SFW814AHA

SFW814AHA SEOUL | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 23

Technical content

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Seoul semiconductor Customer Drawn by Checked by Approved by Approved by SPECIFICATION [SFW814AHA]

Description

www.seoulsemicon.com2 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt SFW814AHA Rev1.0, November 28, 2019 Enabling High Flux system while reduces LED count SFW814AHA

• 1-chip and No-package
• SMT solder ability
• Own patent reserved
• RoHS Compliant
• Low Thermal Resistance
• Pb-free Reflow Soldering application
• Very useful Top View LED in small Flash application
• 1.4mm x 1.4mm x 0.25mm
• Chip on the Board
• Camera cell phones
• PDA’s RoHS

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Table of Contents Index

• Product Brief 2
• Table of Contents 3
• Performance Characteristics 4
• Characteristic Diagram 5
• Reliability Test 10
• Color Bin Structure 11
• Mechanical Dimension 13
• Material Structure 14
• Emitter Tape & Reel Packaging 15
• Product Nomenclature 17
• Reflow Soldering Characteristics 18
• Handling of Silicone Resin for LEDs 19
• Precaution For Use 20
• Company Information 23

Reverse Voltage VR Not designed for reverse condition. Table 2. Electro Optical Characteristics (Ta = 25ºC) (2) Фv is total luminous flux output as measured with an integrating sphere. (3) 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. (1) Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. (2) Peak pulsed forward current applies to TON ≤ 300ms and 10% maximum duty cycle. (3) Maximum drive current depends on junction temperature. Table 1. Absolute Maximum Ratings (Ta = 25ºC)

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Characteristic Diagram Fig 1. Color Spectrum, Ta = 25℃, IF = 1000mA, RH30% Fig 2. Radiant pattern, Ta = 25℃ -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.5

1.0 Ta = 25

O C x axis y axis Relative Intensity [a.u.] Radiation angle [deg.] 400 500 600 700 800 Normalized Intensity [a.u.] Wavelength [nm] Ta = 25 O C IF = 1000mA

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Characteristic Diagram Fig 3. Forward Voltage vs. Forward Current , Ta = 25℃ Fig 4. Forward Current vs. Relative Luminous Flux, Ta = 25℃ 0 150 300 450 600 750 900 100 150 200 250 Ralative Luminous Flux [lm] Ta = 25 O C Forward Current [mA] 200 400 600 800 1000 Ta = 25 O C Forward Current [mA] Forward Voltage [V]

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Characteristic Diagram Fig 5. Forward Current vs Delta CCT, Ta = 25℃ Fig 6. Ambient Temperature vs. Delta Color Coordinate , IF =1000mA 20 30 40 50 60 70 80 90 -0.020 -0.015 -0.010 -0.005 0.000 Delta Cx Delta Cy Delta Cx/Cy Ambient Temprature [ o 0 200 400 600 800 1000 -250 -200 -150 -100 -50 Ta = 25 O C Delta CCT [K] Forward Current [mA]

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Characteristic Diagram Fig 7. Forward Voltage vs. Ambient Temperature, IF =350mA Fig 8. Relative Luminosity vs. Ambient Temperature, IF =350mA Forward Current vs. Ambient Temperature -40 -20 0 20 40 60 80 0.94 0.96 0.98 1.00 1.02 1.04 VF / VF @25 O C [a.u.] Ambient Temprature [ o IF = 350mA -40 -20 0 20 40 60 80 0.85 0.90 0.95 1.00 1.05

1.10 IF = 350mA

IVF / IVF @25 O C [a.u.] Ambient Temprature [ o

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Characteristic Diagram Fig 9. Allowable Forward Current vs. Ambient Temperature Fig 10. Allowable Forward Current vs. Duty Ratio, Ta = 25℃, Tw=0.3s 200 400 600 800 1000

100 Ta = 25

O C Duty Ratio[%] Allowable Forward Current [mA] 0 20 40 60 80 100 100 200 300 400 Allowable Forward Current [mA] Ambient Temprature [ o

