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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

  • For surface mounted applications.
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
  • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
  • Low leakage current
  • High surge capability
  • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data
  • Case: Molded plastic, SMB/JEDEC DO-214AA.
  • Terminals: Solder plated, solderable per MIL-STD-750 method 2026
  • Polarity: Indicated by cathode band.
  • Mounting Position : Any.
  • Weight: 0.0878 gram

Ordering Information

(Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T6 : 3000 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C337SB Issued Date : 2005.12.07 Revised Date :2014.04.30 Page No. : 2/7 SK520SB-SK5100SB CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Symbol Type UnitsSK 520 SK 530 SK 540 SK 550 SK 560 SK 580 SK 5100 Repetitive peak reverse voltage V RRM 20 30 40 50 60 80 100 V Maximum RMS voltage V RMS 14 21 28 35 42 56 70 V Maximum DC blocking voltage V R 20 30 40 50 60 80 100 V Maximum instantaneous Average forward rectified current I O 5A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) I FSM 150 A Maximum DC reverse current VR=VRRM,TA=25℃(Note) VR=VRRM,TA=125℃(Note) IR 0.5 mA mA Maximum thermal resistance, Junction to Lead Rth,JL 12 (typ) ℃/W Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage CJ 380(typ) pF Storage temperature Tstg -55 ~ +150 ℃ Operating temperature T J -55 ~ +125 -55 ~ +150 ℃ Notes : Pulse test, pulse width=300μsec, 2% duty cycle Recommended Footprint

CYStech Electronics Corp. Spec. No. : C337SB Issued Date : 2005.12.07 Revised Date :2014.04.30 Page No. : 3/7 SK520SB-SK5100SB CYStek Product Specification Typical Characteristics Forward Current Derating Curve 0 50 100 150 200 Ambient Temperature---TA(℃) Average Forward Current---Io(A) SK550-SK5100 SK520-SK540 Maximum Non-Repetitive Forward Surge Current 100 120 140 160 11 0 1 0 0 Number of Cycles at 60Hz Peak Forward Surge Current---IFSM(A) Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method Forward Current vs Forward Voltage 0.01 0.1 100 Forward Voltage---VF(V) Forward Current---IF(A) Tj=25℃, Pulse width=300μs, 1% Duty cycle SK520-SK540 SK550-SK560 SK580-SK5100 Junction Capacitance vs Reverse Voltage 200 400 600 800 1000 1200 1400 0.01 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Reverse Leakage Current vs Reverse Voltage 0.01 0.1 100 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) Reverse Leakage Current---I R(mA) Tj=75℃ Tj=25℃

CYStech Electronics Corp. Spec. No. : C337SB Issued Date : 2005.12.07 Revised Date :2014.04.30 Page No. : 4/7 SK520SB-SK5100SB CYStek Product Specification Taping Reel Dimension

CYStech Electronics Corp. Spec. No. : C337SB Issued Date : 2005.12.07 Revised Date :2014.04.30 Page No. : 5/7 SK520SB-SK5100SB CYStek Product Specification Recommended Wave Soldering Profile

CYStech Electronics Corp. Spec. No. : C337SB Issued Date : 2005.12.07 Revised Date :2014.04.30 Page No. : 6/7 SK520SB-SK5100SB CYStek Product Specification Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3 °C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C337SB Issued Date : 2005.12.07 Revised Date :2014.04.30 Page No. : 7/7 SK520SB-SK5100SB CYStek Product Specification DO-214AA/SMB Dimension *:Typical DIM Inches Millimeters DIM Inches Millimeters Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DO-214AA/SMB Plastic Surface Mounted Package CYStek Package Code : SB Marking Code : SK520SB SK530SB SK540SB SS52 SS53 SS54 SK550SB SK560SB SK580SB SS55 SS56 SS58 SK5100SB S510