SKHR31AB0 SEOUL | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 24
Technical content
www.seoulsemicon.com1 Description Features and Benefits SKHR31AB0 –Side View LED Rev1.0, November 21, 2019 SKHR31AB0 Side View LED
- 1-Chip in one package
- SMT Solderability
- RoHS Compliant
- Low Thermal Resistance
- SKHR31AB0 is very useful side view LED in back light unit application
- Side View LED of PCB type
- Flat Backlighting (LCD, Display)
- Mobile Phone, Camera, PDA, Notebook
- Coupling into Light Guide Panel
- AV systems HF
www.seoulsemicon.com Product Data Sheet 2Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Table of Contents Index
- Product Brief 1
- Table of Contents 2
- Performance Characteristics 3
- Characteristic Diagram 4
- Reliability Test 9
- Color Bin Structure 10
- Mechanical Dimension 13
- Material Structure 14
- Packaging Information 15
- Reflow Soldering Characteristics 18
- Handling of Silicone Resin for LEDs 19
- Precaution For Use 20
- Company Information 24
Table 1. Absolute Maximum Ratings (Ta = 25ºC) Table 2. Electro Optical Characteristics (Ta = 25ºC) mechanical axis of the LED package. Luminous flux Measurement allowance is ±5%. (3) 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. operated with a pulse current , ensure there are no issues. (1) Care is to be taken that power dissipation does not exceed the absolute maximum rating of the pr oduct.
www.seoulsemicon.com Product Data Sheet 4Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Characteristic Diagram Product Data Sheet -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 X-Axis Y-Axis Relative Intensity [a.u.] Radiation Angle [deg.] y x 400 500 600 700 800 0.0 0.5 1.0 Normalized Intensity [a.u.] Wavelength [nm] Fig 1. Color Spectrum, Ta = 25℃, IF = 22mA Fig 2. Radiant Pattern, Ta = 25℃, IF = 22mA
www.seoulsemicon.com Product Data Sheet 5Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Characteristic Diagram Product Data Sheet 0 20 40 60 80 100 100 200 300 400 Relative Luminous Flux [%] Forward Current [mA] 100 Forward Current [mA] Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Flux, Ta = 25℃ Fig 3. Forward Voltage vs. Forward Current, Ta = 25℃
www.seoulsemicon.com Product Data Sheet 6Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Characteristic Diagram Product Data Sheet 0.255 0.260 0.265 0.270 0.275 0.280 100mA 10mA 1mA 22mA 30mA Color Coordinate y Color Coordinate x 0.280 0.285 0.290 0.295 0.300 250 -30 Color coordinate y Color coordinate x Fig 5. Forward Current vs. CIE X, Y Shift, Ta = 25℃ Fig 6. Color Coordinate vs. Ambient Temperature, IF = 22mA
www.seoulsemicon.com Product Data Sheet 7Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Characteristic Diagram Product Data Sheet -40 -20 0 20 40 60 80 0.85 0.90 0.95 1.00 1.05 1.10 Flux / Flux @25 O C [a.u.] Ambient Temperature [ o -40 -20 0 20 40 60 80 0.96 0.98 1.00 1.02 1.04 VF / VF @25 O C [a.u.] Ambient Temperature [ o Fig 7. Forward Voltage vs. Ambient Temperature, IF = 22mA Fig 8. Relative Luminous Flux vs. Ambient Temperature, IF = 22mA Forward Current vs. Ambient Temperature
www.seoulsemicon.com Product Data Sheet 8Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Characteristic Diagram Product Data Sheet Fig 9. Allowable Forward Current vs. Ambient Temperature Fig 10. Allowable Forward Current vs. Duty Ratio, Ta = 25℃ 1 10 100 100 120 Allowable Forward Current [mA] Duty Ratio [%] 0 20 40 60 80 100 Allowable Forward Current [mA] Ambient Temperature [ o
Table 4. Criteria for Judging the Damage Table 3. Test Items and Results
Table 5. Color Rank
Table 6. Bin Code Description
www.seoulsemicon.com Product Data Sheet 13Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Mechanical dimensions ( Tolerance: ±0.1, Unit: mm )PKG Outline Dimension (1) Dimension is not including mold flash or metal burr. <Recommended Solder Pattern> CathodeAnode Notes :
www.seoulsemicon.com Product Data Sheet 14Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Material Structure ②③④ No. LIST MATERIAL ① Frame Glass Fabric Based- Epoxy Resin ② LED Chip GaN on Sapphire ③ Phosphor Nitride + KSF+Silicone ④ Housing Silicone Resin ⑤ Metal Cu Base / Au- Plated
www.seoulsemicon.com Product Data Sheet 15Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Emitter Tape & Reel Packaging (1) Quantity : min 2,000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Notes : ( Tolerance: ±0.2, Unit: mm )
www.seoulsemicon.com Product Data Sheet 16Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box
Table 7. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9
www.seoulsemicon.com Product Data Sheet 18Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Reflow Soldering Characteristics (1) In case that the soldered products are reused in soldering process, we don’t guarantee the produ cts. Notes : Lead Free Solder Pre-heat 90~110℃ Pre-heat time 120 sec. Max. Peak-Temperature 190℃ Max. Soldering time Condition 10 sec. Max. Lead Solder Pre-heat 150~170℃ Pre-heat time 120 sec. Max. Peak-Temperature 220℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. 220 C Max. 10 sec. Max. o 60sec. Max. 120sec. Max. Pre-heating 150~170 Co o2.5~5 C / sec. (2) Low temperature Solder (1) Middle temperature Solder 2.5~5 C / sec. 190 C Max. 10 sec. Max. o 60sec. Max. 120sec. Max. Pre-heating 90~110 Co o2.5~5 C / sec.
www.seoulsemicon.com Product Data Sheet 19Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Handling of Silicone Resin for LEDs Product Data Sheet (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts.
www.seoulsemicon.com Product Data Sheet 20Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Precaution for Use Product Data Sheet (1) Storage conditions Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption. a. Keep it at a temperature in the range from 5C to 30C and at a humidity of less than 50% RH. The product should be kept within a year. (2) After opening the package. When soldering, this could result in a decrease of the photoelectric effect or light intensity. a. Soldering should be done right after mounting the product. b. Keep the temperature in the range from 5C to 30C and the humidity at less than 60%. Soldering should be done within 7 days after opening the desiccant package. An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere. Stored at a humidity of less than 10% RH. (3) Precautions for use Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling. The product should not be mounted on a distorted part of PCB. Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and surge damage, and all devices and equipments must be grounded to the earth. (4) Miscellaneous Radiation resistance is not considered. When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used and IPA(Isopropyl Alcohol) must be used. When using the product, operating current should be settled in consideration of the maximum ambient temperature. Its appearance or specification for improvement is subject to change without notice.
www.seoulsemicon.com Product Data Sheet 21Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Precaution for Use (5) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage currentlowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)
www.seoulsemicon.com Product Data Sheet 22Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device
www.seoulsemicon.com Product Data Sheet 23Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Precaution for Use (6) Side View LED structure and precautions L/F type WICOP type a. The light emitting part of the side view LED consists of silicones and shall not interfere with the light emitting part. Interference with a sharp tool can tear up the silicon, damaging the wire and the chip , it can cause a fatal defect. b. Do not to apply pressure to the white wall area from the outside. If the force is applied, the appearance of the PKG can be distorted (damaged), and the chip can be broken (damaged), resulting in poor lighting. c. Chip crack can occur without any external pressure trace due to PCB bending. d. Be careful when using parts smaller than the illuminating part, as it may interfere with the light emitting part. Be careful not to interference with the light emitting part with sharp tools. Do not to apply excessive force to the central part of the PKG. (chip crack) Do not to externally push the center of the PKG. (housing, chip crack) Defect phenomenon normal Chip crack
www.seoulsemicon.com Product Data Sheet 24Rev1.0, November 21, 2019 SKHR31AB0 –Side View LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice.