SMI-40 MICRO-ELECTRONICS | Alldatasheet
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MODEL NO. : SMI-40/ SMI-50 SERIES FEATURES: UN eee cr eto Thee * SUPERIOR QUALITY FROM AN ree oe yy eee AUTOMATED PRODUCTION LINE Nia R UP aay el leptecemmbnie a | * PICK AND PLACE COMPATIBLE. pate i gm * TAPE AND REEL PACKING. ie oe 2 APPLICATION : * NOTEBOOK COMPUTERS. —* DC-DC CONVERTORS. *DC-AC INVERTERS. * SIGNAL CONDITIONING * CELLULAR TELEPHONES “FILTERING. * HYBRIDS * PAGERS. ELECTRICAL SPECIFICATION: PHYSICAL DIMENSION : (UNIT:mm) SMI-40 SERIES SMI-50 SERIES RATED L pc L DCR |RATED OC} - (uH) tr NO. (uH)| (OHMS)} (ma) T | [emaoino | 1o| oor | seo eusoses {33 | ass | so | x jee a Yeu Cswi-40-3R3 | 33] 0.10 | 300 || swsoena |62| ooo | 450 | CSuiao-se7 47 [0.15 | 250 || smso-t00 | 10 | 072 | 420 | (swiao-ere | 68] 017 | 220 || smvso-t2o | 12 | 015 | 400 | 7 i fi [swi-49-100_| 19] 024 | 200 || swi-s0-160| 15] 076 | 400 | Ps cd [smi-ao120 [12 [030 | 10] am Bi [swi-ao-150 | 15 [038 | 160 || sma-s0-s90 | 33 | 0.35 | 250 | ab [smrao-330 | 39 | 075 | 100 || swi-co-820 | a2] 0.83 | 160 | : [ siiao-560_| 56 | 150 | 00 || smiso-201 |z20| 220 | 100 _| = hy , Cswraowa [ee [210 [70 || smrso-471 |a7o| 470 | 100 _| SMI-40 SERIES SMI-50 SERIES smi-a0-t21 | 120 | 320_| so || smuso-102 |r000] 110 | 40] At anm OR 3 2uh~en [swi-a0-151 | 150| 450 | 45 | [800 [40] na Perey [swi-ao.271 | 270 | 880_| 40 | eee ["smi-ao-ss1 [330 a00 | 40 | eoiirss ream [sw-s0-471 [4701 140 | 40 | [‘smrao-eet [680] 180 | 40 | [smiao-102 [1000 27.0 | 40 | NOTE(1):TEST FREQUENCY: 100KHz,1VRMS. NOTE/2):1.0uH-8.2uH 420%, 10uH-1000uH 210%.
Tape and Ree! Orientation ooo0oclOo 8 |{—— | 0 COVER TAPE ‘CARRIER TAPE ae aN Fe i EMBOSSED CAVITY USER DIRECTION OF FEED CABELAREA = if WIDTH | WIDTH PITCH R NOTE : Top view shown with cover tape removed. [ PES REE. bovsenes| enn [zzann| oom |e | TAPE SPECIFICATIONS: Canter Tape Type: Conductive, Cover Tape Type: Antisiatic. Cover Tape Adhesion to Carer; 10-70 grams. REEL SPECIFICATIONS: Non-antistatic. . Diamater (ange) : 13° (330.2mm) STANDARDS : All embossed carrer tape packaging will be accomplished in compliance with latest revision of EIA-481 “Taping of surface Mount Components for Automatic Placement”, ITEM TEST CONDITION Ten cycles of 30 minutes @ -55°C, 15seconds maximum @room ambiert, | 1 | Thermal Shock 30 minutes @ + 125°C, 15 seconds maxi @ room ambient. Vibration 4 cycle of 30 minutes duration per the following: 5-7 Hz constant displacement of .75 inch, 5 minutes, 7-30 Hz constant acceleration of 1.5 g's. 10 minutes, 30-50 Hz constant displacement of 0.033 inch, 5 minutes, 50-500 Hz constant ace on of 4.2 9's. 10 minutes. Solderability Per MIL-STD-202, Method 208, except steam aging is omitted and pads are dipped 30 from vertical. Solder temperature: + 245°C +6°C. Immersion dwell time: 5+1/2 seconds. Storage Life Subject the component to 168 hours at + 85°C and 85% relative humidity. A Precondition at + 40°C for 60 minutes. Subject the component | 5 | Malate Reser: to 240 hours at + 40°C and 90 to 95% relative humidity. hanical SI ‘One-half sine pulse (8700 g's for 0.3 milliseconds) in each | | mM dias direction along 3 mutually perpendicular axes in each direction 7 7 total of 6 shocks).