SK14SB CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • For surface mounted applications.
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
  • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0.
  • Low leakage current.
  • High surge capability.
  • High temperature soldering: 250°C/10 seconds at terminals.
  • Exceeds environmental standards of MIL-S-19500/228. Mechanical Data
  • Case: Molded plastic, JEDEC DO-214AA/SMB.
  • Terminals: Solder plated, solderable per MIL-STD-750 method 2026.
  • Polarity: Indicated by cathode band.
  • Mounting position: Any.
  • Weight: 0.093 gram. Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, re sistive or inductive load. For capacitive load, derate current by 20%. ) Type Parameter Symbol SK12 SK13 SK14 SK15 SK16 SK18 SK1B Units Repetitive peak reverse voltage VRRM 20 30 40 50 60 80 100 V Maximum RMS voltage VRMS 14 21 28 35 42 56 70 V Maximum DC blocking voltage VR 20 30 40 50 60 80 100 V Maximum instantaneous forward V oltage @ IF=1A (Note 1) VF 0.5 0.7 0.85 V Maximum average forward rectified current @ TL=100°C IO 1 A Peak forward surge current @ 8.3ms, single half sine-wave superimposed on rated load (JEDEC method) IFSM 30 A Maximum DC reverse current at Rated DC blocking TJ=25 °C v o l t a g e T J = 1 0 0 °C IR 0.5 mA Typical thermal resistance, junction to ambient Rth, JA 40 °C/W Typical diode junction capacitance @ f=1MHz and applied 4V reverse voltage CJ 120 pF Storage temperature Tstg -55 ~ +150 °C Operating temperature TJ -55 ~ +125 °C

CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 2/5 SK12SB thru SK1BSB CYStek Product Specification Characteristic Curves SK12-SK14 SK16 SK18-SK1B

CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 3/5 SK12SB thru SK1BSB CYStek Product Specification Recommended Footprint Inches Millimeters DIM Typ Typ A 0.142 3.60 B 0.059 1.50 C 0.118 3.00

Ordering Information

Device Package Shipping Marking SK12SB SMB 3000 pcs / Tape & Reel SK12 SK13SB SMB 3000 pcs / Tape & Reel SK13 SK14SB SMB 3000 pcs / Tape & Reel SK14 SK15SB SMB 3000 pcs / Tape & Reel SK15 SK16SB SMB 3000 pcs / Tape & Reel SK16 SK18SB SMB 3000 pcs / Tape & Reel SK18 SK1BSB SMB 3000 pcs / Tape & Reel SK1B

CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 4/5 SK12SB thru SK1BSB CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C752SB Issued Date : 2012.09.20 Revised Date : Page No. : 5/5 SK12SB thru SK1BSB CYStek Product Specification SMB/DO-214AA Dimension Marking Code : SK12SB SK13SB SK14SB SK15SB SK12 SK13 SK14 SK15 SK16SB SK18SB SK1BSB SK16 SK18 SK1B SMB/DO-214AA Plastic Surface Mounted Package CYStek Package Code : SB *:Typical Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.