SDI453226 SUPERWORLD | Alldatasheet

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(a) (c)(b) (e) (d) 1. PART NO. EXPRESSION : (b) Dimension code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : A 4. GENERAL SPECIFICATION : SUPERWORLD ELECTRONICS (S) PTE LTD 3. SCHEMATIC : (d) Tolerance code : J = ±5%, K = ±10%, M = ±20% (e) F : Lead Free SDI453226 SERIESWIREWOUND CHIP INDUCTORS PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 PCB Pattern BCE H S D I 4 5 3 2 2 6 - 1 R 0 M F Unit:m/m I 4.5±0.3 c) Rated current : Base on temp. rise & ǻL/L0A=10% Max. b) Operating temp. : -25°C to 85°C a) Ambient temp. : 20°C A C B E F E I J I H 1.0 Min. F 1.2 Ref. J

SUPERWORLD ELECTRONICS (S) PTE LTD SDI453226 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 31.07.2008 5. ELECTRICAL CHARACTERISTICS : WIREWOUND CHIP INDUCTORS SDI453226-820F SDI453226-680F SDI453226-330F SDI453226-390F SDI453226-560F SDI453226-470F SDI453226-270F SDI453226-150F SDI453226-220F SDI453226-180F SDI453226-100F SDI453226-8R2F SDI453226-120F SDI453226-6R8F SDI453226-5R6F SDI453226-3R9F SDI453226-4R7F SDI453226-3R3F SDI453226-1R5F SDI453226-2R7F SDI453226-1R8F SDI453226-2R2F SDI453226-1R2F SDI453226-1R0F 68 1M 1M 35 35 1M 35 1M 35 1M 7.5 8.4 2.20 1.90 170 180 9.3 1.40 1.20 1.70 1.50 1.10 0.73 0.82 0.94 240 270 200 220 300 360 340 320 8.2 6.8 1M 5.6 4.7 3.9 3.3 1M 1M1.5 2.7 2.2 1.8 1M 1.2 1.0 1M 1M20 20 1M 20 1M 0.56 0.56 0.62 0.50 0.47 0.40 0.38 0.35 450 400 380 450 500 500 500 500 85 0.30 0.32 0.30 0.30 100 120 0.20 0.20 500 500 500 500 500 500 SDI453226-122F SDI453226-222F SDI453226-182F SDI453226-152F SDI453226-561F SDI453226-102F SDI453226-821F SDI453226-681F SDI453226-331F SDI453226-391F SDI453226-471F 0.252M401K1200 2200 1800 1500 0.252M 0.252M 0.252M 1K560 1000 820 680 470 330 390 0.796M40 0.796M 0.796M 0.252M 0.796M 0.796M 0.796M 4530.01.8 1.3 1.5 1.6 37.0 50.0 45.0 14.52.7 2.0 2.2 2.5 25.0 20.5 17.0 3.0 3.6 3.3 8.20 9.70 11.8 SDI453226-181F SDI453226-221F SDI453226-271F SDI453226-151F SDI453226-101F SDI453226-121F 220 180 270 150 1M 120 100 1M 0.796M 0.796M 0.796M 0.796M 0.796M 0.796M 5.0 4.5 4.0 5.5 5.40 6.80 4.50 3.70 6.2 6.8 3.00 2.50 110 120 100 130 150 160 Frequency ( Hz ) TestInductancePart No. ( uH ) ( MHz )FrequencyMin. Q ( Hz ) Min. Test SRF ( ȍ ) Max. DCR ( mA ) Max. IDC Tolerance M M M M M M M M M, K M, K M, K M, K K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J Inductance tolerance : : J : ±5% K : ±10% M : ±20%

