SME1400B-10 WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 5 May 2007 SME1400B-10 Broadband Surface Mount Mixer Product Features

  • +19 dBm Input IP3
  • RF: 1 – 2200 MHz
  • LO: 1 – 2200 MHz
  • IF: 1 – 2000 MHz
  • +10 dBm LO Drive Level
  • No Internal Solder Connections
  • RoHS-compliant SMT package
  • No External Bias Required

Applications

  • Up/down frequency conversion Product Description The SME1400B-10 is a passive double-balanced diode-ring mixer that provides high d ynamic range performance in a RoHS-compliant surface mount package. The mixer is nominally driven with a LO input power of +10 d Bm to optimize its performance. Other SME models are available for other LO drive levels. Typical applications include frequency up/down conversion, modulation and demodulation for receivers and transmitters used in 2.5G and 3G GSM/CDMA/W-CDMA systems. Functional Diagram Top View Specifications (1) Parameter Units Min Typ Max Notes SSB Conversion Loss RF/LO = 10-1300 MHz, IF = 10-1000 MHz dB 6.2 8.5 See note 1. Guaranteed at 8 dB max at 25 /GDB/G26/G11 RF/LO = 10-2500 MHz, IF = 10-1000 MHz dB 7.5 9.5 See note 1. Guaranteed at 9 dB max at 25 /GDB/G26/G11 RF/LO = 1-2500 MHz, IF = 1-2000 MHz dB 8.0 Port-to-Port Isolation L-R = 10-2000 MHz dB 24 35 L-R = 10-2500 MHz dB 18 25 L-I = 10-2000 MHz dB 20 26 L-I = 10-2500 MHz dB 16 22 R-I = 10-2200 MHz dB 25 3rd Order Input Intercept Point dBm +19 1dB Input Compression Point dBm +6 VSWR RF Port = 600-2000 MHz 1.7:1 RF Port = 10-2500 MHz 2.0:1 LO Port = 600-2000 MHz 1.6:1 LO Port = 10-2500 MHz 2.0:1 IF Port 1.8:1 LO Drive Level dBm +10 1. Measured in a 50 ohm system with a nominal LO drive of +10 dBm, low-side LO, in a downconversion application with LO = 400-2100 MHz, RF = 500-2200 MHz, IF = 100 MHz. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -65 to +100 °C RF Input Power +16 dBm Operation of this device above any of these parameters may cause permanent damage.

Ordering Information

Part No. Description SME1400B-10 Broadband Surface Mount Mixer SME1400B-10F(1) Broadband Surface Mount Mixer SME1400B-10-PCB Fully-Assembled Mixer Application Board Note: 1. Compatible with. 260 /GDB/G26/G03/G55/G48 /G49 /G4F/G52/G5A/G03/G53/G55/G52/G46/G48/G56/G56/G48 /G56 /G11 1 2 3 7 6 5 8 4 RF LO IF

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 5 May 2007 SME1400B-10 Broadband Surface Mount Mixer Performance Charts

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 5 May 2007 SME1400B-10 Broadband Surface Mount Mixer Single-Tone IM Products Harmonics of fLO 0 1 2 3 4 5 0 34 44 46 57 53 1 27 0 33 12 35 28 2 63 55 56 55 59 59 3 >80 69 >80 68 73 47 Harmonics of fRF LO RF IM Products Mult Mult LO (MHz) RF (MHz) MHz dBc 0 1 1950 2000 2000 27 0 2 1950 1000 2000 63 0 3 1950 700 2100 84 0 4 1950 600 2400 77 0 5 1950 400 2000 80 1 0 2000 1950 2000 34 -1 1 1950 2000 50 0 1 -2 2000 975 50 55 1 -3 2000 650 50 69 1 -4 2000 488 48 90 1 -5 2000 390 50 88 2 0 1000 1950 2000 44 -2 1 550 2000 900 33 2 -2 2000 1975 50 56 2 -3 2000 1317 49 89 2 -4 2000 988 48 90 2 -5 2000 790 50 89 3 0 700 1950 2100 46 -3 1 400 1550 350 12 3 -2 1500 1200 2100 55 3 -3 2000 1983 51 68 -3 4 2200 1700 200 80 3 -5 2000 1190 50 89 4 0 500 1950 2000 57 -4 1 420 2000 320 35 4 -2 800 1200 800 59 4 -3 1100 1200 800 73 4 -4 2000 1987 52 89 -4 5 2075 1700 200 88 5 0 400 1950 2000 53 -5 1 350 1950 200 28 5 -2 700 1200 1100 59 5 -3 1000 1200 1400 47 5 -4 1150 1200 950 86 5 -5 1710 1700 50 88 RF harmonics and intermodulation products are referenced to a desired signal produced by fRF = 2000 MHz and fLO = 1950 MHz LO harmonics are referenced to the +10 dBm LO drive signal

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 5 May 2007 SME1400B-10 Broadband Surface Mount Mixer SME1400B-10 Mechanical Information This package is RoHS-compliant. The plating material on the leads is AgPdPt. It is compatible with a tin-lead (maximum 235 °C reflow temperature) soldering processes. Application Circuit Notes: 1. Circuit board material: .014” FR-4, 4 layers, .062” total thickness 2. Blocking capacitors are required on the ports (pins 2, 5, 7) if any dc signal is present. Outline Drawing Land Pattern / Mounting Configuration Notes: 1. Ground vias are critical for RF grounding considerations. 2. A minimum of 12 ground vias underneath the device are required. 3. Trace width depends on the PC board material and thickness. Product Marking The c omponent will be marked with an “ SME1400B-10” designator f ollowed b y an alphanumeric lot code on the top surface of the package. Tape a nd reel specifications for this part are located on the website in the “ Application Notes” section. ESD Information ESD Classification: Class 1C Value: Passes /G0E 1000V to <2000 V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Classification: Class IV Value: Passes /G0E 1000 V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 Functional Pin Layout Pin No. Function 4 RF 6 IF 8 LO 1, 2, 3, 5, 7 Backside Metal GND RF LO PIN 8 PIN 4 SME1400B-10 IF PIN 6 1 2 3 7 6 5 8 4 RF LO IIF SME 1400B-10 XXXX

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 5 of 5 May 2007 SME1400B-10 Broadband Surface Mount Mixer SME1400B-10F Mechanical Information This package is RoHS-compliant. The plating material on the leads is AgPdPt. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes Application Circuit Notes: 1. Circuit board material: .014” FR-4, 4 layers, .062” total thickness 2. Blocking capacitors are required on the ports (pins 2, 5, 7) if any dc signal is present. Outline Drawing Land Pattern / Mounting Configuration Notes: 1. Ground vias are critical for RF grounding considerations. 2. A minimum of 12 ground vias underneath the device are required. 3. Trace width depends on the PC board material and thickness. Product Marking The c omponent will be marked with an “ SME1400B-10F” designator f ollowed b y an alphanumeric lot code on the top surface of the package. Tape a nd reel specifications for this part are located on the website in the “ Application Notes” section. ESD Information ESD Classification: Class 1C Value: Passes /G0E 1000V to <2000 V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Classification: Class IV Value: Passes /G0E 1000 V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 Functional Pin Layout Pin No. Function 4 RF 6 IF 8 LO 1, 2, 3, 5, 7 Backside Metal GND RF LO PIN 8 PIN 4 SME1400B-10F IF PIN 6 1 2 3 7 6 5 8 4 RF LO IIF