SF27G CYSTEKEC | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- High current capability
- High reliability
- Low forward voltage drop
- High surge current capability Mechanical Data
- Case: JEDEC DO-204AC(DO-15) molded plastic
- Terminals: Solder plated, solderable per MIL-STD-750 method 2026
- Polarity: Indicated by cathode band.
- Epoxy : UL94V-0 rate flame retardant
- Weight : 0.014oz., 0.39grams Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Type Parameter Symbol SF 21G SF 22G SF 23G SF 24G SF 25G SF 26G SF 27G SF 28G Units Repetitive peak reverse voltage VRRM 50 100 150 200 300 400 500 600 V Maximum RMS voltage VRMS 35 70 105 140 210 280 350 420 V Maximum DC blocking voltage VR 50 100 150 200 300 400 500 600 V Maximum instantaneous forward voltage, IF=2A (Note 1) VF 0.95 1.3 1.7 V Reverse Recovery Time trr 35 ns Average forward rectified current @TA=95℃ IFAV 2 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 50 A Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=100℃(Note 1) IR 100 μA μA Storage temperature Tstg -55 ~ +150 ℃ Operating temperature TJ -55 ~ +150 ℃ Notes : 1. Pulse test, pulse width=300μsec, 2% duty cycle 2 . Reverse recovery test condition: IF=0.5A, IR=1.0A, IRR=0.25A
CYStech Electronics Corp. Spec. No. : C185LG Issued Date : 2013.03.25 Revised Date : 2013.05.03 Page No. : 2/3 SF21G thru SF28G CYStek Product Specification Characteristic Curves
CYStech Electronics Corp. Spec. No. : C185LG Issued Date : 2013.03.25 Revised Date : 2013.05.03 Page No. : 3/3 SF21G thru SF28G CYStek Product Specification DO-204AC(DO-15) Dimension DO-204AC(DO-15) Molded Plastic Package CYStek Package Code: LG C 0.230 0.300 5.80 7.60 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :
- Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.
- Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
- CYStek reserves the right to make changes to its products without notice.
- CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.