SKM1550USP CYSTEKEC | Alldatasheet
Document overview
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Technical content
Features
150℃ operating junction temperature Softest, fast switching capability Reduced ultra-low forward voltage drop (VF) ; better efficiency and cooler operation. Lead-Free Finish; RoHS Compliant Halogen and Antimony Free. “Green” Device MCD technology provides a superior avalanche capability than schottky diodes Mechanical Data Case: TO-277 molded plastic Mounting Position: Any Weight: 0.093 grams (approximate) Terminals: Pure tin plated, solderable per JESD22-B102 Epoxy: UL 94V-0 rate flame retardant Polarity : As marked. Left Pin Heat Sink Righte Pin
Ordering Information
(RoHS compliant package) 5000/Tape & Reel Marking Information CYS= Manufacturers’ Code Marking M1550U = Product Type Marking Code Y M = Date Code Marking Y = Last One Digits of Year (ex: 4 for 2014) M = Month code (1 ~ 9、10→A、11→B、12→C) IF(A V) 15A VRRM 50V VF at 125°C 0.43V Tj 150°C
CYStech Electronics Corp. Spec. No. : K178SP Issued Date : 2014.12.27 Revised Date : 2014.12.27 Page No. : 2/6 SKM1550USP CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Symbol Min. Typ. Max. Units Maximum DC blocking voltage VDC 50 V Maximum Recurrent peak reverse voltage VRRM 50 V Maximum RMS voltage VRMS 36 V Maximum instantaneous forward voltage at IF=15A TC=25°C VF 0.47 0.52 V TC=125°C 0.43 0.47 Maximum instantaneous VR=50 V, TC=25℃ IR 110 500 μA reverse current at VR=50 V, TC=125℃ 40 100 mA Maximum Average forward rectified current @ TC=100℃ IF(AV) 15 A Non-repetitive peak forward surge current @ IFSM 280 A 8.3ms single half sine wave superimposed on rated load (JEDEC method) Peak Repetitive Reverse Surge Current (2uS-1Khz) IRRM 2 A Maximum Rate of Voltage Change ( at Rated VR ) dv/dt 10000 V/uS Storage temperature range Tstg -55 150 ℃ Operating junction temperature range TJ -55 150 ℃ Thermal Data Parameter Symbol Value Unit Maximum Thermal Resistance, Junction-to-ambient(1) Rth,j-a 97 C/W Maximum Thermal Resistance, Junction-to-ambient(2) Rth,j-a 39 C/W Note 1. FR-4 PCB, 2oz. Copper. Minimum recommended pad layout.
CYStech Electronics Corp. Spec. No. : K178SP Issued Date : 2014.12.27 Revised Date : 2014.12.27 Page No. : 3/6 SKM1550USP CYStek Product Specification Typical Characteristics
CYStech Electronics Corp. Spec. No. : K178SP Issued Date : 2014.12.27 Revised Date : 2014.12.27 Page No. : 4/6 SKM1550USP CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/-5 C 260 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : K178SP Issued Date : 2014.12.27 Revised Date : 2014.12.27 Page No. : 5/6 SKM1550USP CYStek Product Specification TO-277 Dimension TO277 Dim Min Max A 0.95 1.25 A2 0.2 0.3 b1 0.85 0.95 b2 1.7 1.9 D 3.88 4.08 D2 2.9 3.2 E 6.3 6.7 e 1.74 1.94 E1 5.28 5.48 E2 3.4 3.7 L 0.7 1 L1 0.5 0.75 W 1.1 1.4 All Dimensions in mm Mounting Pad Layout
CYStech Electronics Corp. Spec. No. : K178SP Issued Date : 2014.12.27 Revised Date : 2014.12.27 Page No. : 6/6 SKM1550USP CYStek Product Specification Packing Information W A B C d1 d E F P P0 T D D1 D2 G W1 Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.