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Technical content

Features

  • Meets Battery Charging Specification BC1.2 for DCP and CDP
  • Meets Chinese Telecommunications Industry Standard YD/T 1591-2009
  • Supports Non-BC 1.2 charging modes via Automatic se- lection - DM/DP Divider Modes 2.7V/2.0V (1A) & 2.0V/2.7V (2A) - DM/DP 1.2V Mode
  • Support Smart-CDP function - Automatic CDP/SDP mode support for Always data Communication
  • Compatible with USB 2.0/3.0 power switch requirements
  • 73 m Ω (typ) high side MOSFET
  • Adjustable Current Limit up to 3.0 A (typ)
  • Dynamic level detect ci rcuit for inrush current
  • Pb-Free / RoHS Compliant
  • Halogen-Free
  • TQFN-16 Package / MSL-1
  • UL Listed and CB File No. E468659 Pin Configuration

Applications

  • USB Ports/Hubs
  • Notebook PCs
  • Universal Wall Charging Adapter 16-pin TQFN NC DP_IN DM_IN CTL2 CTL1 EN SLGC55544C FAULT# GND ILIM_L DP_OUT DM_OUT VIN GND 4ILIM_SEL CTL3 8 VOUT12

16 ILIM_H

(Top View) DP_IN DM_IN EN FAULT# DP_OUT DM_OUT VIN ILIM_SEL VOUT Power Switch Control Circuitry CTL1 Charge LogicCTL3 CTL2 Charging Downstream Port Mode BC Divider Mode BC 1.2 DCP Mode / 1.2 V Mode Dedicated Sense Host Sense Charge Mode Select Shorted/Divider Mode Switch High Band- width Switch Auto Discharge Current Limit SwitchILIM_L ILIM_H Dynamic Level Detect Circuit

000-000C55544C-105 Page 2 of 20 SLGC55544C Pin Description Pin # Name Type Description 1 VIN PWR Input voltage, connect a 0.1μF or greater ceramic capacitor from IN to GND as close to the device as possible

2 DM_OUT Input/Output D- data line to USB host controller

3 DP_OUT Input/Output D+ data line to USB host controller

4 ILIM_SEL Input Logic level input signal used to dynamically change power switch cur-

rent-limit threshold; logic LOW selects ILIM_L, logic HIGH selects ILIM_H

5 EN Input Logic level control input for turning the power switch and the signal switches

on/off. When EN is LOW, the device is disabled, the signal and power switches are OFF.

6 CTL1 Input Logic level control inputs for controlling the charging mode and the signal

switches. The “000” configuration is used to force and discharge of the output (VOUT) capacitor.7 CTL2 Input

8 CTL3 Input

9 NC NC No Connect. Open or connect to Ground

10 DP_IN Input/Output D+ data line to connector, input/output used for hand-shaking with portable

11 DM_IN Input/Output D- data line to connector, input/output used for hand-shaking with portable

12 VOUT PWR Power switch output

13 FAULT# Output Active low open drain output, asserted during over-temperature or cur-

14 GND GND Ground

15 ILIM_L Input External resistor used to set current-limit threshold when ILIM_SEL is LOW. See current limit setting in detailed description.

16 ILIM_H Input External resistor used to set current-limit threshold when ILIM_SEL is

HIGH. See current limit setting in detailed description.

