SK5150SC CYSTEKEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
Features
- For surface mounted applications.
- For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
- Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
- Low leakage current
- High surge capability
- High temperature soldering: 250°C/10 seconds at terminals
- Exceeds environmental standards of MIL-S-19500/228 Mechanical Data
- Case: Molded plastic, SMC/JEDEC DO-214AB.
- Terminals: Solder plated, solderable per MIL-STD-750 method 2026
- Polarity: Indicated by cathode band.
- Mounting Position : Any.
- Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Symbol Limits Units Repetitive peak reverse voltage VRRM 150 V Maximum RMS voltage VRMS 105 V Maximum DC blocking voltage VR 150 V Maximum instantaneous forward voltage, IF=5A (Note 1) VF 0.9 V Average forward rectified current @TC=100°C IO 5 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 150 A Maximum DC reverse current VR=150V,TA=25℃ VR=150V,TA=125℃ IR 500 μA Maximum thermal resistance, Junction to ambient Rth,JA 50(typ) ℃/W Maximum thermal resistance, Junction to case Rth,JC 16(typ) ℃/W Diode junction capacitance @ f=1MHz and applied 4VDC Reverse voltage CJ 105(typ) pF Operating Junction and Storage temperature Range Tstg ; TJ -55 ~ +175 ℃
Ordering Information
Device Package Shipping Marking SK5150SC SMC 3000 pcs / Tape & Reel S515
CYStech Electronics Corp. Spec. No. : C489SC Issued Date : 2011.07.082011.04.29 Page No. : 2/4 SK5150SC CYStek Product Specification Typical Characteristics Forward Current Derating Curve 0 25 50 75 100 125 150 175 200 Case Temperature---T C(℃) Average Forward Current---I O(A) Resistive or inductive load Maximum Non-Repetitive Forward Surge Current 100 120 140 160 1 10 100 Number of Cycles at 60Hz Peak Forward Surge Current---IFSM(A) Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method Forward Current vs Forward Voltage 100 1000 10000 100000 Forward Voltage---VF(V) Instantaneous Forward Current---IF(mA) Pulse width=300μs, 1% Duty cycle Tj=25℃ Tj=75℃ Tj=125°C Junction Capacitance vs Reverse Voltage 100 1000 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Tj=25℃, f=1.0MHz Reverse Leakage Current vs Reverse Voltage 0.001 0.01 0.1 100 0 20 40 60 80 100 120 140 160 Reverse Voltage---V R(V) Reverse Leakage Current---I R(μA) Tj=125℃ Tj=75℃ Tj=25℃
CYStech Electronics Corp. Spec. No. : C489SC Issued Date : 2011.07.082011.04.29 Page No. : 3/4 SK5150SC CYStek Product Specification Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : C489SC Issued Date : 2011.07.082011.04.29 Page No. : 4/4 SK5150SC CYStek Product Specification DO-214AB/SMC Dimension DO-214AB/SMC Plastic Surface Mounted Package CYStek Package Code : SC *:Typical Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :
- Lead : Pure tin plated.
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
- CYStek reserves the right to make changes to its products without notice.
- CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.