Table 3. TEST ITEMS AND RESULTS Table 4. Criteria for Judging the Damage

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Color Bin Structure CIE Chromaticity Diagram RANK x1 y1 x2 y2 x3 y3 x4 y4 A 0.3452 0.3771 0.3725 0.3973 0.3616 0.3402 0.3417 0.3266 * Measurement Uncertainty of the Color Coordinates is ±0.01 0.30 0.32 0.34 0.36 0.38 0.40 0.42 Cy Cx A

Table 5. Bin Code description

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Mechanical Dimensions Size Tolerance: ±0.10, Unit: mm Thickness Tolerance : ±0.05, Unit: mm PKG Outline dimension Inner circuitRecommended Solder Pattern [mm] TOP Bottom Side Cathode Anode Anode mark

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Material Structure (3) (1) (2) (4) Chip(1) PIS Paste(2) PIS(3) White wall(4) InGaN Silicone YAG 계열 Silicone S社 D社 F社 D社 PKG Material Structure

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Emitter Tape & Reel Packaging (1) Quantity : 1,500pcs/Reel, 3,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 180 11.4±1.0 9±0.3 Size A0 : 1.6±0.05 B0 : 1.6±0.05 K0 : 0.5±0.05 Cathode side

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box

Table 4. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Reflow Soldering Characteristics (1) Lead Solder Profile Feature Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 150 °C 180 °C 80-120 seconds Time maintained above: - Temperature (TL) - Time (tL) 217~220°C 80-100 seconds Peak Temperature (Tp) 250~255℃ Time within 5°C of actual Peak Temperature (tp)2 20-40 seconds Ramp-down Rate 6 °C/second max. Time 25°C to Peak Temperature 8 minutes max. (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED\`s characteristics should be carefully checked before and after such repair.. (3) Die slug is to be soldered. (4) Do not put stress on the LEDs during heating. (5) After reflow, do not clean PCB by water or solvent. SMT recommendation (1) Flux Cleaning recommendation (2) Solder Paste materials (SAC 305, No Cleaning Paste )

• Dong-jin DT-7312S (3) We recommend on/off(@1mA) and TOV/IR test.

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. (2) Sharp objects of all types should not be used to pierce the sealing compound. (3) When it is mounted WICOP on the PCB, material of the pick and place nozzle must be used soft form in SMT. (4) It must be choosing a pick and place nozzle which is smaller than the WICOP’s size. (5) (2),(3) contents is necessary in SMT to prevent surface of WICOP (6) In case WICOP is not recommended isopropyl alcohol and ultrasonic , solvent for cleaning . Isopropyl alcohol and ultrasonic, solvent cleaning may cause damage to the WICOP (7) If you want to be cleaning particle on surface of WICOP, Seoul semiconductors suggests using cotton bud for cleaning after soldering of components (8) Avoid leaving fingerprints on silicone resin parts.

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Precaution for Use (1) Storage conditions Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption. a. Keep it at a temperature in the range from 5C to 30C and at a humidity of less than 50% RH. The product should be kept within a year. (2) After opening the package . When soldering, this could result in a decrease of the photoelectric effect or light intensity. a. Soldering should be done right after mounting the product. b. Keep the temperature in the range from 5C to 30C and the humidity at less than 60%. Soldering should be done within 7 days after opening the desiccant package. If the product has been exposed for more than 7 days after opening the package or the indicating color of the desiccator changes, the product must be baked at a temperature between 65 ±5C for less than 24 hours. An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere. Stored at a humidity of less than 10% RH. (3) Precautions for use Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling. The product should not be mounted on a distorted part of PCB. Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and surge damage, and all devices and equipments must be grounded to the earth. Turn on test is conducted only at room temperature. Also, Should not be turned on at high temperatures (4) Miscellaneous Radiation resistance is not considered. When cleaning the product, any kind of fluid such as water, oil and organic solvent, IPA(Isopropyl Alcohol) must not be used When using the product, operating current should be settled in consideration of the maximum ambient temperature. Its appearance or specification for improvement is subject to change without notice.

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Precaution for Use (5) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the WICOP - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device

Rev1.0, November 28, 2019 www.seoulsemicon.com Product Data Sheet SFW814AHA 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice.