SFT722N-S SEOUL | Alldatasheet

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*Customer: SPECIFICA TION ITEM Top View LED MODEL SSC-SFT722N-S [Contents] CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 1/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)

  1. Features Pb-free Reflow Soldering application RoHS Compliant 6-Pin (R,G,B separate) type Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Silicone Resin High Reliability 2. Application Indoor and outdoor displays LCD Backlights etc. R G B – displays Automotive Signage and Channel letter Indicator 3. Absolute Maximum Ratings *1 (Ta=25ºC) Value Parameter Symbol Red Green Blue Unit Forward Current IF 30 30 30 mA Forward Peak Surge Current *2 IFM 100 100 100 mA Reverse Voltage (per die) VR 5 V 81*3 120*3 114*3 Power Dissipation Pd 263*4 mW Operating Temperature Topr -40 ~ +100 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 2/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)
  1. Electro-Optical Characteristics (Ta=25ºC) Parameter Symbol Condition Min Typ Max Unit Red IF =20mA 1.8 2.1 2.3 Green IF =20mA 3.0 3.2 3.5- Forward Voltage Blue VF IF =20mA 3.0 3.2 3.5- V Red - - 1 Green - - 1 Reverse Current Blue IR VR=10V (per die) - - 1 µA Red - 700 1100 Green - 1200 1600 Luminance Intensity *1 Blue IV IF =20mA (per chip) - 400 560 mcd Red IF =20mA - 632 - Green IF =20mA - 518 - Peak Wavelength Blue λP IF =20mA - 453 - nm Red IF =20mA 620 623 625 Green IF =20mA 520 527 535 Dominant Wavelength Blue λd IF =20mA 455 460 465 nm Red IF =20mA - 14 - Green IF =20mA - 33 - Spectral Bandwidth Blue IF =20mA - 23 - nm Viewing Angle *3 R, G, B 2θ½ IF =20mA (per die) - 120 - deg. *1 The luminous intensity IV was measured at the pea k of the spatial pattern which may not be aligned w ith the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 3/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)
  1. Rank of SFT722N-S SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 4/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)
  1. Rank of Color 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620630 830 BA Bluish White Blue y x Green Red SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 5/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 6/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03) 0.20 0.22 0.24 0.26 0.28 0.30 hg fe dc b y x a

  1. Soldering Profile (1) Reflow Soldering Conditions / Profile Lead Solder Pre-heat 130~210℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. . * Condition ocooling 6 C/sec. Max. 240 C Max. 10 sec. Max. o 60sec. Max. Above 210 C 120sec. Max. Pre-heating 130~210 C1~5 C / sec. ooo o1~5 C / sec. Lead Solder (2) Lead -free solder * Condition 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 180~220 C1~5 C / sec. ooo o1~5 C / sec. Lead-frame Solder cooling 6 C/sec. Max.o (1) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (2) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the ch ip mounter, the picking up nozzle t hat does no t af fect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 7/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03) Pre-heat 180~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. Lead Free Solder
  • MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Silicone Resin Electrodes Ag Plating Copper Alloy SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 8/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03) 8. Outline Dimension Circuit Diagram Red Anode Green Anode Blue Anode Green Cathode Red Cathode Blue Cathode Rear ViewRight ViewFront View Package Marking (Cathode) 12 3 456 Package Outlines Recommended Solder Pad ( Tolerance: ±0.2, Unit: mm ) ( Tolerance: ±0.2, Unit: mm )

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 9/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03) (1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1 -0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package ( Tolerance: ±0.2, Unit: mm ) 9. Packing

  1. Reel Packing Structure XXXXXX Outer Box Structure PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. XXXXXX a RoHS ca b XXXX SIDE 2457inch 220 142 SIZE (mm) Material : Paper(SW3B(B)) SEOUL SEMICONDUCTOR CO., LTD. TYPE b c Aluminum Vinyl Bag Reel PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX HUMIDITY INDICATOR XXXX DESI PAK XXXX LOT NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. XXXXXX PART NUMBER : QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 10/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)
  1. Lot Number The lot number is composed of the following characters; M FT First Part Name ○ Y ear (6 for 2006, 7 for 2007, 8 for 2008 ) □□ Month ( 01 for Jan., 02 for Feb., ‥‥‥11 for Nov., 12 f or Dec.) # ~# The number of the internal quality control XXX SEOUL SEMICONDUCTOR CO., LTD. QUANTITY : 700 LOT NUMBER : SFT70426 01 512 PART NUMBER : SFT722N-S SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 11/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)
  1. Precaution for use (1) Storage In order to a void the ab sorption of mo isture, it is re commended to store in a dry box (o r a desiccator) with a de siccant. Otherwise, to st ore them in the followin g enviro nment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is corre spond to SMD, whe n LED be solde red dip, interfaci al separation may af fect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the ca se of more than 1 wee k p assed af ter openin g or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device sh ould not be used in any type of fl uid such as wate r, oil, organi c solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminatin g, operating current should be deci ded after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moi sture packing, fold to close any o pening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 12/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)
  1. Characteristic Diagram Relative Luminous Intensity vs. Forward Current Forward Current vs. Forward Voltage (TA=25ºC) (TA=25ºC) 100 Forward Current IFP [mA] Forward Voltage VF [V] Blue Green Red RED Forward Current Derating Curve Radiation Diagram (TA=25ºC) Ambient Temperature Ta [ºC] Forward Current IF [mA] -90 -60 -30 0 204 06 08 0 100

3 CHIP ON

1 CHIP ON

Red, Green, Blue SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 13/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03) 0 204 0 608 0 100 BLUE GREEN Relative Luminosity (a.u.) Forward Current IFP [mA] 120

  1. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surfac e should be minimized as much as possible. Sh arp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silico ne d iffers from materials conv entionally used for the manufact uring of LEDs. T hese co nditions must be co nsidered during the handling of such devices. Compared to s tandard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 14/14 - SSC-SFT722N-SSSC-QP-7-03-08(REV.03)