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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

  • Glass passivated chip
  • Uni and Bidirectional unit
  • Excellent clamping capability
  • 200W peak pulse power capability with a 10/1000μs waveform, repetition rate (duty cycle) : 0.01%
  • Very-fast response time
  • Low leakage
  • RoHS compliant Mechanical Data
  • Case : Molded plastic
  • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
  • Polarity: For uni-directional types, the band denotes the cathode, which is positive with respective to the anode under normal TVS operation
  • Mounting position : Any
  • Epoxy: UL 94V-0 rate flame retardant Devices for bidirectional applications For bi-directional devices, use suffix CA (e.g. SMF10CA). Electrical characteristics apply in both directions. Maximum Ratings and Characteristics(TA=25°C, unless otherwise noted) Parameter Symbol Value Unit Peak pulse power dissipation with a 10/1000μs waveform (Note 1) PPP 200 W Peak pulse power dissipation with a 8/20μs waveform (Note 1) PPP 1000 W Peak pulse current with a 10/1000μs waveform (Note 1) IPP See next table A Peak forward surge current, 8.3ms single half sine wave uni-directional only (Note 2) IFSM 20 A Power dissipation on infinite heatsink at TL=75°C PD 0.4 W Maximum instantaneous forward voltage at 25A for unidirectional only (Note 4) VF 3.5 V Operating junction and storage temperature range TJ;TSTG -55 ~ +150 °C Notes: 1.Non-repetitive current pul se, per Fig. 5 and derated above TA=25°C per Fig. 1. 2.Mounted on 8.3ms single half sine-wave or equi valent square wave, duty cycle=4 pulses per minute maximum.

CYStech Electronics Corp. Spec. No. : C296SP Issued Date : 2011.06.20 Revised Date : Page No. : 2/5 SMF5.0A thru SMBJ190CA CYStek Product Specification Electrical Characteristics Ratings at 25℃ ambient temperature, unless otherwise noted. Device Marking Code Breakdown Voltage V(BR) @IT Part Number (UNI) Part Number (BI) UNI BI Min (V) Max (V) IT (mA) Maximum reverse leakage IR @ VRWM (μA) Working Peak reverse voltage VRWM (V) Maximum reverse surge Current IPP (A) Maximum clamping voltage VC @IPP (V)

CYStech Electronics Corp. Spec. No. : C296SP Issued Date : 2011.06.20 Revised Date : Page No. : 3/5 SMF5.0A thru SMBJ190CA CYStek Product Specification Electrical Characteristics(Cont.) Device Marking Code Breakdown Voltage V(BR) @IT Part Number (UNI) Part Number (BI) UNI BI Min (V) Max (V) IT (mA) Maximum reverse leakage IR @ VRWM (μA) Working Peak reverse voltage VRWM (V) Maximum reverse surge Current IPP (A) Maximum clamping voltage VC @IPP (V) Note: 1.Suffix ‘A’ denotes 5% tolerance device. 2.Add suffix ‘C’ or ‘CA ’ after part number to specify Bi-directional devices. 3.For bidirectional types having VR of 10 volts and less, the IR limit is doubled.

CYStech Electronics Corp. Spec. No. : C296SP Issued Date : 2011.06.20 Revised Date : Page No. : 4/5 SMF5.0A thru SMBJ190CA CYStek Product Specification

CYStech Electronics Corp. Spec. No. : C296SP Issued Date : 2011.06.20 Revised Date : Page No. : 5/5 SMF5.0A thru SMBJ190CA CYStek Product Specification SMF Dimension *:Typical D 3.51 3.82 0.140 0.152 H Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.