17 Thermal Pad GND Ground

Ordering Information

SLGC55544CVTR TQFN-16 - Tape and Reel

000-000C55544C-105 Page 3 of 20 SLGC55544C 1. Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maxi mum-rated conditions for extended periods may affect device reliability. Absolute Maximum Conditions 1 Parameter Min. Max. Unit Supply Voltage range VIN -0.3 7 V Input Voltage range EN, ILIM_L, ILIM_H, ILIM_SEL, CTL1, CTL2, CTL3 -0.3 7 V Output Voltage range VOUT, FAULT# -0.3 7 V Output Voltage range VIN to VOUT -7 7 V Voltage range DP_IN, DM_IN, DP_OUT, DM_OUT -0.3 VIN+0.3 or 5.7 V Input Clamp current DP_IN, DM_IN, DP_OUT, DM_OUT -- ±20 mA Continuous current in SDP or CDP mode DP_IN to DP_OUT or DM_IN to DM_OUT -- ±100 mA Continuous current in BC1.2 DCP mode DP_IN to DM_IN -- ±35 mA Continuous output current Internally limited Continuous output sink current FAULT#, NC -- 25 mA Continuous output source current ILIM_L, ILIM_H -- 1 mA Continuous total power dissipation Internally limited ESD Rating, Human Body Model (HBM) VIN, EN, ILIM_L, ILIM_H, ILIM_SEL, CTL1, CTL2, CTL3, NC, OUT, FAULT# 2 -- kV ESD Rating, Human Body Model (HBM) DP_IN, DM_IN, DP_OUT, DM_OUT 8 -- kV ESD Rating, Charged Device Model 500 -- V Operating Temperature Range -40 85 °C Storage Temperature Range -65 165 °C

000-000C55544C-105 Page 4 of 20 SLGC55544C 1. For more information about traditional and new thermal metri cs, see the IC Package Therma l Metrics application report, SPRA953. 2. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. 3. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 4. The junction-to-board thermal resistance is obtained by simu lating in an environment with a ring cold plate fixture to contr ol the PCB temperature, as described in JESD51-8. 5. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). 6. The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). 7. The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Thermal Information1 Parameter RTE Unit θJA Junction-to-ambient thermal resistance 2 53.4 °C/W θJCtop Junction-to-case (top) thermal resistance 3 51.4 °C/W θJB Junction-to-board thermal resistance 4 17.2 °C/W ψJT Junction-to-top characterization parameter 5 3.7 °C/W ψJB Junction-to-board characterization parameter 6 20.7 °C/W θJCbot Junction-to-case (bottom) thermal resistance 7 3.9 °C/W Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Symbol Parameter Condition/Note Min. Typ. Max. Unit VIN Input Voltage VIN 4.5 -- 5.5 V Logic Level Inputs (CTL1, CTL2, CTL3, EN, ILIM_SEL) 0 -- 5.5 V Data Line Inputs (DP_IN, DM_IN, DP_OUT, DM_OUT) -- -- 5.5 V Continuous Current Data Line inputs (SDP or CDP mode, DP_IN to DP_OUT or DM_IN to DM_OUT) -- -- ±30 mA Data Line inputs (BC1.2 DCP mode, DP_IN to DM_IN) -- -- ±15 mA RILIM Current-limit set resistors ILIM_L to GND, ILIM_H to GND 16.9 -- 750 kΩ TJ Operating virtual junction temperature -40 -- 125 °C VIH Input Logic High 1.8 -- -- V VIL Input Logic Low -- -- 0.8 V VHYST Input Logic Hysteresis -- 250 -- mV

