SFH4257

SFH4257 AMSCO | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 17

Technical content

1 Version 1.7 | 2021-10-14 Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

TOPLED ® Black High Power Infrared Emitter (850 nm) Electronic Equipment Industrial Automation (Machine Controls, Light Barriers, Vision Controls) Measurement Levelling Features: Package: clear epoxy Qualifications: AEC-Q102 Qualified ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) High Power Infrared LED Black coloured TOPLED-package Improved imaging characteristics due to absorption of side emission Short switching times

Ordering Information

Type Radiant intensity 1)2) Radiant intensity 1) Ordering Code typ. IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms Ie Ie

2 Version 1.7 | 2021-10-14 Maximum Ratings TA = 25 °C Parameter Symbol Values Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Forward current IF max. 100 mA Forward current pulsed tp ≤ 100 µs; D ≤ 0.005 IF pulse max. 1 A Reverse voltage 3) VR max. 5 V Power consumption Ptot max. 180 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV

3 Version 1.7 | 2021-10-14 Characteristics IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Values Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm Half angle φ typ. 60 ° Dimensions of active chip area L x W typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage 4) VF typ. max. 1.5 V 1.7 V Forward voltage 4) IF = 1 A; tp = 100 µs VF typ. max. 2.4 V 2.9 V Reverse current 3) VR = 5 V IR typ. max. 0.01 µA 10 µA Radiant intensity 1) IF = 1 A; tp = 25 µs Ie typ. 75 mW/sr Total radiant flux 5) Φe typ. 25 mW Temperature coefficient of voltage TCV typ. -0.7 mV / K Temperature coefficient of brightness TCI typ. -0.5 % / K Temperature coefficient of wavelength TCλ typ. 0.3 nm / K Thermal resistance junction solder point real 6) RthJS real max. 200 K / W Thermal resistance junction ambient real 7) RthJA max. 450 K / W

4 Version 1.7 | 2021-10-14 Brightness Groups TA = 25 °C Group Radiant intensity 1)2) Radiant intensity 1)2) IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms min. max. Ie Ie Q 7.1 mW/sr 11.2 mW/sr R 11.2 mW/sr 18.0 mW/sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 8), 9) Ie,rel = f (λ); IF = 100 mA; tp = 20 ms 700 nm OHF04132 100 950750 800 850 Irel λ

5 Version 1.7 | 2021-10-14 Radiation Characteristics 8), 9) Ie,rel = f (φ) 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚ Forward current 8), 9) IF = f (VF); single pulse; tp = 100 µs OHL01713 FI 10-4 0.51 1.52 2.5 V3 100 A FV -110 10-2 Relative Radiant Intensity 8), 9) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHL01715 10-3 mA 101 010 10-1 e e (100 mA) I I IF 010 110 210 31055

6 Version 1.7 | 2021-10-14 Max. Permissible Forward Current IF,max = f (TA); Rthja = 450K / W OHR00883 FΙ 100 120 20 40 60 80 100 120 mA TA RthjA = 450 K/W Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 25°C tp T tAIF D = IP T F Pt OHF05709 -510 -3-410 10 -1-210 10 1010 10 s 210 0.5 0.2 0.1 0.01 0.05 0.02 0.005 D 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.1 Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C tp T tAIF D = IP T F Pt OHF05710 -510 -3-410 10 -1-210 10 1010 10 s 210 0.5 0.2 0.1 0.01 0.05 0.02 0.005 D 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1.0

7 Version 1.7 | 2021-10-14 Dimensional Drawing 10) GPLY6059 (typ) 0.7 (0.028) 0.9 (0.035) 1.7 (0.067) 2.1 (0.083) 0.12 (0.005) 0.18 (0.007) 0.5 (0.020) 1.1 (0.043) 3.3 (0.130) 3.7 (0.146) 0.4 (0.016) 0.6 (0.024) 2.6 (0.102) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) Anode marking 3.0 (0.118) 3.4 (0.134) (2.4 (0.094)) 0.1 (0.004) 4˚±1 Further Information: Approximate Weight: 35.0 mg Package marking: Anode

8 Version 1.7 | 2021-10-14 Recommended Solder Pad 10)

9 Version 1.7 | 2021-10-14 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

10 Version 1.7 | 2021-10-14 Taping 10)

11 Version 1.7 | 2021-10-14 Tape and Reel 11) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000 330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 8000

12 Version 1.7 | 2021-10-14 Barcode-Product-Label (BPL) Dry Packing Process and Materials 10) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

13 Version 1.7 | 2021-10-14 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes

14 Version 1.7 | 2021-10-14 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi- nate the customer-specific request between OSRAM OS and buyer and/or customer.

15 Version 1.7 | 2021-10-14 Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Brightness: The brightness values are measured with a tolerance of ±11%. 3) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char- acteristics or damage the LED. 4) Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V. 5) Total radiant flux: Measured with integrating sphere. 6) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 7) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 8) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 9) Testing temperature: TA = 25°C (unless otherwise specified) 10) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 11) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

16 Version 1.7 | 2021-10-14

Revision History

1.6 2020-08-26 Schematic Transportation Box Dimensions of Transportation Box 1.7 2021-10-14 Maximum Ratings Characteristics

17 Version 1.7 | 2021-10-14 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.