SMI-25-102 MICRO-ELECTRONICS | Alldatasheet
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FEATURES: * SUPERIOR QUALITY FROM AN AUTOMATED PRODUCTION LINE. ww * EXCELLENT COPLANDARITY. @ * LOW DCR, HIGH INDUCTANCE. ~~) * GOLD PLATED PADS WITH A SOLDERLESS rw) - WIRE WELDED TERMINATION. * PICK AND PLACE COMPATIBLE “TAPE AND REEL PACKAGING. * CLASS H MATERIALS (180 DEGREE C). CAN WITHSTAND STANDARD IR REFLOW. * IN HOUSE DESIGN IS AVAILABLE FOR CUSTOM REQUIREMENTS. APPLICATIONS: * SIGNAL CONDITIONING. * DC-DC CONVERTORS. * PAGERS. * NOTEBOOK COMPUTERS. “NOTEBOOK COMPUTERS. “HYBRIDS. * CELLULAR TELEPHONES. * FILTERING. ELECTRICAL SPECIFICATIONS: PHYSICAL DIMENSIONS: (unit:incHimm) BGR TRATED ES SMI-25-SERIES MODEL No, max. | CURRENT (OHM) (mA 5 § 3 is =o Pith. fy e le Em Sonoma 2 Ab ibe aaa aoe | w [ol] ai [swassuz] sooo | co | ss0| 7 __| be i some oo [wt] ‘ [swianaca| 0m | so | ae] 7 | SMMSO-SERIES [smmaosoa| sooo | so | «eo [7 | ie R 3 ee ee a bal s * RATED DC CURRENT IS BASED ON A 25% $ REOUCTION IN THE MINIMUM INDUCTANCE VALUE, EY i cy
[Tape and Reel Orientation Goa000 OO O aN (\\ \\ |___cover TAPE | { JO) i \\ I | CARRIER TAPE x / EMBOSSED CAVITY ns USER DIRECTION OF FEED LABEL AREA wes - WIDTH | WIDTH PITCH PER REEL NonesTepwencroneummenermmrene Jomassenics| tam | is4mm| anm | 200 | TAPE SPECIFICATIONS: Camer Tape Type: Non-conductive, Cover Tape Type: Nerrantistatic, Cover Tape Adhesion to Carrier: 60 -175 grams. REEL SPECIFICATIONS: Non-antistatic, Diameter {flarge) : 13" (330.2mm} ° STANDARDS : All embossed cartier tape packaging wil be accomplished in compliance with latest revision of E1A-481 “Taping of surfaos Mount Components ‘or Automatic Placement”. em] Test. SCSCSCSC*~C*CNDTIN, Ten cycles of 30 minutes @ -55°C, 15seconds maximum @room ambient, 1 | Tiree shes 30 minutes @ + 125°C, 15 seconds maximum @ room ambient. Vibration 1 cycle of 30 minutes duratlo per the following: 5-7 Hz constant displacement of .75 inch, 5 minutes, 7-30 Hz constant acceleration of 1.5g's. 10 minutes, 30-50 Hz constant displacement of 0.033 inch, 5 minutes, 50-500 Hz constant acceleration of 4.2 g's, 10 minutes.
3 Solderability Per MIL-STD-202, Method 208, except steam aging is omitted
and pads are dipped 30 from vertical. Solder temperature: + 245°C +5°C. immersion dwell time: 5+1/2 seconds. 4 Storage Life Subject the component to 168 hours at + 85°C and 85% relative humidity. "i Precondition at + 40°C for 60 minutes. Subject the component Ls | senda 4 to 240 hours at + 40°C and 90 to 95% relative humidity. ical SI One-half sine pulse (8700 g's for 0.3 milliseconds) in each Mechenical direction along 3 mutually perpendicular axes in each direction (total of 6 shocks).