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  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

  • For surface mounted applications.
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
  • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
  • Low leakage current
  • High surge capability
  • High temperature soldering: 250°C/10 seconds at terminals
  • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data
  • Case: Molded plastic, SMC/JEDEC DO-214AB.
  • Terminals: Solder plated, solderable per MIL-STD-750 method 2026
  • Polarity: Indicated by cathode band.
  • Mounting Position : Any.
  • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Type Parameter Symbol SK220 SK240 SK260 SK2100 SK2150 Units Repetitive peak reverse voltage VRRM 20 40 60 100 150 V Maximum RMS voltage VRMS 14 28 42 70 105 V Maximum DC blocking voltage VR 20 40 60 100 150 V Maximum instantaneous forward voltage, IF=2A VF 0.50 0.7 0.85 0.9 V Average forward rectified current IO 2 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 50 A Maximum DC reverse current VR=VRRM,TA=25℃ VR=VRRM,TA=125℃ IR 0.5 mA mA Maximum thermal resistance, Junction to ambient Rth,JA 55 Maximum thermal resistance, Junction to lead Rth,JL 2 0 (Note) ℃/W Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage CJ 170(typ) pF Storage temperature Tstg -55 ~ +150 ℃ Operating temperature TJ -55 ~ +125 -55 ~ +150 ℃ Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area.

CYStech Electronics Corp. Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 2/ 5 SK220SC-SK2150SC CYStek Product Specification Characteristic Curves Forward Current Derating Curve 0.5 1.5 2.5 0 50 100 150 200 Ambient Temperature---T A(℃) Average Forward Current---Io(A) Maximum Non-Repetitive Forward Surge Current 1 10 100 Number of Cycles at 60Hz Peak Forward Surge Current---IFSM(A) Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method Forward Current vs Forward Voltage 0.01 0.1 Forward Voltage---V F(V) Instantaneous Forward Current---IF(A) Tj=25℃, Pulse width=300μs, 1% Duty cycle SK22-SK24 SK26 SK28-SK2B Junction Capacitance vs Reverse Voltage 100 200 300 400 500 600 700 0.01 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Reverse Leakage Current vs Reverse Voltage 0.01 0.1 100 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) Reverse Leakage Current---I R(mA) Tj=75℃ Tj=25℃

CYStech Electronics Corp. Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 3/ 5 SK220SC-SK2150SC CYStek Product Specification

Ordering Information

Device Package Shipping Marking SK220SC SMC 3000 pcs / Tape & Reel SK22 SK240SC SMC 3000 pcs / Tape & Reel SK24 SK260SC SMC 3000 pcs / Tape & Reel SK26 SK2100SC SMC 3000 pcs / Tape & Reel S210 SK2150SC SMC 3000 pcs / Tape & Reel S215

CYStech Electronics Corp. Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 4/ 5 SK220SC-SK2150SC CYStek Product Specification Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C347SC Issued Date : 2011.05.30 Revised Date : Page No. : 5/ 5 SK220SC-SK2150SC CYStek Product Specification DO-214AB/SMC Dimension DO-214AB/SMC Plastic Surface Mounted Package CYStek Package Code : SC *:Typical Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.