SDI321618

SDI321618 SUPERWORLD | Alldatasheet

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(a) (c)(b) (e) (d) 1. PART NO. EXPRESSION : (b) Dimension code (c) Inductance code : R12 = 0.12uH (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. GENERAL SPECIFICATION : SUPERWORLD ELECTRONICS (S) PTE LTD 3. SCHEMATIC : (d) Tolerance code : J = ±5%, K = ±10%, M = ±20% (e) F : Lead Free SDI321618 SERIESWIREWOUND CHIP INDUCTORS PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 S D I 3 2 1 6 1 8 - R 1 2 M F c) Rated current : Base on temp. rise & ǻL/L0A=10% Max. b) Operating temp. : -25°C to 85°C a) Ambient temp. : 20°C C 1.6±0.23.2±0.3 BA A H ECH F 1.0 Ref.1.5 Ref. Unit:m/m JI FB E PCB Pattern I E IJ

SUPERWORLD ELECTRONICS (S) PTE LTD SDI321618 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 31.07.2008 5. ELECTRICAL CHARACTERISTICS : WIREWOUND CHIP INDUCTORS SDI321618-2R2F SDI321618-4R7F SDI321618-1R0F SDI321618-R47F SDI321618-R22F SDI321618-R12F 50 0.533 4301M2.2 1M4.7 31 340 0.845 1M1.0 0.47 0.22 0.12 100 0.364 510 180 250 250 0.210 0.140 700 850 0.112 970 Part No. Test Frequency ( Hz ) Inductance ( uH ) ( MHz ) Min. SRF ( ȍ ) Max. DCR ( mA ) Max. IDC SDI321618-101F SDI321618-470F 100 7.0 15.60 80 10.40 100 SDI321618-220F SDI321618-100F 3.900 160 1.690 230 M Tolerance M M M M K, M J, K J, K J, K J, K Tolerance code : : J = ±5% K = ±10% M = ±20%

TempMIL-STD-202G Method 108A TimeT More than 95% of termincal electrode should SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. MIL-STD-202G Method 208H Physical Characteristics Tests Reference documents: IPC J-STD-002B Solderability Test be covered with solder. PG. 3 31.07.2008 Solder : Sn(63)/Pb(37) Flux : rosin flux Dip time : 5 secs. Solder temperature : 245±5°C -40°C 1. No case deformation or change in appearance. 1. No case deformation or change in appearance. 1. No case deformation or change in appearance. Reference documents: MIL-STD-202G Method 107G Thermal shock test Reference documents: 4. ǻDCR/DCR<10% T : weight< 28g : 15 Min. 28g<weight<136g : 30 Min. 2. ǻL/L<30% (Closed Magnetic Circuit) 3. ǻQ/Q < 30% ǻL/L<10% MIL-STD-202G Method 103B 4. ǻDCR/DCR<10% 3. ǻQ/Q < 30% 3. ǻQ/Q < 30% Humidity Test IEC 68-2-1A 6.1 6.2 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 4. ǻDCR/DCR<10% Low Temperature Storage Test Reference documents: 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 4. ǻDCR/DCR<10% Change time < 5 min Room Temp Temp 125°C Conditions of 1 cycle : Step 2 : 125°C for T time Step 1 : -40°C for T time Total : 20 cycles T Tested after 1 hour (less than 2 hours) at room temperature Tested while the specimens are still in the chamber 96H High temperature93%RH High humidity Time : 96±2 hours Temp & Humidity40°C Conditions Test Time Room Dry oven at temperature of 40±5°C for 24 hours Exposure : Temperature : 40±2°C, Humidity : 93±3% RH, Temp Measured after 24 hours Low temperature -25°C Room Temp 96H Test Time 96H Tested after 1 hour (less than 2 hours) at room temperature Temperature : -25±2°C Time : 96±2 hours Room Temp High temperature 85°C Test Time 1. No case deformation or change in appearance.High Temperature Storage Test 6. RELIABILITY AND TEST CONDITION : Reference documents: Environmental Tests ITEM 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% PERFORMANCE Tested after 1 hour (less than 2 hours) at room temperature TEST CONDITION Temperature : 85±2°C Time : 96±2 hours WIREWOUND CHIP INDUCTORS SDI321618 SERIES

Refer to reflow curve. Peak temp. : 245±5°C Frequency : 10~55Hz Amplitude : 0.75mm directions (Total 6 hours). Bend PCB at middle point, the deflection shall be 2mm. Drop from a height of 1m with 981m/s² (100G) altitude (1 angle, 1 ridge and 2 surface orientations) Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. Pulling Test :Terminal Strength Push Test Reference documents: Reflow Curve JIS C 5321:1997 applied on the right conditions. A : Sectional area of terminal 8mm²<A<20mm² Bending Test : The terminal electrode & the dielectric must not be damaged by the forces 20mm²<A A<8mm² 10>10N >20N 10 Bending Test : R0.5 Time (sec)Force >5N 30 X Pulling Test : Vibration Test Reference documents: MIL-STD-202G Method 201A Drop Test Reference documents: MIL-STD-202G Method 203C 1. No case deformation or change in appearance. 4. ǻDCR/DCR<10% 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 2. ǻL/L<30% (Closed Magnetic Circuit) 4. ǻDCR/DCR<10% 1. No case deformation or change in appearance. 3. ǻQ/Q < 30% ǻL/L<10% Reference documents: IPC J-STD-020B Reflow Soldering Heat Endurance of 6. RELIABILITY AND TEST CONDITION : 2. ǻL/L<30% (Closed Magnetic Circuit) 4. ǻDCR/DCR<10% 1. No case deformation or change in appearance. PERFORMANCE 3. ǻQ/Q < 30% ǻL/L<10% ITEM No. of cycle : 3 PG. 4 31.07.2008 Sample 1.0 Y 10Hz 1Min Time 55Hz Freq TEST CONDITION WIREWOUND CHIP INDUCTORS SDI321618 SERIES 270 250 200 150 100 300 Preheat PeakRamp-up Ramp-down

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 31.07.2008 178 Direction of feed Q'TY (PCS) 120000SDI321618 0.132000 Q'TY (PCS) 8-2. Quantity & G.W. per package SERIES G.W. (Kg) INNER : REEL 39 x 39 x 2312 G.W. (Kg) OUTER : CARTON SIZE (cm) 2.5±0.5 13±1 Tape leader 388mm Min. 1.75±0.1 Tape trailer 160mm Min. Components 23±1 1.50 +0.10 -0.00 4±0.1 120° Cover tape 250mm Min. 8. PACKAGING INFORMATION : ( Unit : mm ) 8-1. Reel & Tape Dimension 4R7 4R7 4R7 4R7 4R7 4R7 WIREWOUND CHIP INDUCTORS SDI321618 SERIES

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 31.07.2008 SDI321618 SERIESWIREWOUND CHIP INDUCTORS in the arrow direction. The force for tearing off cover tape is 10 to 60 grams Base tape Top cover tape 165° to 180° F 8-3. Tearing Off Force a) Products should be handled with care to avoid dam age or contamination from perspiration and skin oils. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) Recommended products should be used within 6 months from the time of delivery. a) Temperature and humidity conditions : Less than 40°C and 70% RH. Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : 2. Transportation :