000-000C55544C-105 Page 5 of 20 SLGC55544C

Electrical Characteristics

Conditions are -40 ≤ TJ ≤ 125°C unless otherwise noted. VEN = VIN = 5 V, RFAULT# = 10 kΩ, RILIM_L = 80 kΩ, RILIM_H = 20 kΩ, ILIM_SEL = VIN, CTL1 = CTL2 = CTL3 = VIN, unless otherwise noted. Positive currents are into pins. Typical values are at 25°C. All voltages are with respect to GND unless otherwise noted. Electrical Characteristics - Power Switch Symbol Parameter Condition/Note Min. Typ. Max. Unit Rds ON Static drain-source on-state resistance 1 IOUT = 100 mA, VILIM_SEL = Logic Low -- 73 -- mΩ TA = TJ = 25°C, IOUT = 2 A, VILIM_SEL = Logic HIgh -- 73 84 mΩ -40°C ≤ TA = TJ ≤ 85°C, IOUT = 2 A, VILIM_SEL = Logic High -- 73 105 mΩ -40°C ≤ TA = TJ ≤ 125°C, IOUT = 2 A, VILIM_SEL = Logic High -- 73 120 mΩ TR Rise Time, Output CL = 1 μF, RL = 100 Ω, 0.7 1.0 1.6 ms TF Fall Time, Output CL = 1 μF, RL = 100 Ω, 0.2 0.35 0.5 ms RDIS Out Discharge Resistance 337 498 681 Ω TDIS Out Discharge Hold Time -- 2 -- s TDIS_LONG Long Out Discharge Hold Time 2 Time VOUT < 0.7 V 1 2 3 s TDIS_SHORT Short Out Discharge Hold Time 2 Time VOUT < 0.7 V 150 250 400 ms IREV Reverse leakage current VOUT = 5.5 V, VIN = VEN = 0 V, TJ = 25°C -- -- 2 μA Note 1: Pulse testing techniques maintain junction temperature close to ambient temperature. Thermal effects must be taken into account separately. Note 2: Guaranteed by design. Not 100% tested. Electrical Characteristics - Input EN Symbol Parameter Condition/Note Min. Typ. Max. Unit VEN Enable pin turn on/off threshold, falling -- 1.08 -- V VEN_HYS EN Hysteresis -- 2301 -- mV IEN Input current VEN = 0 V or 5.5 V -0.5 -- 0.5 μA TON Turn On time CL = 1 μF, RL = 100 Ω, -- 2.7 4.0 ms TOFF Turn Off time CL = 1 μF, RL = 100 Ω, -- 1.7 3.0 ms Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Current Limit Symbol Parameter Condition/Note Min. Typ. Max. Unit VILIM_SEL ILIM_SEL turn on/off threshold, falling -- 1.08 -- V VILIM_HYS ILIM_SEL Hysteresis -- 2301 -- mV ILIM_SEL Input current VILIM_HYS = 0 V or 5.5 V -0.5 -- 0.5 μA

000-000C55544C-105 Page 6 of 20 SLGC55544C ISHORT Maximum DC Output current from VIN to VOUT VILIM_SEL = Logic Low RILIM_L = 210kΩ 0.22 0.26 0.30 A VILIM_SEL = Logic Low RILIM_L = 80.6kΩ -40°C ≤ TJ ≤ 85°C 0.60 0.66 0.72 A VILIM_SEL = Logic Low RILIM_L = 22.1kΩ 2.120 2.275 2.430 A VILIM_SEL = Logic High RILIM_H = 20kΩ 2.340 2.510 2.685 A VILIM_SEL = Logic High RILIM_H= 16.9kΩ 2.77 2.97 3.17 A TIOS Response time to short circuit VIN = 5 V -- 6.651 -- μs Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Supply Current Symbol Parameter Condition/Note Min. Typ. Max. Unit ICCL Supply current, switch disabled VEN = 0 V, OUT grounded, -40°C ≤ TJ ≤ 85°C -- 0.1 2 μA ICCH Supply current, operating VEN = VIN -- 215 270 μA Electrical Characteristics - Undervoltage Lockout Symbol Parameter Condition/Note Min. Typ. Max. Unit VUVLO Low level input voltage, IN VIN rising 3.9 4.1 4.3 V VIN_HYS Hysteresis, IN 1001 mV Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - FAULT# Symbol Parameter Condition/Note Min. Typ. Max. Unit VOL Output Low voltage, FAULT#IFAULT# = 1 mA -- -- 100 mV ILEAK Off-state leakage VFAULT# = 5.5 V -- -- 1 μA FAULT# Deglitch FAULT# assertion or de-asser- tion due to over-current condi- tion -- 8.6 -- ms Electrical Characteristics - CTL Inputs Symbol Parameter Condition/Note Min. Typ. Max. Unit VCTL CTL pins turn on/off threshold, falling -- 1.08 -- V VCTL_HYS Hysteresis, CTL -- 2301 -- mV Input current VCTL= 0 V or 5.5 V -0.5 -- 0.5 μA Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Current Limit Symbol Parameter Condition/Note Min. Typ. Max. Unit

