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Features
Matching® Applied GaAs HBT InGaP HBT GaAs MESFET SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade- Product Description
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. RF MEMS SBB5000 0.05GHz to 6GHz, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER RFMD’s SBB5000 is a high performance InGaP HBT MMIC amplifier utilizing a Dar- lington configuration with an active bias network. The active bias network provides stable current over temperature and process Beta variations. Its efficient operation from a single 5V supply and its compact size (0.59mmx0.70mm) make it ideal for high-density multi-chip module applications. It is well-suited for high linearity 5V gain block applications and it is internally matched to 50. RFMD can provide 100% DC screening, visual inspection, and Hi-Rel water qualifi- cation. Die can be delivered at the wafer level or picked to gel or waffle paks. Gain and Return Loss versus Frequency VS=5V, IS=75mA -40.0 -30.0 -20.0 -10.0 0.0 10.0 20.0 30.0 Frequency (GHz) Gain and Return Loss (dB) IRL Gain ORL GSG Probe Data with Bias Tees ZS=ZL=50 Ohms, T=25°C OIP3=35dBm at 2000MHz P1dB=20.5dBm at 2000MHz Single Fixed 5V Supply Compact Die Size (0.59mmx0.70mm) Patented Thermal Design & Bias Circuit Low Thermal Resistance
Applications
PA Driver Amplifier RF Pre-driver and RF Receive Path Military Communications Test and Instrumentation DS111219 Package: Bare Die SBB5000 0.05GHz to 6GHz, Cascad- able Active Bias InGaP HBT MMIC Amplifier Parameter Specification Unit ConditionMin. Typ. Max. Frequency of Operation 50 6000 MHz Small Signal Gain 20.5 dB Frequency=500MHz 20.5 dB Frequency=2000Mhz 20.0 dB Frequency=4000MHz Output Power at 1dB Compression 21.0 dBm Frequency=500MHz 20.5 dBm Frequency=2000MHz 17.0 dBm Frequency=4000MHz Output IP3 37.0 dBm Frequency=500MHz 35.0 dBm Frequency=2000MHz 30.0 dBm Frequency=4000MHz Input Return Loss 15.0 dB Frequency=2000MHz Output Return Loss 12.0 dB Frequency=2000MHz Current 75.0 mA Noise Figure 3.9 dB Frequency=2000MHz Thermal Resistance 69.9 °C/W Junction to lead (89 pkg) Test Conditions: Z 0=50 , VD=5V , ID=75mA, T=25°C, OIP3 Tone Spacing=1MHz, P OUT/tone=0dBm. GSG Probe Data with Bias Tees.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SBB5000 Typical Performance (GSG Probe Data with Bias Tees) VD=5V , ID=75mA, T=25 °C, Z=50 Absolute Maximum Ratings Parameter Rating Unit Total Current (ID)1 0 0 m A Device Voltage (VD)5 . 5 V Power Dissipation 0.55 W Operating Lead Temperature (TL) -40 to +85 °C RF Input Power +24 dBm Storage Temperature Range -55 to +150 °C Operating Junction Temperature (TJ)+ 1 5 0 ° C ESD Rating - Human Body Model (HBM) Class 1C Operation of this device beyond any one of these limits may cause permanent dam- age. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the table on page one. Bias Conditions should also satisfy the following expression: I DVD<(TJ-TL)/R TH, j-l Parameter Units 500MHz 1000MHz 1500MHz 2000MHz 3000MHz 4000MHz Output 3rd Order Intercept Point (see note 1) Note 1: 0dBm/tone, 1MHz spacing Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SBB5000 Typical Performance (GSG Probe Data with Bias Tees) VD=5.0V , ID=75mA P1dB versus Frequency 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 Frequency (GHz) P1dB (dBm) -20°C 25°C 85°C OIP3 versus Frequency (0dBm/Tone, 1MHz Spacing) 20.0 25.0 30.0 35.0 40.0 45.0 Frequency (GHz) OIP3 (dBm) -20°C 25°C 85°C Current versus Voltage 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 VD (V) ID (mA) -20°C 25°C 85°C Noise Figure versus Frequency 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Frequency (GHz) Noise Figure (dB) 25°C 85°C
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SBB5000 Typical Performance (GSG Probe Data with Bias Tees) VD=5.0V , ID=75mA S11 versus Frequency -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 Frequency (GHz) S11 (dB) -20°C 25°C 85°C S21 versus Frequency 14.0 16.0 18.0 20.0 22.0 24.0 Frequency (GHz) S21 (dB) -20°C 25°C 85°C S12 versus Frequency -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 Frequency (GHz) S12 (dB) -20°C 25°C 85°C S22 versus Frequency -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 Frequency (GHz) S22 (dB) -20°C 25°C 85°C
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SBB5000 Notes: 1. All dimensions in inches [millimeters]. 2. Die thickness is 0.004 [0.100]. 3. Typical bond pad is 0.003x0.006 4. Backside metallization: Gold. 5. Bond pad metallization: Gold. 6. Backside is ground. Die Dimensions Pin Function Description RF IN This pad is DC coupled and matched to 50 . An external DC block is required. RF OUT This pad is DC coupled and matched to 50 . DC bias is applied through this pad. DIE BACKSIDE Die backside must be connected to RF/DC ground using silver filled conductive epoxy.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SBB5000 Device Assembly
Ordering Information
Part Number Description Devices/Container Quantity SBB5000 Bare Die Gel Pack 10pc SBB5000S2 Bare Die Gel Pack 2pc