDFN-6 µDFN6 (1.8x2.0x0.5mm) JEDEC MO-229 Symbol Millimeters Inches Min Nom Max Min Nom Max A3 0.125 REF 0.005 REF e 0.40 BSC 0.016 BSC e1 0.80 BSC 0.031 BSC K 0.50 REF 0.020 REF Recommended soldering pad layout (Unit : mm) 0.45 0.40 0.80 0.55 0.24 0.20 0.94 0.40 0.20 D E A b e Top View Bottom View Side View L k Drawing# : U04-A Embossed Carrier T ape & Reel Specification — µDFN-6 Symbol Millimeters A0 1 .95 +/- 0.05 B0 2.30 +/- 0.05 D0 1 .50 + 0.10 D1 Ø 0.60 + 0.05 E 1 .75 +/- 0.10 F 3.50 +/- 0.05 K0 0.75 +/- 0.05 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00+/-0.05 T 0.25 +/- 0.02 P2 D0 E F W T B0K0 22.12ø13.22 ø179.90 ø155.37 ø70.55 ø15.57 ø58.11 24.32 1.461.11 9.04 Pin1 Location ,Ref. ,Ref. ,Ref. W AO P1 0.50 ±0.05 Do 1.50 0.10 0.00 2.00 0.05(I) PO 4.00 0.1(II) F(III) 1.75 0.1 Y Y X X BO KO T 0.20 0.02 SECTION Y-Y REF 3° SECTION X-X User Feeding Direction Pin 1 Location Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.