000-000C55544C-105 Page 7 of 20 SLGC55544C Electrical Characteristics - Thermal Shutdown Symbol Parameter Condition/Note Min. Typ. Max. Unit Thermal shutdown threshold 155 -- -- °C Thermal shutdown threshold in current-limit 135 -- -- °C Hysteresis 201 °C Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Analog Switch VIN = 5.0 V, TA = 25 °C (unless specified otherwise) Symbol Parameter Condition/Note Min. Typ. Max. Unit VDP_IN, VDM_IN Analog signal Range 0 -- VDD V RON On Resistance DP_OUT/DM_OUT Switch VDP/DM_OUT = 0 V, IDP/DM_IN = 30 mA -- 2 4 Ω VDP/DM_OUT = 2.4 V, IDP/DM_IN = -15 mA -- 3 6 Ω ΔRON On Resistance Mismatch between channels DP_OUT/DM_OUT Switch VIN = 5 V VDP_IN = VDM _IN= 400 mV IDP_IN = IDM_IN = 10 mA -- 0.1 -- Ω RFLAT On Resistance flatness DP_OUT/DM_OUT Switch VIN = 5.0 V VDP_IN = VDM_IN = 0 V to VIN IDP_IN = IDM_IN = 10 mA -- 0.5 -- Ω RSHORT On Resistance of DP_OUT/DM_OUT Short VCB = 0 V VDP_IN = 1 V IDP_IN = IDM _IN= 10 mA -- 100 150 Ω IDP_OUT_OFF, IDM_OUTOFF Off-Leakage Current VIN = 3.6 V VDP_IN = VDM_IN = 0.3 V to 3.3 V VDP_OUT = VDM_OUT = 3.3 V to 0.3 V VEN = 0 V -250 -- 250 nA IDP_IN_OFF, IDM_IN_OFF Off-Leakage Current VIN = 3.6 V VDP_IN = VDM_IN = 3.3 V to 0.3 V VEN = VIN -250 -- 250 nA Electrical Characteristics - Dynamic Performance VDD = 5.0 V, TA = 25 °C (unless specified otherwise) Symbol Parameter Condition/Note Min. Typ. Max. Unit TON Turn On Time VDP_OUT or VDM_OUT = 1.5 V RL = 300 Ω CL = 35 pF --‘ 20 100 μs TOFF Turn Off Time VDP_OUT or VDM_OUT = 1.5 V RL = 300 Ω CL = 35 pF --‘ 1 5 μs TPLH, TPHL DP_OUT/DM_OUT Switch Propagation Delay RL = RS = 50 Ω -- 60 -- ps

000-000C55544C-105 Page 8 of 20 SLGC55544C TSKEW Output Skew Skew between DP_IN and DM_IN when connected to DP_OUT and DM_OUT RL = RS = 50 Ω -- 40 -- ps COFF DP_OUT/DM_OUT Off-Capacitance f = 1 MHz --‘ 2.0 -- pF CON DP_IN/DM_IN On-Capacitance f = 240 MHz --‘ 4.0 5.5 pF BW -3dB Bandwidth RL = RS = 50 Ω -- 1000 -- MHz VISO Off-Isolation VDP_OUT, VDP_IN = 0 dBm RL = RS =50 Ω f = 250 MHz -- -20 -- dB VCT Crosstalk VDP_OUT, VDP_IN = 0 dBm RL = RS = 50 Ω f = 250 MHz -- -25 -- dB Electrical Characteristics - Dynamic Performance VDD = 5.0 V, TA = 25 °C (unless specified otherwise) Symbol Parameter Condition/Note Min. Typ. Max. Unit

000-000C55544C-105 Page 9 of 20 SLGC55544C Parameter Measurement Information Test Circuit Voltage Waveform Voltage Waveforms Response Time to Short-Circuit Waveforms ISHORT

000-000C55544C-105 Page 10 of 20 SLGC55544C DCP BC1.2 Operation VOUT Discharge During CTL Lines Change

