SDT470 SOLIDSTATE | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 8
Technical content
Features
Ultra miniature 4 pin SSOP package Low input power consumption High stability CTR Range 80 – 600% High Isolation Voltage (3750V RMS) Long Life / High Reliability RoHS / Pb-Free / REACH Compliant NOTE: Suffixes listed above are not included in marking on device for part number identification 2 3
4 Collector
+ Input - Input SDT470
© 2012 Solid State Optronics • San José, CA Page 2 of 8 SDT470 /TR Rev 2.02 (07/23/2012) 001506 SDT470 DC Input 80V Photo-Transistor Optocoupler Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications LED Forward Voltage V F - 1.2 1.4 V I F = 20mA LED Reverse Voltage BV R 5 - - V I R = 10μA Terminal Capacitance C t - 60 250 pF V=0, f=1KHz Reverse Current I R - - 10 A VR=4V Output Specifications Collector-Emitter Voltage V CEO 80 - - V IC=100A Emitter-Collector Voltage V COE 6 - - V IE=10A Collector Dark Current I CEO - - 100 nA V CE=20V, IF=0mA Floating Capacitance C f - 0.6 1.0 pF V=0, f=1MHz Cut-Off Frequency f C - 80 - kHz VCE=5V, IC=2mA, RL=100-3dB Saturation Voltage V CE(sat) - 0.1 0.3 V I F=20mA, IC=1mA Coupled Specifications Rise Time T R - 2.0 - S IC=2mA, VCC=2V, RL=100 Fall Time T F - 3.0 - S IC=2mA, VCC=2V, RL=100 Current Transfer Ratio CTR 50 - 600 % I F=5mA, VCE=5V (-A Binning) CTR 80 - 160 % I F=5mA, VCE=5V (-B Binning) CTR 130 - 260 % I F=5mA, VCE=5V (-C Binning) CTR 200 - 400 % I F=5mA, VCE=5V (-D Binning) CTR 300 - 600 % I F=5mA, VCE=5V (-E Binning) CTR 50 - 600 % I F=5mA, VCE=5V Isolation Specifications Isolation Voltage V ISO 3750 - - V RMS RH ≤ 50%, t=1min Input-Output Resistance R I-O - 10 - VI-O = 500VDC Test Circuit: Response Time Electrical Characteristics, TA = 25°C (unless otherwise specified) Test Circuit: Frequency Response
© 2012 Solid State Optronics • San José, CA Page 5 of 8 SDT470 /TR Rev 2.02 (07/23/2012) 001506 SDT470 DC Input 80V Photo-Transistor Optocoupler Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SDT470 Solder Reflow Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Su rface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence
© 2012 Solid State Optronics • San José, CA Page 6 of 8 SDT470 /TR Rev 2.02 (07/23/2012) 001506 SDT470 DC Input 80V Photo-Transistor Optocoupler All dimensions in millimeters [mm] with inches in parenthesis () 7.0 ± 0.7 5.3 ± 0.3 0.20 ± 0.05
© 2012 Solid State Optronics • San José, CA Page 7 of 8 SDT470 /TR Rev 2.02 (07/23/2012) 001506 SDT470 DC Input 80V Photo-Transistor Optocoupler Specification Symbol Dimensions, mm ( inches ) Tape Width W 12 0.3 ( 0.47 ) Sprocket Hole Pitch P0 4 0.1 ( 0.15 ) Compartment Location F 2 0.1 ( 0.079 ) Compartment Pitch P1 12 0.1 ( 0.472 ) SDT470 Packaging Specifications Tape & Reel Specifications (T&R) Note: All dimensions in millimeters [mm] L M N O Q R S
© 2012 Solid State Optronics • San José, CA Page 8 of 8 SDT470 /TR Rev 2.02 (07/23/2012) 001506 SDT470 DC Input 80V Photo-Transistor Optocoupler Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. DISCLAIMER SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY