SDM119N SUPERWORLD | Alldatasheet
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- PART NO. EXPRESSION : 2. CONFIGURATION & DIMENSIONS : A 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core : M-Iron Core (c) Adhesive : Epoxy 3. SCHEMATIC : SDM119N SERIESMOLDING TYPE DIP INDUCTORS PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 PCB Pattern BCD 11.5±0.5 (b) Wire : Enamelled Copper Wire Unit:m/m FW LE 5.7±0.5 R30 A B E ØW F CD 12.5 F E 12.5 b) Frequency up to 1MHz a) Shielded construction 5. FEATURES : 8.5±0.5 M 1.8±0.1 N L M N R25/R36/R47 Part No. R50/R56/R68 R30 1R2 2R0 2R5 3R0 (d) S D M 1 1 9 N - R 2 5 M F (a) (b) (c) (c) Inductance code : R25 = 0.25uH (e) (a) Series code (b) Dimension code (d) Tolerance code : M = ±20% (e) F : Lead Free
SUPERWORLD ELECTRONICS (S) PTE LTD 6. GENERAL SPECIFICATION : d) Irms (A) : Will cause an approximately temp. rise < 40°C typ. c) Ambient temp. : 25°C b) Operating temp. : -25°C to +125°C a) Test Frequency : 100KHz/1.0Vdc SDM119N SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 18.04.2008 e) Isat (A) : Will cause L to drop approximately 20% typ.0 f) Part temperature (ambient + temp. rise) : Shoul d not exceed 125°C under worst case operating conditions. MOLDING TYPE DIP INDUCTORS ±20% @ 0Adc Inductance L ( uH ) 0.30 0.36 0.25 7. ELECTRICAL CHARACTERISTICS : SDM119N-R25MF SDM119N-R36MF SDM119N-R30MF Part No. 3820 Min. Q0 Irms Typ. ( A ) 0.542 50 0.6 45 0.8±10% DCRIsat Max. ( A ) ( m ȍ ) Max. 0.50 0.68 0.56SDM119N-R56MF SDM119N-R68MF SDM119N-R50MF 0.8 1.0 20 35 40 0.8 1.1 2.0 1.2SDM119N-1R2MF SDM119N-2R0MF SDM119N-1R1MF 1.05±8% 3.7 15 20 30 1.5 2.5 3.0SDM119N-3R0MF SDM119N-2R5MF 15 20 25 4.0 20 15 28 4.5 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise 0 1 02 03 04 05 0 DC CURRENT(A) 0.1 0.2 0.3 0.4 0.5 INDUCTANCE (uH) 100 TEMP. RISE( oC) DMPI119N- R25SDM119N-R25MF 0 1 02 03 04 05 0 DC CURRENT(A) 0.2 0.4 0.6 INDUCTANCE (uH) 100 TEMP. RISE(oC) DMPI119N-R30SDM119N-R30MF
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 18.04.2008 8. CHARACTERISTICS CURVES : SDM119N SERIES DC Current vs. Inductance & Temperature Rise MOLDING TYPE DIP INDUCTORS 0 1 02 03 04 05 06 0 DC CURRENT(A) 0.1 0.2 0.3 0.4 0.5INDUCTANCE(uH) TEMP. RISE( oC) DMPI119N-R36SDM119N-R36MF 0 9 18 27 36 45 DC CURRENT(A) 0.25 0.5 0.75 INDUCTANCE (uH) 100 TEMP. RISE( oC) DMPI119N-R50SDM119N-R50MF 0 1 02 03 04 0 DC CURRENT(A) 0. 25 0.5 0. 75 INDUCTANCE (uH) 100 TEMP. RISE(oC) DMPI119N-R56SDM119N-R56MF 01 0 2 0 3 0 4 0 DC CURRENT(A) 0. 25 0. 5 0. 75 INDUCTANCE (uH) 10 0 TEMP. RISE( oC) DMPI119N-R68SDM119N-R68MF 0 1 02 03 04 0 DC CURRENT(A) 0.3 0.6 0.9 1.2 1.5 INDUCTANCE (uH) 100 TEMP. RISE(oC) DMPI119N-1R1SDM119N-1R1MF 0 1 02 03 04 05 0 DC CURRENT(A) 0.3 0.6 0.9 1.2 1.5INDUCTANCE(uH) TEMP. RISE( oC) DMPI119N-1R2 SDM119N-1R2MF
Inductance vs. Frequency SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 18.04.2008 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise MOLDING TYPE DIP INDUCTORS SDM119N SERIES 0 6 12 18 24 30 DC CURRENT(A) 0.8 1.6 2.4 3.2 INDUCTANCE (uH) TEMP. RISE(oC) DMPI119N-2R0SDM119N-2R0MF 0 7 14 21 28 DC CURRENT(A) 0.8 1.6 2.4 3.2 INDUCTANCE (uH) 10 0 TEMP. RISE( oC) DMPI119N-2R5SDM119N-2R5MF 0 5 10 15 20 25 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE( oC) DMPI119N-3R0SDM119N-3R0MF DMPI119N ˃ˁˈ ˄ˁˈ ˅ˁˈ ˆ ˆˁˈ FREQUENCY (MHz) INDUCTANCE(uH) ˥˅ˈ ˥ˆ˃ ˥ˆˉ ˥ˈ˃ ˥ˈˉ ˥ˉˋ ˄˥˄ ˄˥˅ ˅˥˃ ˅˥ˈ ˆ˥˃ SDM119N SERIES
SUPERWORLD ELECTRONICS (S) PTE LTD SDM119N SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 5 18.04.2008 PERFORMANCE Refer to standard electrical characteristics list should be covered with solder. More than 90% of the terminal electrode Preheating seconds 1. Appearance : No significant abnormality 2. Inductance change : Within ±3% Preheating seconds No disconnection or short circuit. 2. Inductance : Within ±3% of initial value. 1. Appearance : No damage No disconnection or short circuit. 2. Inductance : Within ±5% of initial value. 1. Appearance : No damage Reliability Test Humidity Resistance High Temperature Life Test Life Test Low Temperature Thermal Shock Solder Heat Resistance 150°C 260°C 150°C 245°C Inductance Electrical Characteristics Test DCR Heat Rated Current (Irms) Solderability Test Mechanical Performance Test Saturation Current (Isat) 9. RELIABILITY AND TEST CONDITION : ITEM Time : 500±12 hours Applied Current : Rated Curent Humidity : 90% to 95% Temperature : 40±5°C Temperature : 85±5°C Time : 500±12 hours Temperature (°C) Conditions of 1 cycle. Temperature : -40±5°C Time : 500±12 hours Room Temperature Room Temperature 85±3 -25±3 Recovery: 4 to 24hrs of recovery under the standard Total : 5 cycles Step Within 3 Within 3 30±3 Times (min.) 30±3 Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux : rosin Dip Time : 10±0.5sec. 10±0.5 seconds Dipping cooling Natural 4±1 seconds Dipping cooling Natural HP-4192A, HP4284A, CH1320 TEST CONDITION Isat(A) will cause Lo to drop approximately 25% Agilent 33420A Irms(A) will cause an temp rise < 40°C typ. solder bath at 245±5°C for 5 seconds After fluxing, component shall be dipped in a melted condition after the removal from test chamber condition after the removal from test chamber Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Recovery: 4 to 24hrs of recovery under the standard MOLDING TYPE DIP INDUCTORS
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 18.04.2008 SDM119N SERIES 11. PACKING AND QUANTITY : Inner Box Carton 1000 2000 Styrofoam Size 100 SDM119N a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. Application Notice 2. Transportation : c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) Recommended products should be used within 6 months from the time of delivery. a) Temperature and humidity conditions : Less than 30°C and 70% RH. To maintain the solderabililty of terminal electrodes : 1. Storage Conditions : MOLDING TYPE DIP INDUCTORS