000-000C55544C-105 Page 11 of 20 SLGC55544C Overview The following overview references various industry standards. It is always recommended to consult the most up-to-date standard to ensure the most recent and accurate information. Rechargeable portable equipment requires an external power source to charge its batteries. USB ports are a convenient location for charging because of an available 5 V power source. Universally accepted standards are required to make sure host and clie nt-side devices operate together in a system to ensure power management requirements are met. Traditionally, USB host ports following the USB 2.0 specification must provide at least 500 mA to downstream client-side devices. Because multiple USB devices can be attached to a single USB port through a bus-pow- ered hub, it is the responsibility of the client-side device to negotiate its power allotment from the host to ensure the total current draw does not exceed 500 mA. In general, each USB device is granted 100 mA and may request more current in 100 mA unit steps up to 500 mA. The host may grant or deny based on the available current. Additionally, the success of USB has made the mini-USB connector a popular choice for wall adapter cables. This allows a portable device to charge from both a wall adapter and USB port with only one connector. One common difficulty has resulted from this. As USB charging has gained popularity, the 500 mA minimum defined by USB 2.0 has become insufficient for many handset and personal media players which need a higher charging rate. On the other hand, wall adapters can provide much more current than 500 mA. Several new standards have been introduced defining protocol handshaking methods that allow host and client devices to acknowledge and draw additional current beyond the 500 mA minimum defined by USB 2.0 while still using a single micro-USB input connector. The SLGC55544C supports three of the most common protocols:

  • USB 2.0 Battery Charging Specification BC1.2
  • Chinese Telecommunications Industry Standard YD/T 1591-2009
  • Divider Mode All three methods have similarities and differences, but the biggest commonality is th at all three define three types of chargi ng ports that provide charging current to client-side devices. These charging ports are defined as:
  • Standard Downstream Port (SDP)
  • Charging Downstream Port (CDP)
  • Dedicated Charging Port (DCP) BC1.2 defines a Charging Port as a downstream facing USB port that provides power for charging portable equipment. The table below shows the differences between these ports according to BC1.2 (draft). BC1.2 (draft) defines the protocol necessary to allow portable equipment to determine what type of port it is connected to so that it can allot its maximum allowable current draw. The hand-shaking process has two steps. During step one, the primary detection, the portable equipment outputs a nominal 0.6-V output on its D+ line and reads the voltage input on its D- line. The portable device concludes it is connected to an SDP if the voltage is less than the nominal data detect voltage of 0.3 V. The portable device concludes that it is connected to a Charging Port if the D- voltage is greater than the nominal data det ect voltage of 0.3 V an d less than 0.8 V. The second step, the se condary detection, is necessary for port able equipment to determine between a CDP and a DCP. The portable device outputs a nominal 0.6 V output on its D- line and reads the voltage input on its D+ line. The portable device concludes it is connected to a CDP if the data line being read remains less than the nominal data detect voltage of 0.3 V. The portable device concludes it is connected to a DCP if the data line being read is greater than the nominal data detect voltage of 0.3V and less than 0.8 V. Operating Modes Port Type Supports USB 2.0 Communication Maximum Allowable Current Draw By Portable Equipment (A) SDP (USB 2.0) Yes 0.5 SDP (USB 3.0) Yes 0.9 CDP Yes 1.5 DCP No 1.5

