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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications. Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0. Low leakage current. High surge capability. High temperature soldering: 250C/10 seconds at terminals. Exceeds environmental standards of MIL-S-19500/228. Mechanical Data Case: Molded plastic, JEDEC DO-214AC/SMA. Terminals: Solder plated, solderable per MIL-STD-750 method 2026. Polarity: Indicated by cathode band. Mounting position: Any. Weight: 0.064 gram, 0.002 ounce.
Ordering Information
Device Package Shipping Marking SK12SA-0-T4-G SMA (Pb-free lead plating and halogen-free package) 7500 pcs / Tape & Reel SK12 SK13SA-0-T4-G SK13 SK14SA-0-T4-G SK14 SK15SA-0-T4-G SK15 SK16SA-0-T4-G SK16 SK18SA-0-T4-G SK18 SK1BSA-0-T4-G SK1B Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T4 : 7500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name
CYStech Electronics Corp. Spec. No. : C752SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 2/6 SK12SA thru SK1BSA CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Symbol Type Units SK12 SK13 SK14 SK15 SK16 SK18 SK1B Repetitive peak reverse voltage VRRM 20 30 40 50 60 80 100 V Maximum RMS voltage VRMS 14 21 28 35 42 56 70 V Maximum DC blocking voltage VR 20 30 40 50 60 80 100 V Maximum instantaneous forward Voltage @ IF=1A (Note 1) VF 0.5 0.7 0.85 V Maximum average forward rectified current @ TL=100°C IO 1 A Peak forward surge current @ 8.3ms, single half sine-wave superimposed on rated load (JEDEC method) IFSM 30 A Maximum DC reverse current at Rated DC blocking TJ=25 °C voltage TJ=100°C IR 0.5 mA Typical thermal resistance, junction to lead R th, JA 85 °C/W Typical thermal resistance, junction to case Rth, JC 18 °C/W Power Dissipation TA=25°C PD 1.5 W TC=25°C 7 Typical diode junction capacitance @ f=1MHz and applied 4V reverse voltage CJ 120 pF Storage temperature Tstg -55 ~ +150 °C Operating temperature TJ -55 ~ +125 °C Recommended soldering footprint
CYStech Electronics Corp. Spec. No. : C752SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 3/6 SK12SA thru SK1BSA CYStek Product Specification Characteristic Curves SK12-SK14 SK16 SK18-SK1B
CYStech Electronics Corp. Spec. No. : C752SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 4/6 SK12SA thru SK1BSA CYStek Product Specification Reel Dimension Carrier Tape Dimension
CYStech Electronics Corp. Spec. No. : C752SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 5/6 SK12SA thru SK1BSA CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/ -5 C 260 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : C752SA Issued Date : 2006.07.13 Revised Date :2014.09.24 Page No. : 6/6 SK12SA thru SK1BSA CYStek Product Specification SMA/DO-214AC Dimension *:Typical DIM Inches Millimeters DIM Inches Millimeters Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : Lead : Pure tin plated. Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SMA/DO-214AC Plastic Surface Mounted Package CYStek Package Code : SA Marking : SK12SA SK13SA SK14SA SK15SA SK12 SK13 SK14 SK15 SK16SA SK18SA SK1BSA SK16 SK18 SK1B