SF2234E-1 MURATA | Alldatasheet

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Technical content

www.RFM.com E-mail: info@rfm.com Page 1 of 4 ©2011 by RF Monolithics, Inc. SF2234E-1 3/10/11

Electrical Characteristics

Characteristic Sym Notes Min Typ Max Units Center Frequency fC 1985 MHz Insertion Loss, 1965 to 2005 MHz IL 1.8 2.5 dB Amplitude Ripple, 1965 to 2005 MHz 1.5 2.0 dB P-P Input/Output Return Loss, 1965 to 2005 MHz 11 14 dB Attenuation, Referenced to 0 dB: dB DC to 1880 MHz 20 25 1885 to 1915 MHz 25 30 2103 to 2160 35 45 3930 to 3990 MHz 25 30 3990 to 6000 MHz 30 35 Source Impedance ZS 50 Ω Load Impedance ZL 50 Ω Case Style SM3030-6 3.0 x 3.0 mm Nominal Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator A13, YWWS Standard Reel Quantity Reel Size 7 inch 500 Pieces/Reel Reel Size 13 inch 3000 Pieces/Reel Connection Terminals Input 2 Output 5 Case Ground All others SM3030-6

  • Low-loss 1985 MHz SAW Filter  No Matching Required for 50 Ω Source/Load Impedances  Complies with Directive 2002/95/EC (RoHS) Absolute Maximum Ratings Rating Value Units Input Power Level +15 dBm DC Voltage on any Non-grounded Terminal 3 V Operating Temperature Range -40 to +85 °C Storage Temperature Range in Tape and Reel -40 to +85 °C Maximum Soldering Profile, 5 cycles/10 seconds maximum 265 °C

1985 MHz

  1. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified d emonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. 2. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. 3. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is depen dent on PCB layout and external impedance matching design. See Application Note No. 42 for details. 4. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototype s." 5. The design, manufacturing process, and specifications of this filter are subject to change. 6. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. 7. US and international patents may apply. 8. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. Pb CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: Preliminary

www.RFM.com E-mail: info@rfm.com Page 2 of 4 ©2011 by RF Monolithics, SF2234E-1 3/10/11 Filter Passband Response Filter Broadband Response

www.RFM.com E-mail: info@rfm.com Page 3 of 4 ©2011 by RF Monolithics, SF2234E-1 3/10/11 SM3030-6 Case TOP VIEW BOTTOM VIEW A BC D J EF GH I /G4B /G4B /G4F /G4D /G4D /G4E /G4E /G4E /G4C 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Case Materials Dimension mm Inches Min Nom Max Min Nom Max K 3.20 0.126 L 1.70 0.067 M 1.05 0.041 N 0.81 0.032 O 0.38 0.015 Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free PCB Footprint Top View A13 YWWS

www.RFM.com E-mail: info@rfm.com Page 4 of 4 ©2011 by RF Monolithics, SF2234E-1 3/10/11 Tape and Reel Specifications “B” Quantity Per ReelInches millimeters 7 178 500 13 330 3000 See Detail "A" 13.0 20.22.0 12.0 100 REF. "B" REF. COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions Ao 3.35 mm Bo 3.35 mm Ko 1.40 mm Pitch 8.0 mm W1 2 . 0 m m RO.3 (MAX.) Ko SECTION A-A 0.3 ± 0.05 SECTION B-B Bo 2.0 4.0 Ao Pitch BB A R0.5 (MAX.) A 5.5 12.0 1.75 1.5 1.50PIN #1 USER DIRECTION OF FEED