000-000C55544C-105 Page 12 of 20 SLGC55544C Standard Downstream Port (SDP) An SDP is a traditional USB port that follows USB 2.0/3.0 and supplies a maximum of 500 mA per port for USB 2.0 and 900 mA per port for USB 3.0. USB 2.0 communications is supported, and the host controller must be active to allow charging. Charging Downstream Port (CDP) be active to allow charging. What separates a CDP from an SDP is the host-charge handshaking logic that identifies this port as a CDP. A CDP is identifiable by a compliant BC1.2 (draft) client device and allows for additional current draw by the client device. The CDP hand-shaking process is two steps. During step one the portable equipment outputs a nominal 0.6 V output on its D+ line and reads the voltage input on its D- line. The portable device concludes it is connected to an SDP if the voltage is less than the nominal data detect voltage of 0.3 V. The portable device concludes that it is connected to a Charging Port if the D- voltage is greater than the nominal data detect voltage of 0.3V and less than 0.8 V. The second step is necessary for portable equipment to determine between a CDP and a DCP . The portable device outputs a nominal 0.6 V output on its D- line and reads the voltage input on its D+ line. The portable device concludes it is connected to a CDP if the data line being read remains less than the nominal data detect voltage of 0.3 V. The portable device concludes it is connected to a DCP if the data line being read is greater than the nominal data detect voltage of 0.3V and less than 0.8 V. Dedicated Charging Port (DCP) A DCP is a special type of wall-adapter used in charging applications that uses a micro-B connector to connect to portable devices. A DCP only provides power and does not support data connection to an upstream port. As shown in following sections, a DCP is identified by the electrical characteri stics of its data lines. The SLGC55544C emulates DCP in two charging states, namely DCP Forced and DCP Auto. In DCP Forced state the device will support one of the following two DCP charging schemes: Divider1 or Shorted. In DCP Auto state, the SLGC55544C charge detect ion state machine is enabled wh ich will selectively implement charging schemes involved with the Shorted, Divider1, Divider2, and 1.2 V modes. Shorted DCP mode complies with BC1.2 and Chinese Telecommunications Industry Standard YD/T 1591-2009, Divider and 1.2V modes are used to charge devices that do not comply with BC1.2 DCP standard. High-Bandwidth Data Line Switch The SLGC55544C passes the D+ and D- data lines through the device to enable monitoring and handshaking while supporting charging operation. A wide bandwidth signal s witch is used, allowing data to pass thr ough the device without corrupting signal integrity. The data line switches are turned on in any of CDP or SDP operating modes. The EN input also needs to be at logic High for the data line switches to be enabled. Note: 1. While in CDP mode, the data switches are ON even while CDP handshaking is occurring. 2. The data line switches are OFF if EN is low, or if in DCP mode (BC1.2 (draft ), Divider mode or Auto-detect). They are not automatically turned off if the power switch (IN to OUT) is doing current limiting. With SLGC55544C, the data line switches are also off when in “000” mode. 3. The data switches are for USB 2.0 differential pair only. In the case of a USB 3.0 host, the super speed differential pairs must be routed directly to the USB connector without passing through the SLGC55544C.

000-000C55544C-105 Page 13 of 20 SLGC55544C Logic Control Modes The SLGC55544C supports the listed standards above for the SDP, CDP and DCP modes using the CTL1, CTL2, and CTL3 logic I/O control pins, although their truth tables are different as shown below. The different CTLx settings correspond to the different types of charge modes. Also, using the Auto-Detect Mode, the Divider Mode or BC1.2 (draft) / YD/T 1591-2009 can be automat- ically selected without external user interaction Note: With the SLGC55544C, if the “000” mode is selected, the power switch will be turned off and an output discharge resistor will be connected, while the data line switches will be turned off. Notes: 1. No VOUT discharge when charging between 1111 and 1110. 2. CDP Load present governed by the SMART-CDP function. SLGC55544C Control Truth Table CTL1 CTL2 CTL3 ILIM_SEL MODE Current Limit Settings Note 0 0 0 0 Discharge N/A Output held LOW 0 0 0 1 Discharge N/A Output held LOW 0 0 1 0 DCP Auto ILIM_H Data Lines Disconnected 0 0 1 1 DCP Auto ILIM_H Data Lines Disconnected 0 1 0 0 SDP1 ILIM_L Data Lines Connected 0 1 0 1 SDP1 ILIM_H Data Lines Connected 0 1 1 0 DCP Auto ILIM_H Data Lines Disconnected 0 1 1 1 DCP Auto ILIM_H Data Lines Disconnected 1 0 0 0 DCP Shorted ILIM_L Device forced to stay in DCP BC 1.2 charging mode 1 0 0 1 DCP Shorted ILIM_H Device forced to stay in DCP BC 1.2 charging mode 1 0 1 0 DCP / Divider1 ILIM_L Device forced to stay in DCP Divider1 charging mode 1 0 1 1 DCP / Divider1 ILIM_H Device forced to stay in DCP Divider1 charging mode 1 1 0 0 SDP1 ILIM_L Data Lines Connected 1 1 0 1 SDP1 ILIM_H Data Lines Connected 1 1 1 0 SDP21 ILIM_L Data Lines Connected 1 1 1 1 CDP1,2 ILIM_H Data Lines Connected

