MTN2572J3 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

  • Low Gate Charge
  • Simple Drive Requirement
  • Repetitive Avalanche Rated
  • Fast Switching Characteristic
  • RoHS compliant package Symbol Outline MTN2572J3 TO-252 Absolute Maximum Ratings (TC=25°C, unless otherwise noted) Parameter Symbol Limits Unit Drain-Source V oltage VDS 150 Gate-Source V oltage VGS ±30 V Continuous Drain Current @VGS=10V , TC=25°C ID 36 Continuous Drain Current @VGS=10V , TC=100°C ID 22 Pulsed Drain Current (Note 1) IDM 120 Avalanche Current IAS 18 A Avalanche Energy @ L=0.1mH, ID=18A, RG=25Ω EAS 16.2 Repetitive Avalanche Energy@ L=0.05mH (Note 2) EAR 8.1 mJ W Total Power Dissipation (TC=25℃) Linear Derating Factor Pd 50

0.32 W/°C

Operating Junction and Storage Temperature Tj, Tstg -55~+175 °C Note : 1. Pulse width limited by maximum junction temperature 2. Duty cycle ≤ 1% G：Gate G D S D：Drain S：Source

CYStech Electronics Corp. Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 2/7 MTN2572J3 CYStek Product Specification Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 3 °C/W Thermal Resistance, Junction-to-ambient, max Rth,j-a 75 °C/W Characteristics (TC=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS 150 - - V VGS=0V , ID=250μA ∆BVDSS/∆Tj - 0.05 - V/°C Reference to 25°C, ID=1mA VGS(th) 1.5 2.5 4.0 V VDS = VGS, ID=250μA GFS - 40 - S VDS =5V , ID=20A IGSS - - ±100 nA VGS=±30 - - 1 μA VDS =120V , VGS =0V IDSS - - 25 μA VDS =100V , VGS =0V , Tj=125°C *RDS(ON) - 40 50 mΩ VGS =10V , ID=20A *ID(ON) 48 - - A VDS =10V , VGS =10V Dynamic *Qg - 43 - *Qgs - 15 - *Qgd - 25 - nC ID=20A, VDS=80V , VGS=10V *td(ON) - 25 - *tr - 200 - *td(OFF) - 100 - *tf - 120 - ns VDS=75V , ID=1A, VGS=10V , RG=6Ω Ciss - 10460 - Coss - 157 - Crss - 113 - pF VGS=0V , VDS=25V , f=1MHz Rg - 2 - Ω VGS=15mV , VDS=0V , f=1MHz Source-Drain Diode *IS - - 48 *ISM - - 140 A *VSD - - 1.3 V IF=IS, VGS=0V *trr - 120 - ns *Qrr - 380 - nC IF=25A, VGS=0, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking MTN2572J3 TO-252 (RoHS compliant) 2500 pcs / Tape & Reel 2572

CYStech Electronics Corp. Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 3/7 MTN2572J3 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 4/7 MTN2572J3 CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 5/7 MTN2572J3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 6/7 MTN2572J3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 7/7 MTN2572J3 CYStek Product Specification TO-252 Dimension *: Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. Marking: B A C E H I J K D F GL Style: Pin 1.Gate 2.Drain 3.Source 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 2572 □□□□ Device Name Date code DIM Min. Max. Min. Max. Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead : KFC; pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.