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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228 Mechanical Data Case: SMA/DO-214AC molded plastic. Terminals: Solder plated, solderable per MIL-STD-750 method 2026 Polarity: Indicated by cathode band. Packaging: 12mm tape per EIA STD RS-481. Weight: 0.064 gram, 0.002 ounce
Ordering Information
Device Package Shipping Marking SK24SA-0-T4-G SMA (Pb-free lead plating and halogen-free package) 7500 pcs / Tape & Reel SK24 SK26SA-0-T4-G SK26 SK28SA-0-T4-G SK28 SK2BSA-0-T4-G SK2B SK2CSA-0-T4-G SK2C SK2DSA-0-T4-G SK2D Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T4 : 7500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name
CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 2/6 SK2XSA CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. ) Parameter Symbol Type Units SK24 SK26 SK28 SK2B SK2C SK2D Repetitive peak reverse voltage VRRM 40 60 80 100 150 200 V Maximum RMS voltage VRMS 28 42 56 70 105 140 V Maximum DC blocking voltage VR 40 60 80 100 150 200 V Maximum instantaneous Average forward rectified current IO 2 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 50 A Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=100℃(Note 1) IR 0.5 mA mA Maximum thermal resistance, Junction to ambient(Note 2) RθJA 80 ℃/W Maximum thermal resistance, Junction to case RθJC 32 Power dissipation TA=25°C (Note 2) PD 1.3 W TC=25°C 3.1 Diode junction capacitance @ f=1MHz and applied 4V reverse voltage CJ 110 (typ) pF Storage temperature Tstg -65 ~ +150 ℃ Operating temperature TJ -65 ~ +150 -65 ~ +175 ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area. Recommended soldering footprint
CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 3/6 SK2XSA CYStek Product Specification Typical Characteristics ─ : 40V - - : 60~200V 0.375” (9.5mm) Lead Length Resistive or Inductive Load TJ=125°C TJ=75°C TJ=25°C ─ : VRRM =40V - - :VRRM=60~200V 40-60V 80-100V 150-200V 1E5 1E4 1000 100 0.1 0.01 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE, % FORWARD VOLTAGE, V 0.01 0.1 1.0 FORWARD CURRENT, A 1 10 100 NO. OF CYCLES at 60Hz 0 20 40 60 80 100 120 140 160 180 LEAD TEMPERATURE, °C REVERSE CURRENT, uA FIG . 1-FORWARD CURRENT DERATING CURVE FIG .2-MAXIMUM NON-REPETITIVE SURGE CURRENT FIG .3- TYPICAL REVERSE CHARACTERISTICS FIG . 4- TYPICAL FORWARD CHARACTERISTICS PEAK FORWARD SURGE CURRENT, A 2.5 2.0 1.5 1.0 0.5 A VERAGE FORWARD RECTIFIED CURRENT, A TA=25°C
CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 4/6 SK2XSA CYStek Product Specification Reel Dimension Carrier Tape Dimension
CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 5/6 SK2XSA CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 265 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/-5 C 265 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 6/6 SK2XSA CYStek Product Specification SMA/DO-214AC Dimension *:Typical DIM Inches Millimeters DIM Inches Millimeters Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : Lead : Pure tin plated. Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SMA/DO-214AC Plastic Surface Mounted Package CYStek Package Code : SA Marking : Device SK24SA SK26SA SK28SA Code SK24 SK26 SK28 Device SK2BSA SK2CSA SK2DSA Code SK2B SK2C SK2D