SF2135A MURATA | Alldatasheet
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Technical content
www.RFM.com E-mail: info@rfm.com Page 1 of 4 ©2009 by RF Monolithics, Inc. SF2135A - 7/9/09
Electrical Characteristics
Characteristic Sym Notes Min Typ Max Units Center Frequency fC 1
96.0 MHz
1 dB Bandwidth BW1 1.56 1.80 MHz Insertion Loss IL 1, 2,3 11.8 15.0 dB Relative Attenuation 91 to 94.5 MHz 6 9.5 97.5 to 98.5 MHz 6 11.5 dB 10 to 60 MHz 55 72 dB
76.8 MHz 55 72 dB
Passband Amplitude Ripple 95.2 to 96.8 MHz 1, 2, 3 0.9 1.2 dBP-P Group Delay Ripple 95.2 to 96.8 MHz 62 100 nsP-P Operating Temperature 1 -30 +85 °C Terminating Source Impedance 50 ohm Terminating Load Impedance 50 ohm Impedance Matching to 50 Ω Unbalanced External L-C Case Style SMP-53 13.3 x 6.5 mm Nominal Footprint Lid Symbolization (YY = year, WW = week) RFM SF2135A YYWW
- Designed for Wide Channel IF Filtering Low Insertion Loss Hermetic 13.3 x 6.5 mm Surface-mount Case Balanced or Single-ended Input and Output Complies with Directive 2002/95/EC (RoHS) Absolute Maximum Ratings Rating Value Units Maximum Incident Power in Passband +13 dBm Maximum DC Voltage Between any Two Terminals 30 VDC Storage Temperature Range -40 to +85 °C Suitable for Lead-free Soldering - Maximum Soldering Profile 260 °C for 30 s
- Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified d emonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. 2. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. 3. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is depe ndent on PCB layout and external impedance matching design. See Application Note No. 42 for details. 4. Part to part absolute delay measurement records the absolute delay mean across 1 dB passband. 5. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototype s.” 6. The design, manufacturing process, and specifications of this filter are subject to change. 7. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. 8. US and international patents may apply. Pb CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes:
www.RFM.com E-mail: info@rfm.com Page 2 of 4 ©2009 by RF Monolithics, Inc. SF2135A - 7/9/09 CH1 S2 1 DEL 1 00 ns/ RE F 1.5 us CH1 CENTER 9 6 . 000 0 00 MHz SPAN 4 . 000 0 00 MHz Cor Smo PRm CH2 S2 1 LO G 10 dB/ RE F -4 3 d B CH2 CENTER 9 6 . 000 0 00 MHz SPAN 30 . 0 00 00 0 MHz Cor PRm
2 Mar 2007 06:33:48
2:- 7 1 . 8 59 n s 1. 6 0 0 0 0 0 M H z REF= 1 CH1 Markers me an : 1 . 4 73 2 u s s . de v : 13 . 558 ns p-p : 71 . 85 9 ns 1 : -11 . 43 2 dB 9 5 . 568 750 MHz Max SF2135A TST Demo Th ru cal Resp Resp SF2135A 50 ohm Tuning Network SF2135A Group Delay Ripple and Filter Response Plots SF2135A
www.RFM.com E-mail: info@rfm.com Page 3 of 4 ©2009 by RF Monolithics, Inc. SF2135A - 7/9/09 CH1 S11 1 U FS CENTR 96 . 000 MHz SPAN 4 . 000 MHz Cor PRm CH2 S21 LO G 1 d B/ REF -13 dB S TA RT 9 4 . 000 0 00 MHz STOP 9 8 . 000 0 00 MHz Cor PRm CH3 S22 1 U FS CENT R 96 . 000 MHz SPAN 4. 000 MHz Cor
8 Mar 2007 09:46:34
1: 1 0 1 .7 4 28 . 777 4 7 . 709 nH 96 . 0 00 000 MH z 3 4 1 : 0 . 0000 dB 0. 00 0 000 M Hz Ma x RE F=1 CH2 M arkers BW: 1. 77 84 1 7 MH z ce nt : 9 5 . 93 264 9 MH z Q: 53 . 9 43 1_lo ss : -11 . 63 4 dB 1: 4 9.6 6 8 0. 13 67 22 6 . 66 pH 96 . 0 00 0 00 MHz SF2135A TS T Demo Fu ll 2 -p or t cal Full Full SF2135A S11, S22 and Pass-band Plots
www.RFM.com E-mail: info@rfm.com Page 4 of 4 ©2009 by RF Monolithics, Inc. SF2135A - 7/9/09 SAW Filters Package SMP-53 Case 12-Terminal Ceramic Surface-Mount Case 13.3 x 6.5 mm Nominal Footprint Case Dimensions Dimension mm Inches Min Nom Max Min Nom Max C 1.91 2.00 0.075 0.079 D 1.50 0.059 E 0.79 0.031 H 1.0 0.039 P 2.54 0.100 Electrical Connections Connection Terminals Port 1 Input or Return 11 Return or Input 12 Port 2 Output or Return 5 Return or Output 6 Ground All others Single-ended Operation Return is ground Differential Operation Return is hot Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free C H P (8 Places) E (10 Places) DB A 6 5 1112 5 6 TOP VIEW BOTTOM VIEW