SK24SA CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • For surface mounted applications.
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
  • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
  • Low leakage current
  • High surge capability
  • High temperature soldering: 250°C/10 seconds at terminals
  • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data
  • Case: SMA/DO-214AC molded plastic.
  • Terminals: Solder plated, solderable per MIL-STD-750 method 2026
  • Polarity: Indicated by cathode band.
  • Packaging: 12mm tape per EIA STD RS-481.
  • Weight: 0.064 gram, 0.002 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Type Parameter Symbol SK22 SK24 SK26 SK28 SK2B Units Repetitive peak reverse voltage VRRM 20 40 60 80 100 V Maximum RMS voltage VRMS 14 28 42 56 70 V Maximum DC blocking voltage VR 20 40 60 80 100 V Maximum instantaneous Average forward rectified current IO 2 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 80 A Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=125℃(Note 1) IR 0.5 mA mA Maximum thermal resistance, Junction to ambient(Note 2) RθJA 80 Maximum thermal resistance, Junction to case RθJC 32 ℃/W TA=25°C (Note 2) 1.3 Power dissipation TC=25°C PD 3.1 W Diode junction capacitance @ f=1MHz and applied 4V reverse voltage CJ 110 (typ) pF Storage temperature Tstg -55 ~ +150 ℃ Operating temperature TJ -55 ~ +125 ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.

CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2013.05.22 Page No. : 2/6 SK2XSA CYStek Product Specification Characteristic Curves SK26 SK22-SK24 SK28-SK2B

CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2013.05.22 Page No. : 3/6 SK2XSA CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2013.05.22 Page No. : 4/6 SK2XSA CYStek Product Specification Recommended soldering footprint

CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2013.05.22 Page No. : 5/6 SK2XSA CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 265 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 265 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date :2013.05.22 Page No. : 6/6 SK2XSA CYStek Product Specification SMA/DO-214AC Dimension Marking : Device SK22SA SK24SA SK26SA Code SK22 SK24 SK26 Device SK28SA SK2BSA Code SK28 SK2B SMA/DO-214AC Plastic Surface Mounted Package CYStek Package Code : SA *:Typical Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.