000-000C55544C-105 Page 14 of 20 SLGC55544C Wake On USB The SLGC55544C supports low and full speed HID (human interface device like mouse/keyboard) wake function. There are two scenarios under which wake on mouse are supported by the SLGC55544C. The specific CTL pin changes that the SLGC55544C will override are shown below. The information is presented as CTL1, CTL2, CTL3. The ILIM_SEL pin plays no role. 1. 111 (CDP/SDP2) to 011 (DCP-Auto) 2. 010 (SDP1) to 011 (DCP-Auto) Note that the 110 (SDP1) to 011 (DCP-Auto) transition is not supported. This is done for practical reasons since the transition involves changes to two CTL pins. Depending on which CTL pin changes first, the device will see either a temporary 111 or 010 command. The 010 command is safe but the 111 command will cause an OUT discharge as the SLGC55544C will instead proceed to the 111 state. Trans-State Time Transition From Transition To Discharge Time (Typ.) SDP1 CDP 2 s SDP1 DCP 2 s CDP SDP1 2 s CDP DCP 2 s CDP SDP2 No Discharge SDP2 CDP No Discharge DCP SDP1,2 250 ms DCP CDP 250 ms

000-000C55544C-105 Page 15 of 20 SLGC55544C Output Discharge To allow a charging port to renegotiate current with a portable device, SLGC55544C uses the VBUS discharge function. It proceeds by turning off the power switch while discharging VOUT, then turning back ON the power switch to reassert the VOUT voltage. This discharge function is automatically applied when a change at the CTLx lines results in any of the following mode transitions.

  • Any transition to and from CDP
  • Any transition to and from SDP In addition to this, can be achieved using the mode “000”. Overcurrent Protection When an over-current condition is detect ed, the device maintains a constant output current and reduces the output voltage accordingly. Two possible overload conditions can occur. In the first condition, the output has been shorted before the device is enabled or before VIN has been applied. The SLGC55544C senses the short and immediately switches into a constant-current output. In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload occurs, high currents may flow for nominally one to two microseconds before the current-limit circuit can react. The device operates in constant-current mode after the current-limit circuit has responded. Complete shutdown occurs only if the fault is present long enough to activate thermal limiting. The device will remain off until the junction temperature cools approximat ely 10°C and will then re-start. The device will continue to cyc le on/off until the over-current condition is removed. FAULT# Response The FAULT# open-drain output is asserted (active low) during an over-temperature or current limit condition. The output remains asserted until the fault condition is removed. The SLGC55544C is designed to eliminate false FAULT# reporting by using an internal deglitch circuit for current limit conditions without the need for external circuitry. This ensures that FAULT# is not acci- dentally asserted due to normal operation such as starting into a heavy capacitive load. Over-temperature conditions are not deglitched and assert the FAULT# signal immediately. Undervoltage Lockout (UVLO) The undervoltage lockout (UVLO) circuit disables the power switch until the input voltage reaches the UVLO turn-on threshold. Built-in hysteresis prevents unwanted oscillations on the output due to input voltage drop from large current surges. Thermal Sense The SLGC55544C protects itself with two independent thermal sens ing circuits that monitor the operating temperature of the power distribution switch and disables operation if the te mperature exceeds recommended operating conditions. The device operates in constant-current mode during an over-current condition, which increases the voltage drop across power switch. The power dissipation in the package is proportional to the voltage drop across the power switch, so the junction temperature rises during an over-current condition. The first thermal sensor turns off the power switch when the die temperature exceeds 135°C and the part is in current limit. The second thermal sensor turns off the power switch when the die temperature exceeds 155°C regardless of whether the power switch is in current limit. Hysteresis is built into both thermal sensors, and the switch turns on after the device has cooled by approximat ely 10°C. The switch continues to cycle off and on until the fault is removed. The open-drain false reporting output FAULT# is asserted (active low) during an over-temperature shutdown condition. Application and Layout Guidelines
  • The designed power supply range is from 4. 5V to 5.5V. If the input supply is located more than a few inches from the device, an input bypass capacitor larger than 0.1uF is recommended.
  • The trace routing from the upst ream regulator to the VIN pin must be as short as possible to reduce the voltage drop and parasitic inductance.
  • The trace routing from the Current-Limit Set Resistors to the de vice must be as short as possible to reduce parasitic effects on Current-Limit accuracy.

