SHBK07 SEOUL | Alldatasheet
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Technical content
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) *Customer : Specification SHBK07 CUSTOMER Approved byChecked by SUPPLIER Approved byDrawn by
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00)
Contents
- Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Characteristic Diagram 5. Reliability Test Item and Condition 6. Rank of SHBK07 7. Material 8. Outline Dimension 9. Packing 10. Soldering 11. Precaution for use
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) Revision HistoryRevision History The institution of New SpecMarch. 31. 200900 SummaryPage.DateRevision No.
Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) SHBK07 SHBK07 1.Description
- 1-chip in one package
- SMT solderability
- Own patent reserved
- R oHS Compliant
- Low Thermal Resistance
- Pb-free Reflow Soldering application
- SHBK07 is very useful side view LED in back light unit
- Mobile Phone, Camera, PDA, Notebook
- Coupling into Light Guide Panel
- AV systems
Features
Applications
- Side View LED of Reflector type application • Flat Backlighting (LCD, Display)
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 2. Absolute maximum ratings*1 ºC125TjJunction Temperature ºC-40 ~ +100TstgStorage Temperature ºC-30 ~ +85ToprOperating Temperature V5VRReverse Voltage mA100IFM *2Peak Forward Current mA30IFForward Current mW120PdPower Dissipation UnitValueSymbolParameter (Ta = 25℃) *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 0.1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electro-Optical characteristics 1700-1600 1600-1500 S16H S15H 3.4-3.0Rank z30 1500-1400 1400-1300 S14H S13H S12H 3.4-3.2 VF Rank Z32 3.2-3.0Rank Z30 Rank Z28 deg.120IF =20mA2θ ½Viewing Angle *2 mcd 1300-1200 IF =20mAIV Luminous Intensity*1 µA50--VR=5VIRReverse Current V 3.0-2.8 IF =20mAForward Voltage UnitMaxTypMinConditionSymbolParameter (Ta = 25℃) * Luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. * θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. * Measurement Uncertainty of the Color Coordinates is ±0.01 * The preliminary color coordinate can be changed without notice * Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of Seoul Semiconductor.
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 4. Characteristic Diagram Radiation DiagramForward Current vs. Ambient Temperature Intensity vs. Forward CurrentForward Current vs. Forward Voltage 0 5 10 15 20 25 30 500 1000 1500 2000 2500 3000 Ta = 25 O C Intensity [mcd] Forward Current [mA] Ta = 25 O C Forward Current [mA] Forward Voltage [ V] (Ta=25 OC ) -30 -15 0 153 0 456 0 759 0 Forward current [mA] Ambient temperature [ o y x -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.5
1.0 Ta = 25
O C x axis y axis Intensity Theta [ o
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) Color Coordinate vs. Ambient TemperatureForward Voltage vs. Ambient Temperature Spectrum Color Coordinate vs. Forward Current 0.278 0.280 0.282 0.322 0.324 0.326 0.328 0.330 0.332 0.334 Ta = 25 O C 1 mA 30 mA y Coord. x Coord. 400 500 600 700 800 Ta = 25 O C IF = 20 mA Intensity [%] Wavelength [nm] 0.266 0.268 0.270 0.272 0.274 0.276 0.278 0.280 0.282 0.284 0.286 0.288 0.290 0.292 0.294 0.296 0.298 IF = 20 mA y Coord. x Coord. o C o C -30 o C -30 -15 0 153 0 456 0 759 0 105 0.96 0.98 1.00 1.02 1.04 1.06 IF = 20 mA VF / VF [25 O Ambient Temperature [ o
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) Allowable Forward Current vs. Duty Ratio Relative Luminosity vs. Ambient Temperature 11 0 100 100 120 Ta = 25 O C Allowable Forward Current [mA] Duty Ratio [%] (If = 20mA ) -30 -15 0 153 04 56 07 5 90 0.7 0.8 0.9 1.0 1.1 1.2 Iv / Iv [25 o Ambient Temperature [ o
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 5. Reliability Test * TEST ITEMS AND RESULTS 0/5010 cycle25℃ ~ 65℃ ~ -10℃ TH = 90%, 24 hr / 1 cycle JEITA ED-4701 200 203 Moisture Resistance Cycle 0/50100 cycle-40℃ ~ 25℃ ~ 100℃ ~ 25℃ (30min) (5min) (30min) (5min) JEITA ED-4701 100 105Temperature Cycle 0/501 times over 95% Tsld = 215±5℃, 3 sec (Lead Solder) JEITA ED-4701 303 Solder ability (Reflow Soldering) 0/502 timesTsld = 260℃, 10 sec pre treatment ; 30℃, 70%, 168hrs JEITA ED-4701 301 302 Resistance to Soldering Heat HoursTa = 60℃, RH = 90%, IF = 20mAJEITA ED-4701 100 102 High Humidity Heat Life Test 0/201,000 HoursTa = 60℃, RH = 90%JEITA ED-4701 100 103 Humidity Heat Load 0/201,000 HoursTa = -40℃JEITA ED-4701 200 202 Low Temperature Storage 0/5020 CycleTa = -30℃ (30MIN) ~ 85℃ (30MIN)JEITA ED-4701 300 307Thermal Shock 0/201,000 HoursTa = 85℃, IF = 5mA-High Temperature Life Test 0/201,000 HoursTa = -30℃, IF = 20mA-Low Temperature Life Test HoursTa = 25℃, IF = 30mAJEITA ED-4701 100 101 Life Test 2 0/201,000 HoursTa = 100℃JEITA ED-4701 200 201 High Temperature Storage 0/201,000 HoursTa = 25℃, IF = 20mAJEITA ED-4701 100 101Life Test 1 Number of Damage Duration / CycleTest ConditionReferenceItem * Criteria for Judging the Damage -LSL*2 × 0.5IF =20mAIVLuminous Intensity USL × 2.0-VR=5VIRReverse Current USL*1 × 1.2-IF =20mAVFForward Voltage MAXMIN Criteria for Judgement ConditionSymbolItem Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 6. Rank of SHBK07 * CIE Chromaticity Diagram 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515520525530535 540 545 550 555 560 565 570 575 580 585 590 595600 610620630 830 y Coord. x C o o r d . 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 Z5Z4Z3Z2Z1Z0 H2S H0S F2S F0S D2S y Coord. x C o o r d . D0S Z5Z4Z3Z2Z1Z0 Z5Z4Z3Z2Z1Z0 * Color Rank yxyxyx H0SF0SD0S yxyxyx H2SF2SD2S
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 7. Material ChipEncapsulateWireReflectoritem GaNSiliconeGoldPPAMaterial
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 8. Outline Dimension ( Tolerance: ±0.2, Unit: mm ) <Recommended solder Pattern> [Bottom View] Cathode Cathode Mark Anode
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 9. packing 12.0±0.02 4.0±0.1 Anode Cathode +0.1 2.0±0.05 4.0±0.1 SECTION B-B' ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 3500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Label 180 ±0.3 2 ±0.2 15.4 +0.2 ±1.0
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 9. packing
- Lot Number The lot number is composed of the following characters ExampleMeaningSymbol 8 for 2008, 9 for 2009, 10 for 2010 ‥‥Year○ 01 for Jan., 02 for Feb., ‥‥ 12 for Dec.Month□□ 001, 002, 003, 004, 005, 006, 007 ‥‥Number◇◇◇ LOT NUMBER : XXXXXXXX Material : Paper(SW3B(B)) SSC PART NUMBER : XXXXXXXX SEOUL Acriche Semiconductor EcoLight RoHS TUV a MADE IN KOREA TYPE b 7inch c SIZE (mm) 220245 245 220 a b 142 c QUANTITY : XXXX Barcode Label Reel RANK : Outer Box Structure XXX Humidity indicator Desiccant Aluminum Vinyl Bag SHBK07
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 10. soldering (1) Lead Solder Preliminary heating to be at maximum 210°C for maximum 2 minutes. Soldering heat to be at maximum 240°C for maximum 10 seconds. 0 153 04 56 07 59 0 105 120 135 150 165 180 195 120 160 200 240 280 Soldering Times [sec] Device Surface Temperature [ o (2) Lead-Free Solder Preliminary heating to be at maximum 220°C for maximum 2 minutes. Soldering heat to be at maximum 260°C for maximum 10 seconds. 0 15 30 45 60 75 90 105 120 135 150 165 180 195 120 160 200 240 280 Device Surface Temperature [ o Soldering Times [sec] (3) Hand Soldering conditions Not more than 5 seconds @MAX 300°C, under Soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 00 Rev. 00 March 2009March 2009 www.www.acricheacriche.com .com Document No. : SSC-QP-7-07-24 (Rev.00) 11. precaution for use (1) Storage conditions
- Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption. a. Keep it at a temperature in the range from 5°Ct o 30°C and at a humidity of less than 60% RH.
- In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas. (2) After opening the package .
- When soldering, this could result in a decrease of the photoelectric effect or light intensity. a. Soldering should be done right after mounting the product. b. Keep the temperature in the range from 5°Ct o 40°C and the humidity at less than 30%.
- Soldering should be done within 7 days after opening the desiccant package. If the product has been exposed for more than 7 days after opening the package or the indicating color of the desiccator changes, the product must be baked at a temperature between 60°Ca nd 65°C for 10 to 12 hours.
- An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere. (3) Precautions for use
- Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling.
- The product should not be mounted on a distorted part of PCB.
- Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and surge damage, and all devices and equipments must be grounded to the earth. (4) Miscellaneous
- Radiation resistance is not considered.
- When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used and IPA(Isopropyl Alcohol) must be used.
- When using the product, operating current should be settled in consideration of the maximum ambient temperature.
- Its appearance or specification for improvement is subject to change without notice.