WIREWOUND CHIP INDUCTORS SDI453226 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 31.07.2008 6. RELIABILITY AND TEST CONDITION : Temp & Humidity More than 95% of termincal electrode should 28g<weight<136g : 30 Min. T : weight< 28g : 15 Min. be covered with solder. IPC J-STD-002B Solderability Test Physical Characteristics Tests MIL-STD-202G Method 208H Reference documents: MIL-STD-202G Method 107G Reference documents: Thermal shock test -40°C Solder temperature : 245±5°C Solder : Sn(63)/Pb(37) Flux : rosin flux Dip time : 5 secs. 93%RH 40°C 125°C Step 1 : -40°C for T time Step 2 : 125°C for T time Conditions of 1 cycle : Total : 20 cycles T T Temp Room Time Change time < 5 minTemp Time0 96H Test High temperature High humidity 2. ǻL/L<30% (Closed Magnetic Circuit) 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% ǻL/L<10% 1. No case deformation or change in appearance. Low Temperature Storage Test Humidity Test Reference documents: MIL-STD-202G Method 103B Reference documents: IEC 68-2-1A 6.1 6.2 Reference documents: MIL-STD-202G Method 108A ITEM High Temperature Storage Test Environmental Tests Temperature : -25±2°C Tested while the specimens are still in the chamber Tested after 1 hour (less than 2 hours) at room temperature -25°C Temp Temp Measured after 24 hours Time : 96±2 hours Tested after 1 hour (less than 2 hours) at room temperature Exposure : Temperature : 40±2°C, Humidity : 93±3% RH, Dry oven at temperature of 40±5°C for 24 hours Room Time : 96±2 hours TimeLow temperature

0 Test

85°C Temperature : 85±2°C Temp Room Tested after 1 hour (less than 2 hours) at room temperature PERFORMANCE Time : 96±2 hours Time0 Test96H High temperature 1. No case deformation or change in appearance. 4. ǻDCR/DCR<10% 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 1. No case deformation or change in appearance. 4. ǻDCR/DCR<10% 3. ǻQ/Q < 30% 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% Conditions Room 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) 4. ǻDCR/DCR<10% ǻL/L<10% 3. ǻQ/Q < 30%

WIREWOUND CHIP INDUCTORS SDI453226 SERIES SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 31.07.2008 6. RELIABILITY AND TEST CONDITION : Sample TEST CONDITION A period of 2 hours in each of 3 mutually perpendicular Directions & times : X, Y, Z directions for 2 hours. 1Min 1.0 (1 angle, 1 ridge and 2 surface orientations) Drop from a height of 1m with 981m/s² (100G) altitude Bend PCB at middle point, the deflection shall be 2mm. X>5N 30A<8mm²JIS C 5321:1997 >10N >20N applied on the right conditions. dielectric must not be damaged by the forces Bending Test : The terminal electrode & the Reflow Curve 20mm²<A 8mm²<A<20mm² Bending Test :10 10 R0.5 Freq Force A : Sectional area of terminal MIL-STD-202G Method 203C Terminal Strength Push Test Reference documents: Reference documents: Pulling Test : Drop Test Pulling Test : Time (sec) 55Hz 10Hz PERFORMANCE MIL-STD-202G Method 201A Reference documents: Vibration Test Heat Endurance of Reflow Soldering IPC J-STD-020B Reference documents: ITEM directions (Total 6 hours). Amplitude : 0.75mm Frequency : 10~55Hz Peak temp. : 245±5°C No. of cycle : 3 Refer to reflow curve. Y Time 1. No case deformation or change in appearance. 4. ǻDCR/DCR<10% 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 1. No case deformation or change in appearance. 4. ǻDCR/DCR<10% 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 270 250 200 150 100 300 Preheat PeakRamp-up Ramp-down 2. ǻL/L<30% (Closed Magnetic Circuit) 4. ǻDCR/DCR<10% 1. No case deformation or change in appearance. 3. ǻQ/Q < 30% ǻL/L<10%

120° 23±1 13±1 SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 PG. 6 Cover tape 250mm Min. Tape leader 388mm Min. Tape trailer 160mm Min. 8-2. Quantity & G.W. per package SDI453226 SERIES OUTER : CARTON G.W. (Kg)G.W. (Kg) 0.14500 Q'TY (PCS) 24000 Q'TY (PCS) INNER : REEL SIZE (cm) 39 x 39 x 2311 Components 4R7 4R7 Direction of feed 4R7 4R7 4R7 4R7 1.75±0.1 SDI453226 SERIESWIREWOUND CHIP INDUCTORS 8-1. Reel & Tape Dimension 8. PACKAGING INFORMATION : ( Unit : mm ) 178 2.5±0.5

31.07.2008 PG. 7 NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD SDI453226 SERIESWIREWOUND CHIP INDUCTORS 165° to 180° F Top cover tape 8-3. Tearing Off Force The force for tearing off cover tape is 10 to 60 grams in the arrow direction. Base tape 2. Transportation : b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid dam age or contamination from perspiration and skin oils. a) Temperature and humidity conditions : Less than 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. To maintain the solderabililty of terminal electrodes : 1. Storage Conditions : Application Notice