SBILF140E

SBILF140E SEOUL | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 23

Technical content

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED SPECIFICATION [SBILF140E] Seoul semiconductor Customer Drawn by Checked by Approved by Approved by Item: LED Array for LCD BLU Customer P/N Model Name

SBILF140E–Top view LED Product Data Sheet Product Brief

Description

Rev0.0, Aug.9, 2017 www.seoulsemicon.com2 Edge type Application Top view LED SBILF140E

• 1-chip in one package
• SMT solderability
• Own patent reserved
• RoHS Compliant
• Low Thermal Resistance
• Pb-free Reflow Soldering application
• SBILF140E is very useful Top View LED in back light unit application
• 7.0mm x 2.0mm x 0.7mm
• White colored SMT package
• Flat Backlighting (LCD, Display)
• MNT, TV etc.
• Coupling into Light Guide Panel
• AV systems RoHS

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Table of Contents Index

• Product Brief
• Table of Contents
• Performance Characteristics
• Characteristic Diagram
• Reliability Test
• Color Bin Structure
• Mechanical Dimension
• Material Structure
• Packaging Information
• Reflow Soldering Characteristics
• Handling of Silicone Resin for LEDs
• Precaution For Use
• Company Information

Table 2. Electro Optical Characteristics (Ta = 25ºC) ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. *4 Peak wavelength Measurement allowance is ±1nm. The lifetime is estimated by the measured datum at 3khr. Table 1. Absolute Maximum Ratings (Ta = 25ºC)

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Characteristic Diagram Product Data Sheet Fig 1. Color Spectrum, Ta = 25℃, IF = 120mA, RH30% 400 500 600 700 800 Ta = 25 O C IF = 120 mA Normalized Intensity [a.u.] Wavelength [nm] Fig 2. Radiant pattern, Ta = 25℃ -100 -80 -60 -40 -20 0 20 40 60 80 1000.0 0.5

1.0 Ta = 25

O C x axis y axis Relative Intensity [a.u.] Radiation angle [deg.]

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Characteristic Diagram Product Data Sheet Fig 3. Forward Voltage vs. Forward Current , Ta = 25℃ Fig 4. Forward Current vs. Relative Luminous Flux, Ta = 25℃ 120 160 200

240 Ta = 25

O C Forward Current [mA] Forward Voltage [V] 40 80 120 160 200 24020 100 120 140 160 180 Ta = 25 O C Relative Luminous Intensity [%] Forward Current [mA]

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Characteristic Diagram Product Data Sheet Fig 5. Forward Current vs. CIE X, Y Shift, Ta = 25℃ Fig 6. Color Coordinate vs. Ambient Temperature, IF =120mA 0.263 0.264 0.265 60 mA 250 mA 120 mA 180 mA 140 mA Ta = 25 O C Color coordinate y Color coordinate x 40 mA 0.260 0.262 0.264 0.266 0.268 O C O C O C O C -30 O C IF = 120 mA Color coordinate y Color coordinate x

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Characteristic Diagram Product Data Sheet Fig 7. Forward Voltage vs. Ambient Temperature, IF =120mA Fig 8. Relative Luminosity vs. Ambient Temperature, IF =120mA -40 -20 0 20 40 60 80 1000.85 0.90 0.95 1.00 1.05 1.10 1.15 IF = 120 mA IV / IV @25 O C [a.u.] Ambient Temprature [ o -40 -20 0 20 40 60 80 1000.92 0.94 0.96 0.98 1.00 1.02 1.04 1.06 IF = 120 mA VF / VF @25 O C [a.u.] Ambient Temprature [ o

Table 3. TEST ITEMS AND RESULTS Table 4. Criteria for Judging the Damage

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Color Bin Structure CIE Chromaticity Diagram * Measurement Uncertainty of the Color Coordinates is ±0.007 0.22 0.23 0.24 0.25 0.26 0.27 0.28 D2P A2P A1P CIE Coord. y CIE Coord. x D1P C2P C1P B2P B1P RANK x1 y1 x2 y2 x3 y3 x4 y4 A1P 0.2709 0.2396 0.2734 0.2441 0.2798 0.2369 0.2774 0.2324 A2P 0.2734 0.2441 0.2759 0.2486 0.2823 0.2414 0.2798 0.2369 B1P 0.2759 0.2486 0.2783 0.2531 0.2848 0.2460 0.2823 0.2414 B2P 0.2783 0.2531 0.2808 0.2576 0.2872 0.2504 0.2848 0.2459 C1P 0.2808 0.2576 0.2832 0.2621 0.2897 0.2549 0.2872 0.2504 C2P 0.2832 0.2621 0.2857 0.2666 0.2922 0.2594 0.2897 0.2549 D1P 0.2857 0.2666 0.2882 0.2711 0.2946 0.2639 0.2922 0.2594 D2P 0.2882 0.2711 0.2906 0.2756 0.2971 0.2684 0.2946 0.2639

Table 5. Bin Code description

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Mechanical Dimensions ( Tolerance: ±0.1, Unit: mm ) PKG Outline dimension

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Mechanical Dimensions LED PKG Silicone Depth Spec. (1) Silicone Depth (T) : 20um > T > 150um at 25℃ (2) Wire is not exposure over the encapsulation. Silicone Depth (T) = A ~ B A : The top of mold B : Encapsulation face (the center of PKG) Molding depth

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Material Structure No. LIST MATERIAL ① FRAME COPPER FRAME (SILVER PLATED) ② LED CHIP GaN ON SAPPHIRE ③ WIRE GOLD WIRE ④ ENCAPSULATION SILICONE ⑤ PHOSPHOR NITRIDE GREEN NITRIDE RED ⑥ PACKAGE HEAT-RESISTANT POLYMER ⑦ ZENER DIODE Si ②③ ④ ⑤ ⑥⑦

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Emitter Tape & Reel Packaging Reel Outer Box (1) Quantity : 3500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package ( Tolerance: ±0.2, Unit: mm )

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Emitter Tape & Reel Packaging Reel Outer Box

Table 6. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Reflow Soldering Characteristics (3) Hand Soldering conditions Not more than 3 seconds @MAX 350C, under Soldering iron. In case that the soldered products are reused in soldering process, we don’t guarantee the products. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead-frame Solder (1) Lead Solder (2) Lead-Free Solder Lead Free Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max.

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts.

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Precaution for Use Product Data Sheet (1) Storage conditions Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption. a. Keep it at a temperature in the range from 5C to 30C and at a humidity of less than 50% RH. The product should be kept within a year. (2) After opening the package . When soldering, this could result in a decrease of the photoelectric effect or light intensity. a. Soldering should be done right after mounting the product. b. Keep the temperature in the range from 5C to 30C and the humidity at less than 60%. Soldering should be done within 7 days after opening the desiccant package. If the product has been exposed for more than 7 days after opening the package or the indicating color of the desiccator changes, the product must be baked at a temperature between 65 ±5C for less than 24 hours. An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere. Stored at a humidity of less than 10% RH. (3) Precautions for use Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling. The product should not be mounted on a distorted part of PCB. Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and surge damage, and all devices and equipments must be grounded to the earth. (4) Miscellaneous Radiation resistance is not considered. When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used and IPA(Isopropyl Alcohol) must be used. When using the product, operating current should be settled in consideration of the maximum ambient temperature. Its appearance or specification for improvement is subject to change without notice.

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Precaution for Use (5) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device

Rev0.0, Aug.9, 2017 www.seoulsemicon.com Product Data Sheet SBILF140E –Top view LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice.