SKM545ULD CYSTEKEC | Alldatasheet

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Technical content

Features

 150℃ operating junction temperature  Softest, fast switching capability  Reduced ultra-low forward voltage drop (VF) ; better efficiency and cooler operation.  Lead-Free Finish; RoHS Compliant  Halogen and Antimony Free. “Green” Device  MCD technology provides a superior avalanche capability than schottky diodes Mechanical Data  Case: DO-201AD molded plastic  Terminals: Plated axial leads, solderable per MIL-STD-750 method  Polarity: Color band denotes cathode end.  Epoxy: UL 94V-0 rate flame retardant  Polarity : As marked. Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Symbol Min. Typ. Max. Units Maximum DC blocking voltage VDC 45 V Maximum Recurrent peak reverse voltage VRRM 45 V Maximum RMS voltage VRMS 32 V Maximum instantaneous forward voltage at IF=15A TC=25°C VF 0.46 0.49 V TC=125°C 0.42 0.45 Maximum instantaneous VR=45 V, TC=25℃ IR 60 300 μA reverse current at VR=45 V, TC=125℃ 15 35 mA IF(A V) 5A VRRM 45V VF at 125°C 0.42V Tj 150°C

CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 2/5 SKM545ULD CYStek Product Specification Maximum Average forward rectified current @ TC=100℃ IF(AV) 5 A Non-repetitive peak forward surge current @ IFSM 120 A 8.3ms single half sine wave superimposed on rated load (JEDEC method) Peak Repetitive Reverse Surge Current (2uS-1Khz) IRRM 2 A Storage temperature range Tstg -55 150 ℃ Operating junction temperature range TJ -55 150 ℃ Thermal Data Parameter Symbol Value Unit Typical Thermal Resistance, Junction-to-ambient(1) Rth,j-a 60 C/W Typical Resistance, Junction-to-lead(2) Rth,j-l 10 C/W Note 1. 10mm lead length between copper pad 2. Thermal resistance, junction to lead, vertical PCB mounted, 0.375”(9.5mm) lead length

CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 3/5 SKM545ULD CYStek Product Specification Typical Characteristics

CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 4/5 SKM545ULD CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/ -5 C 260 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 5/5 SKM545ULD CYStek Product Specification Important Notice:  All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  CYStek reserves the right to make changes to its products without notice.  CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.