SDT400-R SOLIDSTATE | Alldatasheet
Document overview
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- PDF pages: 10
Technical content
Features
V CEO = 80V Reversed Output (Emitter-Pin4, Collector-Pin3) Low input power consumption CTR Range 50 – 600% (Binning Available) High Isolation Voltage (5000V RMS) Long Life / High Reliability RoHS / Pb-Free / REACH Compliant NOTE: For complete product ordering / naming conventions, reference page 10. Suffixes listed above are not included in marking on device for part number identification
© 2013 Solid State Optronics • San José, CA Page 2 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications LED Forward Voltage V F - 1.2 1.4 V I F = 20mA LED Reverse Voltage BV R 6 - - V I R = 10μA Terminal Capacitance C t - 30 250 pF V=0, f=1KHz Input Reverse Current I R - - 10 A VR=4V Output Specifications Collector-Emitter Voltage V CEO 80 - - V IC=100A Emitter-Collector Voltage V ECO 6 - - V IE=10A Collector Dark Current I CEO - - 100 nA V CE=20V Collector Current I C 2.5 - 30 mA I F=5mA, VCE=5V Floating Capacitance C f - 0.6 1.0 pF V CE=0, f=1MHz Cut-Off Frequency f C - 80 - kHz VCE=5V, IC=2mA, RL=100-3dB Saturation Voltage V CE(sat) - 0.1 0.2 V I F=20mA, IC=1mA Coupled Specifications Rise Time T R - 4 - S IC=2mA, VCC=2V, RL=100 Fall Time T F - 3 - S IC=2mA, VCC=2V, RL=100 Current Transfer Ratio CTR 50 - 600 % I F=10mA, VCE=5V CTR Classification (BINNING) - C 100 - 400 % I F=10mA, VCE=5V - E 50 - 600 % I F=10mA, VCE=5V Isolation Specifications Isolation Voltage V ISO 5000 - - V RMS RH ≤ 50%, t=1min Input-Output Resistance R I-O - 10 - VI-O = 500VDC Electrical Characteristics, TA = 25°C (unless otherwise specified) Test Circuit: Response Time Test Circuit: Frequency Response
© 2013 Solid State Optronics • San José, CA Page 5 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SDT400-R Solder Reflow Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Su rface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence
© 2013 Solid State Optronics • San José, CA Page 6 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler All dimensions in millimeters [mm] with inches in parenthesis ()
© 2013 Solid State Optronics • San José, CA Page 7 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler 4 PIN WIDE Lead Space Package (-H) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
© 2013 Solid State Optronics • San José, CA Page 8 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler 4 PIN SMD Surface Mount Package (-S) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
© 2013 Solid State Optronics • San José, CA Page 9 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler SDT400-R Packaging Specifications Tape & Reel Specifications (T&R) Note: All dimensions in millimeters [mm] with inches in parenthesis () L M N O Q R S D E F P P1 P2 W T
© 2013 Solid State Optronics • San José, CA Page 10 of 10 SDT400-R/H/S/TR Rev 2.01 (07/29/2013) 001612 SDT400-R DC Input 80V Photo-Transistor Optocoupler Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. DISCLAIMER SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY SDT400 – R X Y Z VDE Lead Spacing - Blank Standard DIP - “H” 0.40” Lead Spacing CTR Binning - A 100-400% - B 100-400% - C 100-400% - D 100-400% - E or Blank 50-600% Packaging / Lead Form - Blank Standard DIP - S SMD Form - STR SMD + Tape & Reel