000-000C55544C-105 Page 16 of 20 SLGC55544C Package Top Marking System Definition Part Code Datecode Lot Revision – Part ID Field: identifies the specific device configuration – Date Code Field: Coded date of manufacture – Lot Code: Designates Lot # – Assembly Site/COO: Specifies Assembly Site/Country of Origin – Revision Code: Device Revision XXXXX DD LLL C RR COO

000-000C55544C-105 Page 17 of 20 SLGC55544C Package Drawing and Dimensions

16 Lead TQFN Package

000-000C55544C-105 Page 18 of 20 SLGC55544C Tape and Reel Specifications Carrier Tape Drawing and Dimensions Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 6.75 mm 3 (nominal). More information can be found at www.jedec.org. Package Type # of Pins Nominal Package Size [mm] Max Units Reel & Hub Size [mm] Leader (min) Trailer (min) Tape Width [mm] Part Pitch [mm]per Reel per Box Pockets Length [mm] Pockets Length [mm] TQFN 16L 3X3mm Green 16 3 x 3 x 0.75 5,000 10,000 330 / 100 42 336 42 336 12 8 Package Type Pocket BTM Length Pocket BTM Width Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole to Tape Edge Index Hole to Pocket Center Tape Width A0 B0 K0 P0 P1 D0 E F W TQFN 16L 3X3mm Green

000-000C55544C-105 Page 19 of 20 SLGC55544C

Revision History

9/29/2017 1.05 Added additional conditions for RDSON Added TDIS_LONG and TDIS_SHORT Added Trans-State Time Table Added Wake On USB descriptioin 7/11/2017 1.04 Added Application and Layout Guidelines 2/7/2017 1.03 Updated Control Truth Table 10/5/2016 1.02 Updated Block Diagram and Features 2/4/2016 1.01 Fixed typos and formatting 10/1/2015 1.00 Updated Recommended Operating Conditions Added Recommended Reflow Soldering Profile

000-000C55544C-105 Page 20 of 20 SLGC55544C Silego Website & Support Silego Technology Website Silego Technology provides online support via our website at http://www.silego.com/.This website is used as a means to make files and information easily available to customers. For more information regarding Silego Green products, please visit: http://greenpak.silego.com/ http://greensak.silego.com/ http://greenlib.silego.com/ http://greenfet.silego.com/ http://greenclk.silego.com/ http://greenddr3.silego.com/ Products are also available for purchase directly from Silego at the Silego Online Store at http://store.silego.com/. Silego Technical Support Datasheets and errata, application notes and example designs, user guides, and hardware support documents and the latest software releases are available at the Silego website or can be requested directly at info@silego.com. For specific GreenPAK design or applications questions and support please send e-mail requests to GreenPAK@silego.com Users of Silego products can receive assistance through several channels: Online Live Support Silego Technology has live video technical assistance and sales support available at http://www.silego.com/. Please ask our live web receptionist to schedule a 1 on 1 training session with one of our application engineers. Contact Your Local Sales Representative Customers can contact their local sales representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. More information regarding your lo cal representative is available at the Silego website or send a request to info@silego.com Contact Silego Directly Silego can be contacted directly via e-mail at info@silego.com or user submission form, located at the following URL: http://support.silego.com/ Other Information The latest Silego Technology press releases, listing of seminars and events, listings of world wide Silego Technology offices and representatives are all available at http://www.silego.com/ THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. SILEGO TECHNOLOGY DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLI- CATIONS OR USES OF ITS PRODUCTS. SILEGO TECHNOLOGY RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE.