SKM545ULD CYSTEKEC | Alldatasheet
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Technical content
Features
150℃ operating junction temperature Softest, fast switching capability Reduced ultra-low forward voltage drop (VF) ; better efficiency and cooler operation. Lead-Free Finish; RoHS Compliant Halogen and Antimony Free. “Green” Device MCD technology provides a superior avalanche capability than schottky diodes Mechanical Data Case: DO-201AD molded plastic Terminals: Plated axial leads, solderable per MIL-STD-750 method Polarity: Color band denotes cathode end. Epoxy: UL 94V-0 rate flame retardant Polarity : As marked. Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Symbol Min. Typ. Max. Units Maximum DC blocking voltage VDC 45 V Maximum Recurrent peak reverse voltage VRRM 45 V Maximum RMS voltage VRMS 32 V Maximum instantaneous forward voltage at IF=15A TC=25°C VF 0.46 0.49 V TC=125°C 0.42 0.45 Maximum instantaneous VR=45 V, TC=25℃ IR 60 300 μA reverse current at VR=45 V, TC=125℃ 15 35 mA IF(A V) 5A VRRM 45V VF at 125°C 0.42V Tj 150°C
CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 2/5 SKM545ULD CYStek Product Specification Maximum Average forward rectified current @ TC=100℃ IF(AV) 5 A Non-repetitive peak forward surge current @ IFSM 120 A 8.3ms single half sine wave superimposed on rated load (JEDEC method) Peak Repetitive Reverse Surge Current (2uS-1Khz) IRRM 2 A Storage temperature range Tstg -55 150 ℃ Operating junction temperature range TJ -55 150 ℃ Thermal Data Parameter Symbol Value Unit Typical Thermal Resistance, Junction-to-ambient(1) Rth,j-a 60 C/W Typical Resistance, Junction-to-lead(2) Rth,j-l 10 C/W Note 1. 10mm lead length between copper pad 2. Thermal resistance, junction to lead, vertical PCB mounted, 0.375”(9.5mm) lead length
CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 3/5 SKM545ULD CYStek Product Specification Typical Characteristics
CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 4/5 SKM545ULD CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/ -5 C 260 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : K175LD Issued Date : 2015.04.10 Revised Date : 2016.09.26 Page No. : 5/5 SKM545ULD CYStek Product Specification Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.